JP2001308573A - Covering case of electronic component and covering method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a covering case of an electronic component and a covering method of an electronic component whereby the covering cost can be favorably reduced even in the case when there are electronic components to be covered of various sizes. SOLUTION: A covering case 1 is provided with rectangular covering parts 5 and axial leads 7, which protrude at constant intervals from two opposing sides of the covering parts 5. The covering parts 5 and the axial leads 7 are formed integrally by blanking a metallic plate. Further, a plurality of covering cases 1 is fixed by disposing the ends of the axial leads 7 between carrier tapes 1. The covering cases 1 are separated and used one by one by cutting the axial leads 7 inside the carrier tapes 11, and can be automatically mounted as a conventional axial electronic component. Since the axial leads 7 are bent at a bending position according to a width and a height of an electronic component, various sized electronic components can be covered to shield electromagnetic wave.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a case for covering an electronic component and a method for covering an electronic component, and more particularly to a case for covering an electronic component and a method for covering an electronic component for shielding electromagnetic waves. It relates to a coating method.

[0002]

2. Description of the Related Art Conventionally, it is prevented that an external electromagnetic wave is superimposed as noise on a signal input / output to an electronic component or an electromagnetic wave generated by the electronic component itself is superimposed on other signals as noise. Therefore, it has been considered that the electronic component is covered with a metal case and the case is connected to a ground electrode to shield the electromagnetic wave.
Further, as this type of case, a rectangular parallelepiped box-shaped case having an open lower surface is generally considered.

[0003]

However, the case needs to cover the entire electronic component, and is required to be as small as possible. For this reason, the cases are individually made, for example, to a size corresponding to the size of the electronic component. Therefore, a mold must be prepared every time a case is prepared, and the cost required for the coating is high.

Accordingly, the present invention provides an electronic component coating case and an electronic component coating method capable of favorably reducing the cost required for coating even when the size of the electronic component to be coated varies. Made for the purpose of providing.

[0005]

Means for Solving the Problems and Effects of the Invention In order to achieve the above object, the invention according to claim 1 comprises a covering portion for covering an electronic component from the front side, and a covering portion covering the electronic component in a direction opposite to the covering portion. An electronic component covering case, comprising: an axial lead protruding and having a distal end fixed to a carrier tape.

In the thus constructed cover case of the present invention, the axial lead is bent at a position corresponding to the size of the electronic component, the coating portion is disposed on the front side of the electronic component, and the axial lead is provided. Is connected to a printed wiring board (often a ground electrode) around the electronic component. That is, the coated case of the present invention is:
Since the axial leads are projected from the covering part in the direction facing each other, the axial leads can be bent at the positions corresponding to the width and height of the electronic parts to cover the electronic parts of various sizes well. You can do it. If the electronic component is coated in this way, a coating portion is provided on the surface side of the electronic component, and an axial lead is provided around the electronic component, and the electromagnetic wave entering and exiting the electronic component is shielded by the cooperation of the two. Can be.

Therefore, in the electronic component covering case of the present invention, even when the size of the electronic component to be covered is various, the cost required for the covering can be favorably reduced. Further, since the coated case of the present invention has the tip of the axial lead fixed to the carrier tape, a conventionally known axial type electronic component insertion device (for example, see Japanese Patent Application Laid-Open No. 09-0555600). By using the same configuration, it is possible to automatically mount on the printed wiring board. In this case, the cost required for the coating can be further reduced.

According to a second aspect of the present invention, in addition to the first aspect, the covering portion is rectangular and a plurality of axial leads project at equal intervals from two opposing sides of the covering portion. And According to the present invention, the covering portion is formed in a rectangular shape, and the axial lead is provided on the opposite side of the covering portion.
Since it has a simple structure in which a plurality of parts protrude from the side at equal intervals, manufacture is easy. Further, by adopting such a simple configuration, the covering case of the present invention can satisfactorily cover various electronic components, and the bending position of the axial lead can be easily set. Furthermore, by adopting the simple configuration described above, the coated case of the present invention can be automatically mounted on a printed wiring board by using the above-described axial type electronic component insertion device as it is or by making simple improvements. It becomes possible.

