JPH03266493A - Hybrid laminated circuit device and hybrid laminated circuit component - Google Patents
Hybrid laminated circuit device and hybrid laminated circuit componentInfo
- Publication number
- JPH03266493A JPH03266493A JP2065755A JP6575590A JPH03266493A JP H03266493 A JPH03266493 A JP H03266493A JP 2065755 A JP2065755 A JP 2065755A JP 6575590 A JP6575590 A JP 6575590A JP H03266493 A JPH03266493 A JP H03266493A
- Authority
- JP
- Japan
- Prior art keywords
- laminated
- hybrid
- laminated circuit
- passive composite
- hybrid laminated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002131 composite material Substances 0.000 claims abstract description 39
- 239000002470 thermal conductor Substances 0.000 claims abstract description 23
- 239000002184 metal Substances 0.000 claims abstract description 9
- 229910052751 metal Inorganic materials 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims description 29
- 239000000696 magnetic material Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 abstract description 33
- 239000003990 capacitor Substances 0.000 abstract description 16
- 239000000463 material Substances 0.000 abstract description 4
- 239000011347 resin Substances 0.000 abstract description 2
- 229920005989 resin Polymers 0.000 abstract description 2
- 229910052573 porcelain Inorganic materials 0.000 abstract 2
- 150000001875 compounds Chemical class 0.000 abstract 1
- 229920001296 polysiloxane Polymers 0.000 abstract 1
- 238000004804 winding Methods 0.000 description 13
- 230000017525 heat dissipation Effects 0.000 description 7
- 239000000919 ceramic Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 230000010354 integration Effects 0.000 description 5
- 230000005855 radiation Effects 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 230000020169 heat generation Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Landscapes
- Coils Or Transformers For Communication (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、コイル層を含む積層受動複合体の一方の面上
に能動回路部品を搭載した面実装型の混成積層回路部品
及びこれと基板とを組合せた混成積層回路装置に関し、
基板と積層受動複合体との間の段差を埋める熱伝導体を
設けることにより、コイル層または能動回路部品で発生
する熱を、熱伝導体を介して基板に熱伝導することによ
り放熱し、発熱による温度特性変化を防止すると共に、
更に小型化または高集積化した混成積層回路装置、及び
、これを構成するのに適した混成積層回路部品を提供で
きるようにしたものである。[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to a surface-mount type hybrid laminated circuit component in which an active circuit component is mounted on one side of a laminated passive composite body including a coil layer, and a substrate. Regarding a hybrid laminated circuit device that combines
By providing a thermal conductor that fills the step between the substrate and the laminated passive composite, the heat generated in the coil layer or active circuit components is conducted to the substrate via the thermal conductor, dissipating the heat and generating heat. In addition to preventing changes in temperature characteristics caused by
Furthermore, it is possible to provide a compact or highly integrated hybrid laminated circuit device and hybrid laminated circuit components suitable for constructing the same.
〈従来の技術〉
従来、面実装型の混成積層回路装置は、実開昭６３−３
１５４７号公報の第５図に見られるように、混成積層回
路部品で発生する熱を、表面からの熱放射または縁部に
設けた接続端子を介して基板のランドへの熱伝導によっ
て放熱している。<Prior art> Conventionally, a surface-mount type hybrid laminated circuit device was developed in U.S. Pat.
As shown in Figure 5 of Publication No. 1547, the heat generated in the hybrid laminated circuit component is radiated by heat radiation from the surface or by heat conduction to the land of the board via the connection terminal provided at the edge. There is.
〈発明が解決しようとするｐｓｍ＞
この種の混成積層回路装置及び混成積層回路部品の目的
の一つは、コイル、抵抗等の受動部品とＩＣ、トランジ
スタ等の能動回路部品とを組合せて高集積化、高機能化
を図ることである。高集積化すると特定の回路素子の発
熱が他の回路素子の温度特性に影響を与え、混成積層回
路部品としての温度特性が問題となり、混成積層回路装
置及び混成積層回路部品の小型化を阻む、ＤＣ−ＤＣコ
ンバータの制御回路のようにコイル部品を使用し、電力
を扱う場合は特に顕著である。<PSM to be solved by the invention> One of the purposes of this type of hybrid laminated circuit device and hybrid laminated circuit components is to achieve high integration by combining passive components such as coils and resistors with active circuit components such as ICs and transistors. The objective is to improve the functionality and functionality of the system. As integration increases, the heat generated by a specific circuit element affects the temperature characteristics of other circuit elements, and the temperature characteristics of hybrid laminated circuit components become a problem, hindering miniaturization of hybrid laminated circuit devices and hybrid laminated circuit components. This is particularly noticeable when using coil components and handling electric power, such as in the control circuit of a DC-DC converter.
