JPH0243018U - - Google Patents
Info
- Publication number
- JPH0243018U JPH0243018U JP12201888U JP12201888U JPH0243018U JP H0243018 U JPH0243018 U JP H0243018U JP 12201888 U JP12201888 U JP 12201888U JP 12201888 U JP12201888 U JP 12201888U JP H0243018 U JPH0243018 U JP H0243018U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- external electrode
- exterior body
- dimensions
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010408 film Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 239000010409 thin film Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
第１図は本考案の一実施例を示す断面図、第２
図は同上の斜視図、第３図は従来例の断面図、第
４図は同上の等価回路図、第５図は同上の実装時
の斜視図である。
１……圧電共振子（素子）、２……外装体、３
……外部電極、４……アース電極（第三の電極）
。
Fig. 1 is a sectional view showing one embodiment of the present invention;
3 is a sectional view of the conventional example, FIG. 4 is an equivalent circuit diagram of the same, and FIG. 5 is a perspective view of the same when mounted. 1...Piezoelectric resonator (element), 2...Exterior body, 3
...External electrode, 4...Earth electrode (third electrode)
.
Claims (1)
電極を取着すると共に薄膜によつて第三の電極を
形成し、前記外部電極と第三の電極との表面段差
を半田膜厚以下の寸法にしたことを特徴とするチ
ツプ型電子部品。 A metal external electrode is attached to the outer circumferential surface of the exterior body containing the element, and a third electrode is formed using a thin film, and the surface level difference between the external electrode and the third electrode is reduced to less than the solder film thickness. A chip-type electronic component characterized by its dimensions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12201888U JPH0243018U (en) | 1988-09-18 | 1988-09-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12201888U JPH0243018U (en) | 1988-09-18 | 1988-09-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0243018U true JPH0243018U (en) | 1990-03-26 |
Family
ID=31369558
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12201888U Pending JPH0243018U (en) | 1988-09-18 | 1988-09-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0243018U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06224680A (en) * | 1993-01-27 | 1994-08-12 | Murata Mfg Co Ltd | Chip type electronic parts |
-
1988
- 1988-09-18 JP JP12201888U patent/JPH0243018U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06224680A (en) * | 1993-01-27 | 1994-08-12 | Murata Mfg Co Ltd | Chip type electronic parts |
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