JPH04134815U - Transformer mounting structure - Google Patents
Transformer mounting structureInfo
- Publication number
- JPH04134815U JPH04134815U JP4118091U JP4118091U JPH04134815U JP H04134815 U JPH04134815 U JP H04134815U JP 4118091 U JP4118091 U JP 4118091U JP 4118091 U JP4118091 U JP 4118091U JP H04134815 U JPH04134815 U JP H04134815U
- Authority
- JP
- Japan
- Prior art keywords
- transformer
- wiring board
- printed wiring
- shield member
- core
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 11
- 229910052751 metal Inorganic materials 0.000 claims abstract description 5
- 239000002184 metal Substances 0.000 claims abstract description 5
- 230000000694 effects Effects 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 abstract description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 7
- 230000005855 radiation Effects 0.000 abstract description 4
- 230000020169 heat generation Effects 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Coils Of Transformers For General Uses (AREA)
- Transformer Cooling (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】
【目的】 各種電子機器の回路構成に広く使用されるプ
リント板ユニットのトランス実装構造に関し、トランス
の発熱を熱伝導の優れたプリント配線板に伝熱して当該
トランスを容易に冷却することを目的とする。
【構成】 巻回したコア2-1 の両端面に絶縁部材2-3 を
介してそれぞれ複数本のリード端子2-3aを突出させたト
ランス２と、アルミ等よりなる基板11-1の表面に絶縁膜
11-2を介して一対の接続パターン11-3と、当該接続パタ
ーン11-3の中間に放熱パターン11-4を設けたプリント配
線板11と、上記トランス２の該コイル2-2の上部外周面
と該コア2-1 の上面および両側面に密着できる形状に成
形して、上記プリント配線板11の該放熱パターン11-4に
達する位置で曲折することにより接合面13ａを形成した
熱伝導の優れた金属薄板よりなるシールド部材13とから
構成する。
(57) [Abstract] [Purpose] Regarding the transformer mounting structure of printed board units that are widely used in the circuit configuration of various electronic devices, the heat generation of the transformer is transferred to the printed wiring board with excellent heat conduction to easily mount the transformer. The purpose is to cool. [Structure] A transformer 2 has a plurality of lead terminals 2-3a protruding from both end faces of a wound core 2-1 through an insulating member 2-3, and a substrate 11-1 made of aluminum or the like has a transformer 2 on its surface. Insulating film
A pair of connection patterns 11-3 via 11-2, a printed wiring board 11 provided with a heat radiation pattern 11-4 in the middle of the connection patterns 11-3, and an upper outer periphery of the coil 2-2 of the transformer 2. The heat conduction plate is formed into a shape that can be closely attached to the upper surface and both side surfaces of the core 2-1, and is bent at a position reaching the heat dissipation pattern 11-4 of the printed wiring board 11 to form the joint surface 13a. The shield member 13 is made of a superior thin metal plate.
Description
【０００１】0001
本考案は、各種電子機器の回路構成に広く使用されるプリント板ユニットのト ランス実装構造に関する。 This invention is a printed circuit board unit widely used in the circuit configuration of various electronic devices. Regarding the lance mounting structure.
【０００２】 最近、大型電算機等のプリント板ユニットは、熱伝導性の優れたアルミ等より なるプリント配線板に、更に高集積化された半導体装置等の電子部品が高密度に 実装されるとともにこれらの電子部品に電源を供給する小型のトランスも実装さ れるようになっているために、この実装されたトランスからの発熱をプリント配 線板に伝熱させて冷却することができるトランス実装構造が必要とされている。0002 Recently, printed board units for large computers, etc. have been made from aluminum, which has excellent thermal conductivity. Electronic components such as highly integrated semiconductor devices are becoming more densely packed on printed wiring boards. A small transformer that supplies power to these electronic components is also implemented. The heat generated from this mounted transformer is removed by the printed wiring board. There is a need for a transformer mounting structure that can transfer heat to the wire plate for cooling.