Furthermore, in the present invention, since a plurality of axial leads are protruded at equal intervals, it is possible to further prevent electromagnetic waves from entering and exiting through the gap between the axial leads. In consideration of the electromagnetic wave shielding property and the easiness of mounting, it is desirable that the above-mentioned interval is 1 mm to 2 mm (more preferably 1.5 mm). Therefore, in the present invention, in addition to the effects of the invention described in claim 1,
By facilitating manufacture and mounting, the cost required for the coating can be reduced more favorably, and the effect of better shielding of electromagnetic waves can be obtained.

[0010] The third aspect of the present invention is the first or second aspect.
In addition to the configuration described above, the axial lead has a stopper that prevents the axial lead from being inserted into the printed wiring board by a predetermined amount or more. When an electromagnetic wave is shielded by covering an electronic component, it is required that the covering case does not directly contact the electronic component. Therefore, in the covering case of the present invention, a stopper for preventing the axial lead from being inserted into the printed wiring board by a predetermined amount or more is provided. For this reason, the portion of the axial lead closer to the covering portion than the bending position and the covering portion can be extremely easily held in the hollow, and the axial type electronic component insertion device can be used more favorably. That is, this type of insertion device is configured on the premise that electronic components that do not need to be held in a hollow state, such as a resistor, are mounted. However, according to the above-described configuration of the present invention, it is possible to cover even without adjusting the insertion device side. The part can be easily held hollow. Therefore, according to the present invention, in addition to the effects of the first and second aspects of the present invention, there is an effect that the cost required for the coating can be more favorably reduced by making mounting easier.

According to a fourth aspect of the present invention, in addition to the configuration according to any one of the first to third aspects, when a plurality of adjacent parts are arranged adjacent to each other in a direction orthogonal to a direction in which the axial leads protrude, the covering parts may partially overlap each other. It is characterized in that it forms a series of covering parts by overlapping with each other. In the case of the present invention,
When a plurality of the covering cases are arranged adjacent to each other in a direction orthogonal to the axial lead protruding direction, the covering portions partially overlap to form a series of covering portions. For this reason, even if a covering case having a large covering portion is not manufactured in advance, a covering case having an apparently large covering portion can be configured by arranging the covering case adjacently as described above. Therefore, according to the present invention, it is possible to satisfactorily cover various electronic components, and in addition to the effects of the inventions according to claims 1 to 3, it is possible to further reduce the cost required for the coating. Occurs.

According to a fifth aspect of the present invention, there is provided an electronic component coating method for coating an electronic component mounted on a printed wiring board using the electronic component coating case according to any one of the first to fourth aspects. Bending the axial lead at a position corresponding to the size of the electronic component, disposing the covering portion on the front surface side of the electronic component, and connecting the axial lead to the printed wiring board around the electronic component. It is characterized by doing.

According to the present invention, the axial lead of the cover case according to any one of claims 1 to 4 is bent at a position corresponding to the size of the electronic component, and the cover portion is arranged on the front side of the electronic component. In addition, the axial lead is connected to a printed wiring board (often a ground electrode) around the electronic component. For this reason, as described in relation to claim 1, by bending the axial lead at a position corresponding to the width and height of the electronic component, electronic components of various sizes can be covered well, and In addition, even when the size of the electronic component is various, the cost required for covering the electronic component can be favorably reduced. In addition, as described above, if the method of the present invention is performed using the same configuration as the axial-type electronic component insertion device, the cost required for coating can be further reduced.

According to a sixth aspect of the present invention, in addition to the configuration of the fifth aspect, a plurality of covering cases for the electronic component are used, and the covering portions are overlapped so that the axial leads project in different directions. It is characterized in that it is arranged on the front side of the electronic component. In the present invention, since a plurality of covering cases for the electronic component are used, and the covering portions are overlapped and arranged on the surface side of the electronic component so that the protruding directions of the axial leads are different from each other, the periphery of the electronic component is Can be coated with axial leads from various directions. Therefore, in the present invention, in addition to the effect of the fifth aspect of the invention, there is an effect that electromagnetic waves can be shielded more favorably.

