JPH0243017U - - Google Patents
Info
- Publication number
- JPH0243017U JPH0243017U JP12147188U JP12147188U JPH0243017U JP H0243017 U JPH0243017 U JP H0243017U JP 12147188 U JP12147188 U JP 12147188U JP 12147188 U JP12147188 U JP 12147188U JP H0243017 U JPH0243017 U JP H0243017U
- Authority
- JP
- Japan
- Prior art keywords
- electrode layer
- electrode
- terminal
- soldered
- laminating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 229910000792 Monel Inorganic materials 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
Description
第１図は本考案の一実施例を示す部分断面図、
第２図は同上の素子の全体斜視図、第３図は同上
のデイツプ成形後の断面図である。
１……素子、２……下地電極層、３……表面電
極層、４……電極、５……端子、６……高温半田
、９……外装樹脂。
FIG. 1 is a partial sectional view showing an embodiment of the present invention;
FIG. 2 is an overall perspective view of the same element as above, and FIG. 3 is a sectional view of the same after forming a dip. DESCRIPTION OF SYMBOLS 1...Element, 2...Base electrode layer, 3...Surface electrode layer, 4...Electrode, 5...Terminal, 6...High temperature solder, 9...Exterior resin.
Claims (1)
いて、モネルメタルの下地電極層の上に銀の表面
電極層を積層して電極を形成し、高温半田を用い
て前記電極に端子を半田付けしたことを特徴とす
る電子部品。 In an electronic component in which an element is packaged with an exterior resin, an electrode is formed by laminating a silver surface electrode layer on a monel metal base electrode layer, and a terminal is soldered to the electrode using high-temperature solder. Featured electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12147188U JPH0243017U (en) | 1988-09-16 | 1988-09-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12147188U JPH0243017U (en) | 1988-09-16 | 1988-09-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0243017U true JPH0243017U (en) | 1990-03-26 |
Family
ID=31368507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12147188U Pending JPH0243017U (en) | 1988-09-16 | 1988-09-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0243017U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04255102A (en) * | 1991-02-06 | 1992-09-10 | Murata Mfg Co Ltd | Manufacture of electronic component |
| JPH04255103A (en) * | 1991-02-06 | 1992-09-10 | Murata Mfg Co Ltd | Manufacture of electronic component |
| JPH06224680A (en) * | 1993-01-27 | 1994-08-12 | Murata Mfg Co Ltd | Chip type electronic parts |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56100430A (en) * | 1980-01-11 | 1981-08-12 | Toshiba Corp | Fixing method for power transistor to substrate |
| JPS5755244A (en) * | 1980-09-18 | 1982-04-02 | Nippon Soken Inc | Windshield wiper device |
| JPS5857785A (en) * | 1981-09-30 | 1983-04-06 | 松下電器産業株式会社 | Method of mounting electronic part |
| JPS59993A (en) * | 1982-06-25 | 1984-01-06 | 東光株式会社 | Method of bonding metal plate electrode |
| JPS63219181A (en) * | 1987-03-09 | 1988-09-12 | Tokin Corp | Piezoelectric ceramic electrode and formation thereof |
-
1988
- 1988-09-16 JP JP12147188U patent/JPH0243017U/ja active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56100430A (en) * | 1980-01-11 | 1981-08-12 | Toshiba Corp | Fixing method for power transistor to substrate |
| JPS5755244A (en) * | 1980-09-18 | 1982-04-02 | Nippon Soken Inc | Windshield wiper device |
| JPS5857785A (en) * | 1981-09-30 | 1983-04-06 | 松下電器産業株式会社 | Method of mounting electronic part |
| JPS59993A (en) * | 1982-06-25 | 1984-01-06 | 東光株式会社 | Method of bonding metal plate electrode |
| JPS63219181A (en) * | 1987-03-09 | 1988-09-12 | Tokin Corp | Piezoelectric ceramic electrode and formation thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04255102A (en) * | 1991-02-06 | 1992-09-10 | Murata Mfg Co Ltd | Manufacture of electronic component |
| JPH04255103A (en) * | 1991-02-06 | 1992-09-10 | Murata Mfg Co Ltd | Manufacture of electronic component |
| JPH06224680A (en) * | 1993-01-27 | 1994-08-12 | Murata Mfg Co Ltd | Chip type electronic parts |