【０００３】0003
従来広く使用されているトランス実装構造は、図４に示すように電磁波を遮断 できる金属，例えば銅の薄板よりなるシールド部材３をコア2-1 の隙間とコイル 2-2 の外周へエンドレス状に巻回し、前記コア2-1 の両端面に絶縁部材2-3 を介 してそれぞれ複数本のリード端子2-3aを突出させて配列したトランス２を、アル ミ等よりなる基板1-1 の表面に接続パターン1-3 を形成したプリント配線板１に 載置する。 The conventionally widely used transformer mounting structure blocks electromagnetic waves as shown in Figure 4. A shielding member 3 made of a thin plate of metal such as copper is inserted between the gap between the core 2-1 and the coil. The core 2-2 is wound endlessly around the outer circumference of the core 2-2, and the insulating member 2-3 is interposed between both end surfaces of the core 2-1. The transformers 2 each having a plurality of lead terminals 2-3a protruding are arranged in an aluminum Printed wiring board 1 with connection pattern 1-3 formed on the surface of board 1-1 consisting of Place it.
【０００４】 そして、当該プリント配線板１の各接続パターン1-3 と上記トランス２の各リ ード端子2-3aを位置合わせして当接させ、半田付けあるいはボンディング等によ り各リード端子2-3aと各接続パターン1-3 とを接合することにより、上記プリン ト配線板１の表面に前記トランス２が実装されている。0004 Then, each connection pattern 1-3 of the printed wiring board 1 and each line of the transformer 2 are connected. Align and touch the ground terminals 2-3a, and then solder or bond them. By joining each lead terminal 2-3a and each connection pattern 1-3, the above printer can be connected. The transformer 2 is mounted on the surface of the wiring board 1.
【０００５】[0005]
以上説明した従来のトランス実装構造で問題となるのは、コア2-1 の両端面に 絶縁部材2-3 を介して配列したリード端子2-3aをプリント配線板１の接続パター ン1-3 と接合して実装されているから、発熱により温度が上昇するコア2-1 とコ イル2-2 は熱伝導度の低い絶縁部材2-3 により宙に浮いて、その熱が熱伝導の優 れたアルミ等よりなる基板1-1 に伝熱されないために実装されたトランス２が小 型化できないという問題が生じている。 The problem with the conventional transformer mounting structure explained above is that Connect the lead terminals 2-3a arranged through the insulating member 2-3 to the connection pattern of the printed wiring board 1. Since the core 2-1 and the core 1-3 are mounted in contact with each other, the temperature rises due to heat generation. The coil 2-2 is suspended in the air by the insulating material 2-3, which has low thermal conductivity, and the heat is transferred to the The mounted transformer 2 is small to prevent heat transfer to the substrate 1-1 made of aluminum etc. The problem is that it cannot be modeled.
【０００６】 本考案は上記のような問題点に鑑み、トランスの発熱を熱伝導の優れたプリン ト配線板に伝熱して当該トランスを容易に冷却することで小型化できる新しいト ランス実装構造の提供を目的とする。[0006] In view of the above-mentioned problems, this invention has been developed to reduce the heat generated by the transformer by using a material with excellent thermal conductivity. A new transformer that can be made smaller by transferring heat to the wiring board and easily cooling the transformer. The purpose is to provide a lance mounting structure.
【０００７】[0007]
本考案は、図１に示すようにコイル2-2 を巻回したコア2-1 の両端面に絶縁部 材2-3 を介してそれぞれ複数本のリード端子2-3aを突出させたトランス２と、 アルミ等よりなる基板11-1の表面に絶縁膜11-2を介して一対の接続パターン11 -3と、当該接続パターン11-3の中間に平面状の放熱パターン11-4を設けたプリン ト配線板11と、 図３に示すように上記トランス２の該コイル2-2 の上部外周面と該コア2-1 の 上面および両側面に密着できる逆Ｕ字に成形して、上記プリント配線板11の該放 熱パターン11-4に達する位置で曲折することにより接合面13ａを形成した熱伝導 の優れた金属薄板よりなるシールド部材13とから構成する。 As shown in Figure 1, this invention has an insulating section on both end surfaces of a core 2-1 around which a coil 2-2 is wound. A transformer 2 each having a plurality of lead terminals 2-3a protruding through a material 2-3, A pair of connection patterns 11 are formed on the surface of a substrate 11-1 made of aluminum or the like through an insulating film 11-2. -3 and a printer with a planar heat dissipation pattern 11-4 between the connection pattern 11-3. a wiring board 11; As shown in FIG. 3, the upper outer peripheral surface of the coil 2-2 and the core 2-1 of the transformer 2 are It is formed into an inverted U-shape that can be tightly attached to the top and both sides of the printed wiring board 11. Heat conduction that forms a joint surface 13a by bending at the position reaching the thermal pattern 11-4 The shield member 13 is made of a thin metal plate with excellent properties.