[0015]

Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view illustrating a configuration of a covering case 1 to which the present invention is applied. As shown in FIG. 1, the covering case 1 includes a rectangular covering portion 5, and axial leads 7 protruding at equal intervals (1.5 mm intervals) from two opposing sides of the covering portion 5. The axial lead 7 is formed integrally by punching a metal plate. Further, a plurality of the covering cases 1 are arranged in a direction (hereinafter, referred to as a length direction) orthogonal to a projection direction (hereinafter, referred to as a width direction) of the axial leads 7, and a tip of each axial lead 7 is sandwiched by a carrier tape 11. Is fixed.

The thus constructed cover case 1 is used by separating the axial leads 7 one by one by cutting the axial leads 7 at a portion inside the carrier tape 11.
Further, since the covering case 1 is fixed to the carrier tape 11 in this manner, a conventionally known axial type electronic component insertion device (for example, Japanese Patent Application Laid-Open No. 09-0556).
The configuration can be automatically mounted on the printed wiring board 13 (see FIG. 2) by using the same configuration as that of the first embodiment.
Next, an electronic component (for example, IC
A method of coating the chip 15 (see FIG. 2) will be described.

FIG. 2 shows one covering case 1 as described above.
Is separated from the carrier tape 11 and the covering portion 5 is held by the chuck 17 of the insertion device. After being held in this manner, the covering case 1 is
Is disposed right above the IC chip 15 and the printed wiring board 1
Holes 13a provided on both sides of IC chip 15 in 3
The axial lead 7 is bent in accordance with (conduction with the ground electrode). Subsequently, the chuck 17 is lowered, the tip of the axial lead 7 is fitted into the hole 13a, and reflow soldering is performed from the lower surface.

As shown in FIG. 3, a stopper 7a projects in the front-rear direction near the tip of each axial lead 7, and when the chuck 17 is lowered, the stopper 7a engages with the outer periphery of the hole 13a. The stopping of the covering case 1 is stopped by the stopping. At this time, the printed wiring board 1
The position of the stopper 7a is set below the bottom 3 so that the axial lead 7 protrudes as much as necessary for the reflow soldering. The coating case 1 is fixed by spraying the solder 19 from the lower surface of the printed wiring board 13. You. Then, as schematically shown in FIG.
The coating portion 5 is provided on the surface side of the IC chip 5 and the axial lead 7 is provided around the IC chip 15, so that the electromagnetic waves entering and exiting the IC chip 15 can be shielded by the cooperation of the both.

Alternatively, as shown schematically in FIG. 5, two covering cases 1 may be used and the covering portions 5 may be overlapped so that the protruding directions of the axial leads 7 are different from each other by 90 °. In this case, the periphery of the IC chip 15 can be covered with the axial leads 7 from all directions, and the electromagnetic waves can be more effectively shielded. FIG.
Although the covering part 5 is drawn in a square (of course, one form of a rectangle), even if the covering part 5 has a rectangular shape having different lengths in the length direction and the width direction, the axial lead 7 can be formed. By appropriately setting the bending position, the overlapping as shown in FIG. 5 can be performed.

The above-described cover case 1 covers electronic components of various sizes by bending the axial leads 7 at bending positions corresponding to the width and height of the electronic components (such as the IC chip 15). The electromagnetic wave can be shielded as shown in FIG. Therefore, even when the size of the electronic component to be coated is various, the cost required for the coating can be favorably reduced.

Further, since the tip of the axial lead 7 is fixed to the carrier tape 11 in the covering case 1,
As described above, it is possible to automatically mount the printed wiring board 13 using the same configuration as that of the known insertion device, and the cost required for the coating can be further reduced. In addition, the covering case 1 has the axial lead 7
Since the stopper 7a is provided in the vicinity of the distal end of the cover 5, the cover 5 can be easily held in a hollow state without adjusting the insertion device. Therefore, the mounting can be further facilitated, and the cost can be further reduced.