実開昭６３−３１５４７号公報に見られる従来技術では
、その′ｉＪ５図に示すように、混成積層回路部品と基
板との間は、接続端子の厚みによる段差及び空洞が生じ
ている。このため、基板への熱伝導ができず、混成積層
回路部品の放熱特性も悪くなっている。In the prior art disclosed in Japanese Utility Model Application Publication No. 63-31547, as shown in Figure 'iJ5, a step and a cavity are created between the hybrid laminated circuit component and the board due to the thickness of the connection terminal. Therefore, heat cannot be conducted to the substrate, and the heat dissipation characteristics of the hybrid laminated circuit component are also deteriorated.
そこで、本発明の課題は、上述した従来の問題点を解決
し、特定の素子の発熱による温度特性変化を防止した混
成積層回路装置、及び、混成積層回路装置を構成するの
に適した小型、かつ、高集積度の混成積層回路部品を提
供することである。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a hybrid laminated circuit device that solves the above-mentioned conventional problems and prevents changes in temperature characteristics due to heat generation of specific elements, and a compact and compact device suitable for configuring the hybrid laminated circuit device. Another object of the present invention is to provide a highly integrated hybrid laminated circuit component.
く課題を解決するための手段〉
上述した課題解決のため、本発明は、混成積層回路部品
と、前記混成積層回路部品を実装する基板とを有する混
成積層回路装置であって、前記混成積層回路装置は、コ
イル層を含む積層受動複合体と、能動回路部品と、接続
端子とを有しており、
前記コイル層は、磁性体中に埋設された一つまたは複数
のコイルを有しており、
前記積層受動複合体は、一方の面上に前記能動回路部品
を搭載しており、
前記接続端子は、前記積層受動複合体の縁部に一方の面
から他方の面に亙って設けられていて、前記積層受動複
合体との間に段差を形成しており、
前記基板と前記積層受動複合体との間に前記段差を埋め
る熱伝導体を有すること
を特徴とする。Means for Solving the Problems> In order to solve the above-mentioned problems, the present invention provides a hybrid laminated circuit device having a hybrid laminated circuit component and a substrate on which the hybrid laminated circuit component is mounted, The device has a laminated passive composite including a coil layer, an active circuit component, and a connecting terminal, the coil layer having one or more coils embedded in a magnetic material. , the laminated passive composite has the active circuit component mounted on one surface, and the connection terminal is provided at an edge of the laminated passive composite from one surface to the other surface. and a step is formed between the substrate and the laminated passive composite, and a thermal conductor is provided between the substrate and the laminated passive composite to fill the step.
また、本発明に係る混成積層回路部品は、コイル層を含
む積層受動複合体が、接続端子と積層受動複合体の面と
の間に生じる段差を埋める熱伝導体を有することを特徴
とする。Further, the hybrid laminated circuit component according to the present invention is characterized in that the laminated passive composite body including the coil layer has a heat conductor that fills a step created between the connection terminal and the surface of the laminated passive composite body.
〈作用〉
積層受動複合体のコイル層は、磁性体中に埋設された一
つまたは複数のコイルを有しており、鉄損及び銅損のた
め内部から発熱する。積層受動複合体の一方の面上に搭
載された能動回路部品も自己の消費電力で発熱する。こ
れらの熱の一部は、それぞれの素子の表面からの熱放射
または縁部の接続端子を介して基板への熱伝導によフて
放出される。<Operation> The coil layer of the laminated passive composite has one or more coils embedded in a magnetic material, and generates heat from within due to iron loss and copper loss. Active circuit components mounted on one side of the laminated passive composite also generate heat due to their own power consumption. Some of this heat is dissipated by radiation from the surface of each element or by conduction to the substrate via the connection terminals at the edges.
接続端子は、積層受動複合体の縁部に一方の面から他方
の面に亙って設けられているので、積層受動複合体との
間に段差が生じる。熱伝導体は、この段差による空洞を
埋めるように構成しであるので、コイル層で発生した熱
は熱伝導体を介して基板に熱伝導される。これによフて
、コイル層の温度上昇が抑止され、能動回路部品の熱が
コイル層に熱伝導されるようになるので、能動回路部品
の温度上昇も抑止される。Since the connection terminal is provided at the edge of the laminated passive composite from one surface to the other, a step is created between the connection terminal and the laminated passive composite. Since the thermal conductor is configured to fill the cavity created by this step, the heat generated in the coil layer is thermally conducted to the substrate via the thermal conductor. As a result, the temperature rise of the coil layer is suppressed, and the heat of the active circuit components is thermally conducted to the coil layer, so that the temperature rise of the active circuit components is also suppressed.