【０００８】[0008]
本考案では、図１に示すようにプリント配線板11の接続パターン11-3とコア2- 1 の両端面から絶縁部材2-3 を介して配列したリード端子2-3aとを接合してトラ ンス２を実装し、図３に示す如くこのトランス２のコイル2-2 の上部外周面とコ ア2-1 の上面および両側面に密着させてシールド部材13の接合面13ａをプリント 配線板11の放熱パターン11-4を接合することにより、トランス２より出射する電 磁波はシールド部材13と基板11-1あるいはその表面に形成した放熱パターン11-4 で遮断できる。 In this invention, as shown in FIG. 1, the connection pattern 11-3 of the printed wiring board 11 and the core 2- Connect lead terminals 2-3a arranged from both end faces of 1 through insulating member 2-3 to connect the lead terminals 2-3a and As shown in Fig. 3, the upper outer peripheral surface of the coil 2-2 of this transformer 2 and the coil 2-2 of the transformer 2 are mounted. A2-1 Print the joint surface 13a of the shield member 13 in close contact with the top surface and both sides. By joining the heat dissipation pattern 11-4 of the wiring board 11, the electric current emitted from the transformer 2 can be reduced. The magnetic waves are transmitted through the shielding member 13 and the substrate 11-1 or the heat dissipation pattern 11-4 formed on its surface. It can be blocked by
【０００９】 また、トランス２の発熱は熱伝導の優れたシールド部材13を経由してプリント 配線板11に放熱されるので、プリント配線板11に実装した当該トランス２を容易 に冷却することが可能となる。[0009] In addition, the heat generated by transformer 2 is printed via a shield member 13 with excellent heat conduction. Since the heat is radiated to the wiring board 11, it is easy to install the transformer 2 mounted on the printed wiring board 11. It becomes possible to cool down to
【００１０】0010
以下図１〜図３について本考案の実施例を詳細に説明する。 図１は第一実施例によるトランス実装構造を示す斜視図、図２は第二実施例を 示す斜視図、図３は実施例の作用を説明する側視図を示し、図中において、図４ と同一部材には同一記号を付しているが、その他の11は各種電子部品とトランス を実装するプリント配線板，13はトランスを冷却するとともに電磁波を遮断する シールド部材である。 Embodiments of the present invention will be described in detail with reference to FIGS. 1 to 3 below. Figure 1 is a perspective view showing a transformer mounting structure according to the first embodiment, and Figure 2 is a perspective view showing the transformer mounting structure according to the second embodiment. 3 is a side view for explaining the operation of the embodiment, and in the figure, FIG. The same parts are given the same symbols, but the other 11 are various electronic parts and transformers. The printed wiring board that implements 13 cools the transformer and blocks electromagnetic waves. It is a shield member.
【００１１】 プリント配線板11は、図１に示すようにアルミ等よりなる基板11-1の表面に絶 縁膜11-2を施して、図示していない半導体等の電子部品を実装するフットパター ンとトランス２の両端面より突出したリード端子2-3aと接合する一対の接続パタ ーン11-3を形成して、その対向する接続パターン11-3の中間に平面状の放熱パタ ーン11-4を設けたものである。[0011] As shown in Fig. 1, the printed wiring board 11 is permanently attached to the surface of the substrate 11-1 made of aluminum or the like. A foot putter on which electronic parts such as semiconductors (not shown) are mounted by applying a membrane 11-2. A pair of connection patterns that connect to the lead terminals 2-3a protruding from both end faces of the transformer 2 and the transformer 2. A planar heat dissipation pattern is formed between the opposing connection patterns 11-3. 11-4.