The covering case 1 can also function as a heat dissipating member by attaching a heat conductive sheet 21 to the lower surface of the covering portion 5 as shown in FIG. In this case, if the axial lead 7 is too long, the heat conductive sheet 21 may not contact the surface of the IC chip 15 as shown in FIG. 6A, but the covering portion 5 and the axial lead 7 can be deformed. If the thickness is configured, it can be adjusted as follows.

That is, as shown in FIG.
When the heat sink 23 having 3a is used, a part of the covering portion 5 is pressed by the protrusion 23a to bend the covering portion 5 and the axial lead 7, and the heat conductive sheet 21 is brought into contact with the surface of the IC chip 15. be able to. In the case where a flat heat sink 25 is used as shown in FIG. 6C, the axial lead 7 is pressed by pressing the entire covering portion 5 with the lower surface of the heat sink 25.
And the heat conductive sheet 21 can be brought into contact with the surface of the IC chip 15. In any case, the heat generated in the IC chip 15 is satisfactorily radiated to the heat sink 23 or the heat sink 25 via the heat conductive sheet 21 and the cover 5.

In each of the above embodiments, the case where only one IC chip 15 as an electronic component is covered has been described as an example. However, a plurality of electronic components may be covered simultaneously. In addition, the shape of the covering portion 5 can be various shapes other than the rectangle, and for example, may be adapted to the shape of a unit including a plurality of electronic components.

However, the covering part 5 is rectangular as in the covering case 1 and the axial lead 7 is
In the case of protruding from the side at equal intervals, the structure becomes simple and the production becomes easy. Moreover, when the thickness of the covering portion 5 and the thickness of the axial lead 7 are made the same as in the case of the covering case 1, it is possible to manufacture easily by punching a metal plate as described above. Therefore, the manufacturing cost can be further reduced.

Further, by adopting a simple configuration in which the covering portion 5 is rectangular and the axial leads 7 protrude from the two opposing sides of the covering portion 5 at equal intervals, the covering case 1 can better accommodate a wider variety of electronic components. And the bending position of the axial lead 7 can be easily set. Further, by adopting the above simple configuration, the covering case 1
Can be automatically mounted on the printed wiring board 13 by using the above-described insertion device as it is or by making a simple improvement. Therefore, the cost required for the coating can be further reduced.

Further, in the covering case 1, the axial leads 7 are protruded at equal intervals of 1.5 mm.
Electromagnetic waves can be more preferably prevented from entering and exiting through the gap between the axial leads 7. For this reason,
Electromagnetic waves can be better shielded.

In each of the above embodiments, reflow soldering is performed by penetrating the axial lead 7 through the printed wiring board 13. However, solder cream is applied to the printed wiring board 13 and mounted thereon. May be. In this case, it is not necessary to provide the axial lead 7 with the stopper 7a. Further, even when the axial leads 7 are made to penetrate, various forms of the stopper can be considered, such as using the carrier tape 11 as a stopper by projecting the tip of the axial lead 7 to the outside of the carrier tape 11. . Further, the stoppers may be provided only on some of the axial leads 7 such as four corners.

Further, the present invention is not limited to the above-described embodiment at all, and can be implemented in various forms without departing from the gist of the present invention. For example, the cover case of the electronic component of the present invention can be configured to be connectable in the length direction like a cover case 31 shown in FIGS.

As shown in FIG.
Is provided with a flat plate portion 35a that forms a series of flat plates with the axial lead 37 between a pair of axial leads 37 that are arranged to face each other, and from the flat plate portion 35a, one of the length directions (hereinafter referred to as front). Toward the flat plate part 3
Three upper pieces 35b bent above 5a protrude. Further, behind the flat plate portion 35a, the flat plate portion 3 is provided.
The two lower pieces 35c that are bent downward below 5a protrude, and the flat part 35a, the upper piece 35b, and the lower piece 35
The covering portion 35 of the covering case 31 is constituted by c.