従って、混成積層回路部品からの放熱特性が改善され、
温度上昇による特性変化を防止した混成積層回路装置を
提供できると共に、更に小型化または高集積化した混成
積層回路装置を提供できる。Therefore, the heat dissipation characteristics from the hybrid laminated circuit components are improved,
It is possible to provide a hybrid laminated circuit device that prevents changes in characteristics due to temperature rise, and also to provide a hybrid laminated circuit device that is more compact or highly integrated.
また、熱伝導体は段差によって混成積層回路部品と基板
との間に生ずる空洞を埋め、熱伝導をさせるものである
から、熱伝導体を混成積層回路部品側に設けても、基板
側に設けても同様の作用効果を有する混成積層回路装置
が得られる。In addition, the thermal conductor fills the cavity created between the hybrid laminated circuit component and the board due to the step difference, and conducts heat. However, a hybrid laminated circuit device having similar effects can be obtained.
更に、積層受動複合体に段差を埋める熱伝導体を設けた
混成積層複合部品においては、混成積層回路部品を基板
に実装した場合に、基板と積層受動複合体との間に形成
される空洞が埋められる。Furthermore, in a hybrid laminated composite component in which a thermal conductor is provided to fill the steps in the laminated passive composite, when the hybrid laminated circuit component is mounted on a board, a cavity is formed between the board and the laminated passive composite. Buried.
従って、放熱特性が改善され、かつ、実装性の優れた、
混成積層回路装置を構成するのに通した混成積層回路部
品を提供できる。Therefore, it has improved heat dissipation characteristics and is easy to mount.
A hybrid laminated circuit component that can be used to construct a hybrid laminated circuit device can be provided.
熱伝導体の全体を金属層で構成するのが理想であるが、
表面を金属層で構成することによっても、基板への熱伝
導及びコイル層または基板への熱拡散ができる。Ideally, the entire thermal conductor should be composed of a metal layer, but
Constructing the surface with a metal layer also allows heat conduction to the substrate and heat diffusion to the coil layer or substrate.
〈実施例〉
第１図は本発明に係る第１の実施例である混成積層回路
装置の実装状態を示す断面図、’ｔｓ２図はそれに実装
された混成積層回路部品の平面図、第３図はその積層構
造を示す断面図、第４図はその回路図である。′ｉ４４
図は本発明の適用可能なりＣ−ＤＣコンバタータの回路
例を示している。<Example> Fig. 1 is a sectional view showing the mounted state of a hybrid laminated circuit device according to a first embodiment of the present invention, Fig. 2 is a plan view of a hybrid laminated circuit component mounted thereon, and Fig. 3 is a cross-sectional view showing its laminated structure, and FIG. 4 is its circuit diagram. 'i44
The figure shows a circuit example of a C-DC converter to which the present invention can be applied.
回路動作は当業者にとって周知であるので、説明は省略
する。図において、１はコイル層、２はコンデンサ層、
３は抵抗体層である。コイル層１、コンデンサ層２及び
抵抗体層３は積層受動複合体を構成している。４１〜４
５は能動回路部品、５は接続端子、６は熱伝導体、８は
基板である。The circuit operation is well known to those skilled in the art and will not be described further. In the figure, 1 is a coil layer, 2 is a capacitor layer,
3 is a resistor layer. Coil layer 1, capacitor layer 2 and resistor layer 3 constitute a laminated passive composite. 41-4
5 is an active circuit component, 5 is a connection terminal, 6 is a heat conductor, and 8 is a substrate.
コイル層１は、フェライト等の磁性体１０の内部にコイ
ル１１〜１６を埋設した構造となっている。コイル１１
〜１６の巻回数、個数及び接続関係は要求される回路構
成に応じて任意に選定される。例えば、コイル１１とコ
イル１３を直列に接続してトランス１００の１次側コイ
ルとし、コイル１２、コイル１４をトランス１００の２
次側コイルとするようにである。コイル１１〜１６は接
続端子５の何れかに接続されて外部に引出される。The coil layer 1 has a structure in which coils 11 to 16 are embedded inside a magnetic material 10 such as ferrite. coil 11
The number of turns, number, and connection relationship of 16 to 16 are arbitrarily selected depending on the required circuit configuration. For example, coil 11 and coil 13 are connected in series to form the primary coil of transformer 100, and coil 12 and coil 14 are connected in series to form the primary coil of transformer 100.