【００１２】 シールド部材13は、図１に示すように電磁波が遮断できるとともに熱伝導の優 れた金属，例えば銅の薄板を、図３に示すようにトランス２のコイル2-2 の上部 外周面とコア2-1 の上面および両側面に密着する形状の逆Ｕ字状に成形し、その 対向する両側面をプリント配線板11に形成された放熱パターン11-4に達する位置 で互いに反対方向へ一定長さ曲折して、両端縁に前記放熱パターン11-4と接合す る平面状の接合面13ａを形成したものである。0012 As shown in Figure 1, the shield member 13 can block electromagnetic waves and has excellent heat conduction. Place a thin plate of metal, such as copper, on top of coil 2-2 of transformer 2 as shown in Figure 3. It is molded into an inverted U-shape that closely fits the outer circumferential surface and the top and both sides of core 2-1. The position where the opposing sides reach the heat radiation pattern 11-4 formed on the printed wiring board 11 Bend a certain length in opposite directions to join the heat dissipation pattern 11-4 at both ends. A flat joint surface 13a is formed.
【００１３】 上記部材を使用した第一実施例によるトランス実装構造は、図１に示すように 基板11-1の表面に接続パターン11-3を形成したプリント配線板11にトランス２を 載置し、このトランス２のコア2-1 両端面に絶縁部材2-3 を介してそれぞれ突出 させた複数本のリード端子2-3aと前記プリント配線板11の接続パターン11-3を位 置合わせして接合することにより当該トランス２が実装される。[0013] The transformer mounting structure according to the first embodiment using the above members is as shown in Figure 1. The transformer 2 is installed on the printed wiring board 11 on which the connection pattern 11-3 is formed on the surface of the board 11-1. The core 2-1 of this transformer 2 is protruded from both end faces through the insulating member 2-3. Connect the plurality of lead terminals 2-3a and the connection pattern 11-3 of the printed wiring board 11. The transformer 2 is mounted by aligning and joining.
【００１４】 そして、図３に示すように上記実装されたトランス２を跨ぐようにシールド部 材13を嵌入することにより、当該シールド部材13の内面をトランス２のコイル2- 2 の上部外周面とコア2-1 の上面および両側面に密着させ、このシールド部材13 の接合面13ａとプリント配線板11の放熱パターン11-4を半田付けあるいはボンデ ィング等により接合することで当該シールド部材13を固着する。[0014] Then, as shown in Figure 3, the shield part is placed across the mounted transformer 2. By fitting the material 13, the inner surface of the shield member 13 is connected to the coil 2- of the transformer 2. 2 and the top and both sides of core 2-1, The bonding surface 13a of the printed wiring board 11 and the heat dissipation pattern 11-4 are soldered or bonded. The shield member 13 is fixed by bonding or the like.
【００１５】 また、第二実施例は、図２に示すようにアルミ等よりなる基板11-1の上記シー ルド部材13の接合面13ａと対応する部分を除く全面に絶縁膜21-2を施して、電子 部品を実装するフットパターンとトランス２の両端面より突出したリード端子2- 3aと接合する接続パターン11-3を形成したプリント配線板21に、上記と同一方法 でトランス２のリード端子2-3aと接続パターン11-3を接合する。[0015] Further, in the second embodiment, as shown in FIG. An insulating film 21-2 is applied to the entire surface of the lead member 13 except for the part corresponding to the joint surface 13a, and the electronic Foot pattern for mounting components and lead terminals 2- protruding from both end surfaces of transformer 2. The same method as above is applied to the printed wiring board 21 on which the connection pattern 11-3 to be bonded to 3a is formed. Connect the lead terminal 2-3a of the transformer 2 and the connection pattern 11-3.
【００１６】 そして、シールド部材13をトランス２に嵌入してその内面をコイル2-2 の上部 外周面とコア2-1 の上面および両側面に密着させ、このシールド部材13の接合面 13ａをプリント配線板21の基板11-1に直接接合することにより固着する。[0016] Then, fit the shield member 13 into the transformer 2 and place its inner surface over the coil 2-2. The joint surface of this shield member 13 is closely attached to the outer peripheral surface and the top and both sides of core 2-1. 13a is fixed by directly bonding to the substrate 11-1 of the printed wiring board 21.