A plurality of covering cases 31 constructed as described above are arranged adjacent to each other in the longitudinal direction, and as shown in FIG.
5b is placed on the flat plate portion 35a of the adjacent covering case 31,
The flat portion 35a of the covering case 31 to which the lower piece 35c is adjacent.
Below, the covering portions 35 arranged adjacently partially overlap each other to form a series of covering portions. For this reason, in the covering case 31, even if the covering case having the large covering portion is not manufactured in advance, the covering case having the apparently large covering portion can be configured by arranging the covering case adjacently as described above. Therefore, it is possible to satisfactorily cover various electronic components,
The cost required for the coating can be reduced more favorably.

In addition, the flat plate portion 35a is
Needless to say, it may be configured to be larger than 7 in the length direction. In this case, it is also possible to project a plurality of axial leads 37 from the flat plate portion 35a in directions facing each other. In the case where a plurality of axial leads project from the covering portion in the direction facing each other as in this embodiment and the covering case 1 described above, each covering portion is stably disposed on the surface side of the electronic component. be able to.
On the other hand, when a pair of axial leads are protruded from the covering portion in a direction facing each other as in the covering case 31, a conventional axial-type electronic component insertion device can be used more favorably.

[Brief description of the drawings]

FIG. 1 is a perspective view illustrating a configuration of a covering case to which the present invention is applied.

FIG. 2 is an explanatory diagram illustrating a method of coating an electronic component using the coating case.

FIG. 3 is an explanatory view showing a structure of a tip of an axial lead of the covering case.

FIG. 4 is an explanatory diagram showing a covering state of an electronic component using the covering case.

FIG. 5 is an explanatory diagram illustrating another form of a covering state of the electronic component.

FIG. 6 is an explanatory view showing the above-mentioned covering case provided with a heat radiation effect.

FIG. 7 is a perspective view illustrating a configuration of another covering case to which the present invention is applied.

FIG. 8 is a cross-sectional view illustrating a use state of the covering case.

[Explanation of symbols]

1,31 ... Coating case 5,35 ... Coating part 7,
37 ... Axial lead 7a ... Stopper 11 ... Carrier tape 1
3: Printed circuit board 15: IC chip 17: Chuck 2
DESCRIPTION OF SYMBOLS 1 ... Thermal conductive sheet 35a ... Flat plate part 35b ... Upper piece 3
5c ... lower piece

Claims (6)

[Claims] 1. An electronic component comprising: a covering portion for covering an electronic component from a surface side; and an axial lead projecting from the covering portion in a direction facing each other and having a tip fixed to a carrier tape. Covering case for electronic components. 2. The electronic component coating case according to claim 1, wherein the coating portion is rectangular, and a plurality of the axial leads project at equal intervals from two opposing sides of the coating portion. 3. The axial lead according to claim 1, wherein the axial lead has a stopper for preventing the axial lead from being inserted into a printed wiring board by a predetermined amount or more.
Or a coating case for an electronic component according to 2. 4. A series of covering portions when the plurality of covering portions are arranged adjacent to each other in a direction orthogonal to a direction in which the axial leads protrude, and the covering portions partially overlap each other. A case for covering an electronic component according to any one of the above. 5. A method for coating an electronic component mounted on a printed circuit board using the electronic component coating case according to claim 1, wherein the axial lead is mounted on the printed circuit board. Bending the electronic component at a position corresponding to the size of the electronic component, disposing the covering portion on the front surface side of the electronic component, and connecting the axial lead to the printed wiring board around the electronic component. How to cover electronic components. 6. A method according to claim 1, wherein a plurality of covering cases for the electronic component are used, and the covering portions are overlapped with each other so that the axial leads project in different directions, and are disposed on the front surface side of the electronic component. The method for coating an electronic component according to claim 5.