As with the next coil. The coils 11 to 16 are connected to any of the connection terminals 5 and drawn out.
コンデンサ層２は、誘電体磁器２ｏの内部にコンデンサ
ネットワーク２１〜２７を埋設した構造となフている。The capacitor layer 2 has a structure in which capacitor networks 21 to 27 are embedded inside a dielectric ceramic 2o.
′ｔＳ１図にはそのうち２つが図示されている。コンデ
ンサネットワーク２１〜２７は、誘電体磁器層を介して
電極を対向させて形成されたコンデンサを、所要のコン
デンサ回路を構成するように接続することによって構成
されている。コンデンサネットワーク２１〜２７のそれ
ぞれの回路構成は、用途に応じて任意に選択される。こ
れらのコンデンサネットワーク２１〜２７は接続端子５
の何れかに接続されて外部に引出される。Two of them are shown in the 'tS1 diagram. The capacitor networks 21 to 27 are constructed by connecting capacitors formed with electrodes facing each other via dielectric ceramic layers to form a required capacitor circuit. The circuit configuration of each of the capacitor networks 21 to 27 is arbitrarily selected depending on the application. These capacitor networks 21 to 27 are connected to the connection terminals 5
It is connected to one of the following and pulled out to the outside.
抵抗体層３は、誘電体磁器上に厚膜抵抗３１〜３５が印
刷により形成されている。第１図にはそのうち１つが図
示されている。The resistor layer 3 includes thick film resistors 31 to 35 formed by printing on dielectric ceramic. One of them is illustrated in FIG.
能動回路部品である制御ＩＣ４１、トランジスタ４２、
ダイオード４３〜４５は抵抗体層３と共に、誘電体磁器
上に搭載され、他の回路部品と第４図に示すように接続
されている。A control IC 41, a transistor 42, which are active circuit components,
The diodes 43 to 45 are mounted on the dielectric ceramic together with the resistor layer 3, and are connected to other circuit components as shown in FIG.
接続端子５は、積層受動複合体の各層間の接続及び外部
との接続のため、積層受動複合体の縁部に一方の面から
他方の面に互って設けられており、積層受動複合体のコ
イル層１との間に、その厚み部の段差Ｇｌを生じている
。The connection terminals 5 are provided at the edge of the laminated passive composite from one side to the other for connection between each layer of the laminated passive composite and for connection with the outside. A step Gl is generated in the thickness portion between the coil layer 1 and the coil layer 1.
熱伝導体６は、段差Ｇ１により、基板８と前記積層受動
複合体のコイル層１との間に形成される空洞を埋めるも
のであり、金属等の電気的な導体材料、シリコン・コン
パウンド等の熱伝導性の良い樹脂材料等が用いられてい
る。The thermal conductor 6 fills the cavity formed between the substrate 8 and the coil layer 1 of the laminated passive composite due to the step G1, and is made of an electrically conductive material such as metal, silicon compound, etc. A resin material with good thermal conductivity is used.
基板８は誘電体磁器またはガラスエポキシ等の材料基板
の上に導体で形成されたランド８１及び８２、導体部８
３及び回路パターン（図示せず）を有している。The substrate 8 includes lands 81 and 82 formed of a conductor on a material substrate such as dielectric ceramic or glass epoxy, and a conductor portion 8.
3 and a circuit pattern (not shown).
本実施例ではコイル１１〜１６、制御ＩＣ４１、トラン
ジスタ４２及びダイオード４３〜４５が多く発熱する。In this embodiment, the coils 11 to 16, the control IC 41, the transistor 42, and the diodes 43 to 45 generate a lot of heat.
特にトランス１００を構成するコイル１１〜１４は鉄損
及び銅損により発熱する。このため、コイル層１は基板
８に最も近くなるように構成しである。この熱は、接続
端子５及び半田７を介して基板８のランド８１．８２へ
の熱伝導またはコイル層１の表面からの熱放射によって
放出される。In particular, the coils 11 to 14 forming the transformer 100 generate heat due to iron loss and copper loss. For this reason, the coil layer 1 is configured to be closest to the substrate 8. This heat is released by conduction to the lands 81, 82 of the substrate 8 via the connection terminals 5 and the solder 7, or by heat radiation from the surface of the coil layer 1.
また、制御ＩＣ４１等の能動回路部品も自己の消費電力
により発熱する。この熱も、接続端子５及び半田７を介
して基板８のランド８１．８２への熱伝導または各部品
の表面からの熱放射によって放出される。Furthermore, active circuit components such as the control IC 41 also generate heat due to their own power consumption. This heat is also released by heat conduction to the lands 81, 82 of the board 8 via the connection terminals 5 and solder 7, or by heat radiation from the surfaces of each component.