【００１７】 その結果、図２および図３に示すように電磁波を遮断するとともに熱伝導の優 れたシールド部材13をトランス２のコア2-1 とコイル2-2 の上部に密着させて、 その接合面13ａとプリント配線板11に形成された放熱パターン11-4を接合してい るので、対向するコア2-1 の隙間の上部と両側面側はシールド部材13で覆われて おり、下部にはアルミ等よりなる基板11-1あるいはその表面に形成した放熱パタ ーン11-4が介在しているため、コア2-1 の隙間から発生する電磁波の外部漏洩を 完全に遮断することができ、またトランス２の発熱は、シールド部材13を伝わっ て放熱パターン11-4より放熱効果の高い基板11-1へ伝熱されるから容易に伝熱冷 却することができる。[0017] As a result, as shown in Figures 2 and 3, it blocks electromagnetic waves and has excellent heat conduction. The shield member 13 is placed in close contact with the top of the core 2-1 and coil 2-2 of the transformer 2, The bonding surface 13a and the heat radiation pattern 11-4 formed on the printed wiring board 11 are bonded. Therefore, the upper part and both sides of the gap between the opposing cores 2-1 are covered with the shield member 13. At the bottom, there is a substrate 11-1 made of aluminum or the like or a heat dissipation pattern formed on its surface. Because core 2-1 is interposed, electromagnetic waves generated from the gap in core 2-1 are prevented from leaking to the outside. It can be completely shut off, and the heat generated by the transformer 2 is transmitted through the shield member 13. Since the heat is transferred from the heat dissipation pattern 11-4 to the substrate 11-1, which has a higher heat dissipation effect, it can be easily cooled by heat transfer. can be rejected.
【００１８】 以上、図示実施例に基づき説明したが、本考案は上記実施例の態様のみに限定 されるものでなく、例えばインダクタンス（チョークコイル）についても適用し ても良い。[0018] Although the above has been explained based on the illustrated embodiments, the present invention is limited only to the aspects of the above embodiments. For example, it also applies to inductance (choke coil). It's okay.
【００１９】[0019]
以上の説明から明らかなように本考案によれば極めて簡単な構成で、プリント 配線板に実装したトランスから発生する電磁波を遮断するとともに当該トランス を冷却することができる等の利点があり、著しい経済的及び、信頼性向上の効果 が期待できるトランス実装構造を提供することができる。 As is clear from the above explanation, the present invention has an extremely simple configuration and prints easily. In addition to blocking electromagnetic waves generated from transformers mounted on wiring boards, It has the advantage of being able to cool the It is possible to provide a transformer mounting structure that can be expected.
【図１】 第一実施例によるトランス実装構造を示す斜
視図である。FIG. 1 is a perspective view showing a transformer mounting structure according to a first embodiment.
【図２】 第二実施例を示す斜視図である。FIG. 2 is a perspective view showing a second embodiment.
【図３】 実施例の作用を説明する側視図である。FIG. 3 is a side view illustrating the operation of the embodiment.
【図４】 従来のトランス実装構造を示す斜視図であ
る。FIG. 4 is a perspective view showing a conventional transformer mounting structure.