更に、熱伝導体６が、基板８の導体部８３と接触してい
るので、コイル層１で発生した熱は導体部８３へ熱伝導
体６を介して熱伝導される。特に、混成積層回路部品が
集積化されて表面積が小さくなり、熱放射による放熱は
期待できなくなった場合でも、熱伝導体６によって有効
に放熱できるので、集積度を上げることが可能になる。Furthermore, since the heat conductor 6 is in contact with the conductor portion 83 of the substrate 8, the heat generated in the coil layer 1 is thermally conducted to the conductor portion 83 via the heat conductor 6. In particular, even when hybrid laminated circuit components are integrated and their surface areas become smaller and heat radiation cannot be expected to be radiated, the thermal conductor 6 can effectively radiate heat, making it possible to increase the degree of integration.
熱伝導体６は、基板８へ多くの熱伝導をさせるため、導
体部８３をできるだけ広くとることが望ましい。これに
よフて、コイル層１の温度上昇が少なくなり、能動部品
４１〜４５で発生する熱もコイル層！へ熱伝導される割
合が大きくなるので、能動回路部品４１〜４５の温度上
昇も少なくできる。また、基板８に導体部８３を設けな
い場合、その分を熱伝導体６で隙間を補ってやれば、基
板８への熱伝導を確保で包る。In order for the heat conductor 6 to conduct a large amount of heat to the substrate 8, it is desirable to make the conductor portion 83 as wide as possible. As a result, the temperature rise in the coil layer 1 is reduced, and the heat generated in the active parts 41 to 45 is also reduced in the coil layer! Since the rate of heat conduction to the active circuit components 41 to 45 increases, the temperature rise in the active circuit components 41 to 45 can also be reduced. Further, when the conductor portion 83 is not provided on the substrate 8, the heat conduction to the substrate 8 can be ensured by filling the gap with the thermal conductor 6.
これによって、混成積層回路部品の放熱特性が改善され
、発熱による温度特性変化を防止した混成積層回路装置
を提供できると共に、更に小型化または高集積化した混
成積層回路装置を提供できる。As a result, the heat dissipation characteristics of the hybrid laminated circuit component are improved, and it is possible to provide a hybrid laminated circuit device that prevents changes in temperature characteristics due to heat generation, and it is also possible to provide a hybrid laminated circuit device that is more compact or highly integrated.
第５図は、第１図に示すコイル１１〜１６のコイルの巻
方の１例を示す図である。FIG. 5 is a diagram showing an example of how the coils 11 to 16 shown in FIG. 1 are wound.
コイル導体１１１．１１２は、巻軸方向０に変位する螺
旋状となっていて、各巻軸が互いの巻径面内に位置する
ように配置されている。The coil conductors 111 and 112 have a spiral shape that is displaced in the winding axis direction 0, and are arranged such that each winding axis is located within the winding diameter plane of each other.
また、コイル導体１１１の巻方向ａ、とコイル導体１１
２の巻方向す、とは、同一の巻軸方向０で見て、互いに
逆になっている。即ち、巻軸方向Ｏで見て、コイル導体
１１１の巻方向ａ１は時計方向であり、コイル導体１１
２の巻方向す、は反時計方向である。Further, the winding direction a of the coil conductor 111 and the winding direction a of the coil conductor 11
The winding directions S and 2 are opposite to each other when viewed from the same winding axis direction 0. That is, when viewed from the winding axis direction O, the winding direction a1 of the coil conductor 111 is clockwise, and the winding direction a1 of the coil conductor 11
The winding direction of No. 2 is counterclockwise.
コイル４体１１１．１１２は、コイル電流により同一方
向の磁界を生じるように、接続部１１３によって互いに
接続されている。コイル導体１１１の巻方向とコイル導
体１１２の巻方向とは、互いに逆になっているので、コ
イル１１１の終端部と、コイル導体１１２始端部とを接
続部１１３によって互いに接続した場合、コイル導体１
１１．１１２により、電流方向が同一のコイルが形成さ
れ、同一方向の磁界を生じる。従って、同一のコイル長
に対して倍のＳ回数のコイルが得られ、集積度も倍にで
きる。このようにコイルの集積度を上げた場合、コイル
層１の発熱も増加するので、本発明は更に効果的となる
。The four coils 111 and 112 are connected to each other by a connecting portion 113 so that the coil current generates a magnetic field in the same direction. Since the winding direction of the coil conductor 111 and the winding direction of the coil conductor 112 are opposite to each other, when the terminal end of the coil 111 and the start end of the coil conductor 112 are connected to each other by the connecting part 113, the coil conductor 1
11 and 112, coils with the same current direction are formed, producing magnetic fields in the same direction. Therefore, for the same coil length, twice as many coils as S can be obtained, and the degree of integration can also be doubled. When the degree of integration of the coils is increased in this way, the heat generation of the coil layer 1 also increases, making the present invention even more effective.
第６図は本発明の３４２の実施例に係る混成積層型回路
装置の好適な実装状態を示す断面図である。第１図と同
一参照符号は同一性のある構成部品を示す。これは、熱
伝導体６を基板８側に設けた実施例である。本実施例で
は、熱伝導体６を誘電体磁器基板上に電気的な導体材料
を厚膜印刷により形成しているが、蒸着、スパッタ、メ
ツキ等で形成してもよい。更に、エポキシ基板上に金属
の導体層を接着等の手段を用いて形成してもよい。この
基板８に混成積層回路部品を実装すると、第１の実施例
と同様の実装状態になるので、同様の効果が得られる。FIG. 6 is a sectional view showing a preferred mounting state of the hybrid stacked circuit device according to the 342nd embodiment of the present invention. The same reference numerals as in FIG. 1 indicate identical components. This is an example in which the thermal conductor 6 is provided on the substrate 8 side. In this embodiment, the thermal conductor 6 is formed by thick film printing of an electrically conductive material on a dielectric ceramic substrate, but it may also be formed by vapor deposition, sputtering, plating, etc. Furthermore, a metal conductor layer may be formed on the epoxy substrate using means such as adhesion. When the hybrid laminated circuit component is mounted on this board 8, the mounting state is similar to that of the first embodiment, so that the same effect can be obtained.
第７図は第３の実施例に係る混成積層回路装置の部品と
して好適な混成積層回路部品の断面図である。第１図と
同一参照符号は同一性のある構成部品を示す。これは、
第１の実施例における熱伝導体６を積層受動複合体のコ
イル層１の他方の面に設けたものである。本実施例では
、熱伝導体６を、電気的な導体材料を厚膜印刷すること
により形成しているが、蒸着、スパッタ、メツキ等で形
成してもよい、更に、金属の薄板を接着剤で接着しても
よい。本実施例の混成積層回路部品を基板８に実装すれ
ば、３４１の実施例と同様の状態になるので、同様の効
果が得られる。FIG. 7 is a sectional view of a hybrid laminated circuit component suitable as a component of a hybrid laminated circuit device according to the third embodiment. The same reference numerals as in FIG. 1 indicate identical components. this is,
The heat conductor 6 in the first embodiment is provided on the other surface of the coil layer 1 of the laminated passive composite. In this embodiment, the thermal conductor 6 is formed by thick film printing of an electrically conductive material, but it may also be formed by vapor deposition, sputtering, plating, etc. You can also glue it with If the hybrid laminated circuit component of this embodiment is mounted on the board 8, it will be in the same state as the embodiment No. 341, and the same effects can be obtained.
従って、混成積層回路部品からの放熱特性が改善され、
かつ、実装性の優れた、混成積層回路装置を構成するの
に適した混成積層回路部品を提供できる。Therefore, the heat dissipation characteristics from the hybrid laminated circuit components are improved,
Moreover, it is possible to provide a hybrid laminated circuit component suitable for configuring a hybrid laminated circuit device that has excellent mounting performance.
更に、積層受動複合体のコイル層１を構成する磁性体に
突起部を設け、熱伝導体６の代りとしてもよい。この場
合でも、空洞部をなくすことができるので熱伝導性が向
上する。接続端子５と積層受動複合体とが形成する段差
Ｇ１が小さいときには有効である。Furthermore, a protrusion may be provided on the magnetic material constituting the coil layer 1 of the laminated passive composite body in place of the heat conductor 6. Even in this case, since the cavity can be eliminated, thermal conductivity is improved. This is effective when the step G1 formed between the connection terminal 5 and the laminated passive composite body is small.
上記の各実施例において、熱伝導体６の全体を金属層で
構成するのが理想であるが、表面を金属層で構成するこ
とによっても、基板８への熱伝導及びコイル層１または
基板８への熱拡散ができるので効果的である。In each of the above embodiments, it is ideal that the entire heat conductor 6 is made of a metal layer, but it is also possible to make the surface of the heat conductor 6 a metal layer to improve heat conduction to the substrate 8 and the coil layer 1 or the substrate 8. This is effective because it allows heat to diffuse to the surrounding area.