２はトランス、2-1 はコア、
2-2 はコイル、2-3aはリード端子、11, 21はプリント配
線板、11-1は基板 11-2, 21
-2は絶縁膜、11-3は接続パターン、 11
-4は放熱パターン、13はシールド部材、13ａは接合面、2 is the transformer, 2-1 is the core,
2-2 is the coil, 2-3a is the lead terminal, 11, 21 is the printed wiring board, 11-1 is the board 11-2, 21
-2 is an insulating film, 11-3 is a connection pattern, 11
-4 is a heat radiation pattern, 13 is a shield member, 13a is a joint surface,
Claims (2)
両端面よりそれぞれ複数本のリード端子(2-3a)を突出さ
せたトランス(2) と、放熱効果の高い基板(11-1)の表面
に、絶縁膜(11-2)を介して上記トランス(2)の該リード
端子(2-3a)を接合する一対の接続パターン(11-3)と、当
該接続パターン(11-3)の中間に放熱パターン(11-4)を設
けたプリント配線板(11)と、上記トランス(2) の該コイ
ル(2-2) の上部外周面と該コア(2-1) の上面および両側
面に密着する形状に成形して、上記プリント配線板(11)
の該放熱パターン(11-4)と接合する接合面(13a) を形成
した熱伝導の優れた金属薄板よりなるシールド部材(13)
とから構成したことを特徴とするトランス実装構造。[Claim 1] A transformer (2) having a plurality of lead terminals (2-3a) protruding from both end faces of a core (2-1) around which a coil (2-2) is wound, and a transformer (2) with a high heat dissipation effect. A pair of connection patterns (11-3) for joining the lead terminals (2-3a) of the transformer (2) via an insulating film (11-2) on the surface of the substrate (11-1); A printed wiring board (11) with a heat dissipation pattern (11-4) provided in the middle of the pattern (11-3), the upper outer peripheral surface of the coil (2-2) of the transformer (2) and the core (2- 1) Form the printed wiring board (11) into a shape that fits tightly on the top and both sides of the board (11).
A shield member (13) made of a thin metal plate with excellent heat conduction and forming a joint surface (13a) that joins with the heat dissipation pattern (11-4).
A transformer mounting structure characterized by comprising:
に上記シールド部材(13)の該接合面(13a) と対応する部
分を除く全面に絶縁膜(21-2)を施すとともに、上記トラ
ンス(2) の該リード端子(2-3a)を接合する一対の接続パ
ターン(11-3)を形成し、該シールド部材(13)の該接合面
(13a) を上記基板(11-1)に直接接合したことを特徴とす
る請求項１記載のトランス実装構造。Claim 2: The printed wiring board includes the substrate (11-1)
An insulating film (21-2) is applied to the entire surface of the shield member (13) except for a portion corresponding to the bonding surface (13a), and the lead terminal (2-3a) of the transformer (2) is bonded to the shield member (13). A pair of connection patterns (11-3) are formed, and the joint surface of the shield member (13)
The transformer mounting structure according to claim 1, characterized in that (13a) is directly bonded to the substrate (11-1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991041180U JP2589697Y2 (en) | 1991-06-04 | 1991-06-04 | Transformer mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991041180U JP2589697Y2 (en) | 1991-06-04 | 1991-06-04 | Transformer mounting structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04134815U true JPH04134815U (en) | 1992-12-15 |
| JP2589697Y2 JP2589697Y2 (en) | 1999-02-03 |
Family
ID=31922023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1991041180U Expired - Fee Related JP2589697Y2 (en) | 1991-06-04 | 1991-06-04 | Transformer mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2589697Y2 (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001308573A (en) * | 2000-04-24 | 2001-11-02 | Kitagawa Ind Co Ltd | Covering case of electronic component and covering method thereof |
| JP2002208521A (en) * | 2001-01-11 | 2002-07-26 | Denso Corp | Smoothing coil for smoothing large current |
| JP2003347783A (en) * | 2002-05-31 | 2003-12-05 | Mitsubishi Electric Corp | Power conversion apparatus |
| JP2008016641A (en) * | 2006-07-06 | 2008-01-24 | Tamagawa Seiki Co Ltd | Short ring |
| JP2011009418A (en) * | 2009-06-25 | 2011-01-13 | Cosel Co Ltd | Insulating transformer for switching power supply device |
| JP2011108916A (en) * | 2009-11-19 | 2011-06-02 | Cosel Co Ltd | Isolation transformer |
| WO2013183665A1 (en) * | 2012-06-05 | 2013-12-12 | 国立大学法人 埼玉大学 | Contactless feeding transformer |
| JP6261689B1 (en) * | 2016-09-09 | 2018-01-17 | 三菱電機株式会社 | Power converter |