〈発明の効果〉
以上述べたように、本発明によれば、次のような効果が
得られる。<Effects of the Invention> As described above, according to the present invention, the following effects can be obtained.
（ａ）混成積層回路部品と基板との間に形成される段差
による空洞を熱伝導体により埋めるようにしたので、コ
イル層及び能動回路部品で発生する熱は、熱伝導体を介
して基板へ熱伝導される。(a) Since the cavity created by the step formed between the hybrid laminated circuit component and the board is filled with a heat conductor, the heat generated in the coil layer and active circuit components is transferred to the board via the heat conductor. Heat is conducted.
従フて、コイル層等の発熱素子の放熱が容易になり、混
成積層回路部品の温度上昇が少なくなるので、発熱によ
る温度特性変化を防止した混成積層回路装置を提供でき
る。Therefore, heat dissipation from heating elements such as coil layers is facilitated, and the temperature rise of hybrid laminated circuit components is reduced, so that it is possible to provide a hybrid laminated circuit device that prevents changes in temperature characteristics due to heat generation.
（ｂ）混成積層回路部品の温度上昇が少なくなるので、
更に小型化または高集積化した混成積層回路部品の使用
が可能となり、結果として、小型、かつ、高機能化した
混成積層回路装置が提供できる。(b) Since the temperature rise of hybrid laminated circuit components is reduced,
Furthermore, it becomes possible to use hybrid laminated circuit components that are more compact or highly integrated, and as a result, a compact and highly functional hybrid laminated circuit device can be provided.
（ｃ）混成積層回路部品に熱伝導体を設けたので、放熱
特性及び実装性が優れ、かつ、混成積層回路装置を構成
するのに適した混成積層回路部品を提供できる。(c) Since the heat conductor is provided in the hybrid laminated circuit component, it is possible to provide a hybrid laminated circuit component that has excellent heat dissipation characteristics and mounting properties and is suitable for constructing a hybrid laminated circuit device.
第１図は本発明に係る第１の実施例である混成積層回路
装置の実装状態を示す断面図、３４２図はそれに実装さ
れた混成積層回路部品の平面図、第３図はその積層構造
を示す断面図、第４図はその回路図、第５図は第１図に
示すコイル１１〜１６のコイルの巻方の１例を示す図、
第６図は本発明の第２の実施例に係る混成積層型回路装
置の好適な実装状態を示す断面図、第７図は第３の実施
例に係る混成積層回路装置の部品として好適な混成積層
回路部品の断面図である。
１・・・コイル層 ２・・・コンデンサ層・・・抵
抗体層
１〜４５・・・能動回路部品
・・・接続端子 ６・・・熱伝導体・・・基板
第
１
第
図
第
図
へ
第
図
第
しＩ
１FIG. 1 is a cross-sectional view showing the mounted state of a hybrid laminated circuit device according to a first embodiment of the present invention, FIG. 342 is a plan view of a hybrid laminated circuit component mounted thereon, and FIG. 4 is a circuit diagram thereof, FIG. 5 is a diagram showing an example of how to wind the coils 11 to 16 shown in FIG. 1,
FIG. 6 is a sectional view showing a preferred mounting state of a hybrid laminated circuit device according to a second embodiment of the present invention, and FIG. 7 is a cross-sectional view showing a preferred mounting state of a hybrid laminated circuit device according to a third embodiment of the present invention. FIG. 3 is a cross-sectional view of a laminated circuit component. 1... Coil layer 2... Capacitor layer... Resistor layer 1 to 45... Active circuit component... Connection terminal 6... Heat conductor... Substrate 1 Go to Figure 1 Figure No. I 1
Claims (7)
装する基板とを有する混成積層回路装置であって、 前記混成積層回路部品は、コイル層を含む積層受動複合
体と、能動回路部品と、接続端子とを有しており、 前記コイル層は、磁性体中に埋設された一つ又は複数の
コイルを有しており、 前記積層受動複合体は、一方の面上に前記能動回路部品
を搭載しており、 前記接続端子は、前記積層受動複合体の縁部に一方の面
から他方の面に亙って設けられていて、前記積層受動複
合体との間に段差を形成しており、 前記基板と前記積層受動複合体との間に前記段差を埋め
る熱伝導体を有すること を特徴とする混成積層回路装置。(1) A hybrid laminated circuit device comprising a hybrid laminated circuit component and a board on which the hybrid laminated circuit component is mounted, the hybrid laminated circuit component comprising a laminated passive composite including a coil layer and an active circuit component. , and connection terminals, the coil layer has one or more coils embedded in a magnetic material, and the laminated passive composite has the active circuit component on one side. The connecting terminal is provided at the edge of the laminated passive composite from one surface to the other surface, and the connecting terminal is provided with a step between the laminated passive composite and the laminated passive composite. A hybrid laminated circuit device, further comprising a thermal conductor that fills the step between the substrate and the laminated passive composite.
に設けられていることを特徴とする請求項１に記載の混
成積層回路装置。(2) The hybrid laminated circuit device according to claim 1, wherein the thermal conductor is provided on the other surface of the laminated passive composite.
とする請求項１に記載の混成積層回路装置。(3) The hybrid laminated circuit device according to claim 1, wherein the thermal conductor is provided on the substrate side.
請求項１、２または３に記載の混成積層回路装置。(4) The hybrid laminated circuit device according to claim 1, 2 or 3, wherein the thermal conductor includes a metal layer.
と、接続端子とを有する混成積層回路部品であって、 前記コイル層は、磁性体中に埋設された一つ又は複数の
コイルを有しており、 前記積層受動複合体は、一方の面上に前記能動回路部品
を搭載しており、 前記接続端子は、前記積層受動複合体の縁部に一方の面
から他方の面に亙って設けられていて、前記積層受動複
合体との間に段差を形成しており、 前記積層受動複合体は、前記他方の面に前記段差を埋め
る熱伝導体を有すること を特徴とする混成積層回路部品。(5) A hybrid laminated circuit component having a laminated passive composite including a coil layer, an active circuit component, and a connection terminal, wherein the coil layer includes one or more coils embedded in a magnetic material. The laminated passive composite has the active circuit component mounted on one surface, and the connection terminal is provided at an edge of the laminated passive composite from one surface to the other surface. and a step is formed between the layered passive composite and the layered passive composite, and the layered passive composite has a thermal conductor on the other surface that fills the step. Laminated circuit components.
あることを特徴とする請求項５に記載の混成積層回路部
品。(6) The hybrid laminated circuit component according to claim 5, wherein the thermal conductor is a part of the laminated passive composite.
請求項５または６に記載の混成積層回路部品。(7) The hybrid laminated circuit component according to claim 5 or 6, wherein the thermal conductor includes a metal layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2065755A JP2892089B2 (en) | 1990-03-16 | 1990-03-16 | Hybrid multilayer circuit device and hybrid multilayer circuit component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2065755A JP2892089B2 (en) | 1990-03-16 | 1990-03-16 | Hybrid multilayer circuit device and hybrid multilayer circuit component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03266493A true JPH03266493A (en) | 1991-11-27 |
| JP2892089B2 JP2892089B2 (en) | 1999-05-17 |
Family
ID=13296164
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2065755A Expired - Fee Related JP2892089B2 (en) | 1990-03-16 | 1990-03-16 | Hybrid multilayer circuit device and hybrid multilayer circuit component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2892089B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003034494A1 (en) * | 2001-10-15 | 2003-04-24 | Matsushita Electric Industrial Co., Ltd. | Module component |
| JP2009049046A (en) * | 2007-08-13 | 2009-03-05 | Tdk Corp | Electronic component module |
| CN110831355A (en) * | 2020-01-13 | 2020-02-21 | 智恩电子(大亚湾)有限公司 | Preparation method of printed circuit board of 5G base station coupler |
| JP2020088127A (en) * | 2018-11-22 | 2020-06-04 | ヤマハ株式会社 | Electrical component and electrical equipment |
-
1990
- 1990-03-16 JP JP2065755A patent/JP2892089B2/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003034494A1 (en) * | 2001-10-15 | 2003-04-24 | Matsushita Electric Industrial Co., Ltd. | Module component |
| US6828670B2 (en) | 2001-10-15 | 2004-12-07 | Matsushita Electric Industrial Co., Ltd. | Module component |
| CN100382309C (en) * | 2001-10-15 | 2008-04-16 | 松下电器产业株式会社 | Molecule component |
| JP2009049046A (en) * | 2007-08-13 | 2009-03-05 | Tdk Corp | Electronic component module |
| JP2020088127A (en) * | 2018-11-22 | 2020-06-04 | ヤマハ株式会社 | Electrical component and electrical equipment |
| CN110831355A (en) * | 2020-01-13 | 2020-02-21 | 智恩电子(大亚湾)有限公司 | Preparation method of printed circuit board of 5G base station coupler |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2892089B2 (en) | 1999-05-17 |
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