| JP2019030089A (en) * | 2017-07-27 | 2019-02-21 | Tdk株式会社 | Coil unit, and power transmission device, power reception device, and wireless power transmission system using coil unit |
| JP2019029461A (en) * | 2017-07-27 | 2019-02-21 | Tdk株式会社 | Coil unit, and power transmission device, power reception device, and wireless power transmission system using coil unit |
| JP2019153757A (en) * | 2018-03-06 | 2019-09-12 | Tdk株式会社 | Surface-mount coil device and electronic equipment |
| JP2020078245A (en) * | 2020-01-29 | 2020-05-21 | Tdk株式会社 | Coil unit, and power transmission device, power receiving device and wireless power transmission system including the coil unit |
| JP2020088127A (en) * | 2018-11-22 | 2020-06-04 | ヤマハ株式会社 | Electrical component and electrical equipment |
| WO2021199261A1 (en) * | 2020-03-31 | 2021-10-07 | 太陽誘電株式会社 | Component module |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6350007A (en) * | 1986-08-19 | 1988-03-02 | Nec Corp | Low-noise transformer provided with heat releasing plate |
| JPH03124007A (en) * | 1989-10-06 | 1991-05-27 | Furukawa Electric Co Ltd:The | Heat dissipation structure of transformer or choke coil |
-
1991
- 1991-06-04 JP JP1991041180U patent/JP2589697Y2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6350007A (en) * | 1986-08-19 | 1988-03-02 | Nec Corp | Low-noise transformer provided with heat releasing plate |
| JPH03124007A (en) * | 1989-10-06 | 1991-05-27 | Furukawa Electric Co Ltd:The | Heat dissipation structure of transformer or choke coil |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001308573A (en) * | 2000-04-24 | 2001-11-02 | Kitagawa Ind Co Ltd | Covering case of electronic component and covering method thereof |
| JP2002208521A (en) * | 2001-01-11 | 2002-07-26 | Denso Corp | Smoothing coil for smoothing large current |
| JP2003347783A (en) * | 2002-05-31 | 2003-12-05 | Mitsubishi Electric Corp | Power conversion apparatus |
| JP2008016641A (en) * | 2006-07-06 | 2008-01-24 | Tamagawa Seiki Co Ltd | Short ring |
| JP2011009418A (en) * | 2009-06-25 | 2011-01-13 | Cosel Co Ltd | Insulating transformer for switching power supply device |
| JP2011108916A (en) * | 2009-11-19 | 2011-06-02 | Cosel Co Ltd | Isolation transformer |
| US9406429B2 (en) | 2012-06-05 | 2016-08-02 | Technova Inc. | Contactless power transfer transformer |
| JPWO2013183665A1 (en) * | 2012-06-05 | 2016-02-01 | 国立大学法人埼玉大学 | Contactless power transformer |
| WO2013183665A1 (en) * | 2012-06-05 | 2013-12-12 | 国立大学法人 埼玉大学 | Contactless feeding transformer |
| JP2017103461A (en) * | 2012-06-05 | 2017-06-08 | 国立大学法人埼玉大学 | Non-contact feeding transformer |
| JP6261689B1 (en) * | 2016-09-09 | 2018-01-17 | 三菱電機株式会社 | Power converter |
| JP2018041901A (en) * | 2016-09-09 | 2018-03-15 | 三菱電機株式会社 | Power converter |
| JP2019030089A (en) * | 2017-07-27 | 2019-02-21 | Tdk株式会社 | Coil unit, and power transmission device, power reception device, and wireless power transmission system using coil unit |
| JP2019029461A (en) * | 2017-07-27 | 2019-02-21 | Tdk株式会社 | Coil unit, and power transmission device, power reception device, and wireless power transmission system using coil unit |
| JP2019153757A (en) * | 2018-03-06 | 2019-09-12 | Tdk株式会社 | Surface-mount coil device and electronic equipment |
| JP2020088127A (en) * | 2018-11-22 | 2020-06-04 | ヤマハ株式会社 | Electrical component and electrical equipment |
| JP2020078245A (en) * | 2020-01-29 | 2020-05-21 | Tdk株式会社 | Coil unit, and power transmission device, power receiving device and wireless power transmission system including the coil unit |
| WO2021199261A1 (en) * | 2020-03-31 | 2021-10-07 | 太陽誘電株式会社 | Component module |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2589697Y2 (en) | 1999-02-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 19970729 |
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| LAPS | Cancellation because of no payment of annual fees |