JP2892090B2 - Multilayer composite circuit device and multilayer composite circuit component - Google Patents
Multilayer composite circuit device and multilayer composite circuit componentInfo
- Publication number
- JP2892090B2 JP2892090B2 JP2065756A JP6575690A JP2892090B2 JP 2892090 B2 JP2892090 B2 JP 2892090B2 JP 2065756 A JP2065756 A JP 2065756A JP 6575690 A JP6575690 A JP 6575690A JP 2892090 B2 JP2892090 B2 JP 2892090B2
- Authority
- JP
- Japan
- Prior art keywords
- composite circuit
- layer
- multilayer composite
- coil
- coil layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Coils Or Transformers For Communication (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【発明の詳細な説明】 <産業上の利用分野> 本発明は、コイル層を含む積層複合回路部品及びこれ
と基板とを組合せた積層複合回路装置に関する。Description: TECHNICAL FIELD The present invention relates to a multilayer composite circuit component including a coil layer and a multilayer composite circuit device obtained by combining the same with a substrate.
<従来の技術> 従来、面実装型の積層複合回路装置は、実開昭63−31
547号公報の第5図に見られるように、積層複合回路部
品で発生する熱を、表面からの熱放射または縁部に設け
た接続端子を介して基板のランドへの熱伝導によって放
熱している。<Conventional technology> Conventionally, a surface mount type multilayer composite circuit device has been
As shown in FIG. 5 of Japanese Patent Publication No. 547, the heat generated in the laminated composite circuit component is radiated by heat radiation from the surface or heat conduction to the land of the substrate through the connection terminal provided at the edge. I have.
<発明が解決しようとする課題> この種の積層複合回路装置及び積層複合回路部品の目
的の一つは、コイル、抵抗等の受動部品を組合せて高集
積化、高機能化を図ることである。高集積化すると特定
の回路素子の発熱が他の回路素子の温度特性に影響を与
え、積層複合回路部品としての温度特性が問題となり、
積層複合回路装置及び積層複合回路部品の小型化を阻
む。DC−DCコンバータのトランス部品として使用した場
合は特に顕著である。<Problems to be Solved by the Invention> One of the objects of this type of multilayer composite circuit device and multilayer composite circuit component is to achieve high integration and high functionality by combining passive components such as coils and resistors. . As the degree of integration increases, the heat generated by a particular circuit element affects the temperature characteristics of other circuit elements, causing a problem with the temperature characteristics of the multilayer composite circuit component.
The miniaturization of the multilayer composite circuit device and the multilayer composite circuit component is prevented. This is particularly noticeable when used as a transformer component of a DC-DC converter.
実開昭63−31547号公報に見られる従来技術では、そ
の第5図に示すように、積層複合回路部品と基板との間
は、接続端子の厚みによる段差及び空洞が生じている。
このため、基板への熱伝導ができず、積層複合回路部品
の放熱特性も悪くなっている。In the prior art disclosed in Japanese Utility Model Application Laid-Open No. 63-31547, as shown in FIG. 5, a step and a cavity are formed between the laminated composite circuit component and the substrate due to the thickness of the connection terminal.
For this reason, heat cannot be conducted to the substrate, and the heat radiation characteristics of the laminated composite circuit component are also deteriorated.
そこで、本発明の課題は、上述した従来の問題点を解
決し、特定の素子の発熱による温度特性変化を防止した
積層複合回路装置、及び、積層複合回路装置を構成する
のに適した小型、かつ、高集積度の積層複合回路部品を
提供することである。Therefore, an object of the present invention is to solve the above-described conventional problems and to prevent a change in temperature characteristics due to heat generation of a specific element, a laminated composite circuit device, and a compact, suitable for configuring the laminated composite circuit device. Another object of the present invention is to provide a highly integrated multilayer composite circuit component.
<課題を解決するための手段> 上述した課題解決のため、本発明に係る積層複合回路
装置は、積層複合回路部品と、前記積層複合回路部品を
実装する基板とを有する。<Means for Solving the Problems> In order to solve the above-described problems, a multilayer composite circuit device according to the present invention includes a multilayer composite circuit component and a substrate on which the multilayer composite circuit component is mounted.
前記積層複合回路部品は、積層受動複合体と、接続端
子とを有する。前記積層複合体は、コイル層と、コンデ
ンサ層とを含み、前記コイル層及びコンデンサ層は一面
側が互いに重ね合わされている。The multilayer composite circuit component has a multilayer passive composite and connection terminals. The laminated composite includes a coil layer and a capacitor layer, and the coil layer and the capacitor layer are overlapped on one side.
前記コイル層は、磁性体中に埋設された一つまたは複
数のコイルを有する。前記コンデンサ層は、誘電体磁器
層の内部にコンデンサネットワークを有する。The coil layer has one or more coils embedded in a magnetic body. The capacitor layer has a capacitor network inside the dielectric porcelain layer.
前記接続端子は、前記積層受動複合体の縁部に設けら
れ、少なくとも一端部が、重ね合わせ面とは反対側の前
記コイル層の他面に設けられていて、前記他面との間に
段差を形成している。The connection terminal is provided on an edge of the laminated passive composite, and at least one end is provided on the other surface of the coil layer opposite to the superimposed surface, and a step between the other surface and the other surface. Is formed.
前記基板と、前記コイル層の前記他面との間に前記段
差を埋める熱伝導体を有する。A heat conductor that fills the step between the substrate and the other surface of the coil layer;
また、本発明に係る積層複合回路部品は、積層受動複
合体と、接続端子とを有する。前記積層複合体は、コイ
ル層と、コンデンサ層とを含み、前記コイル層及びコン
デンサ層は一面側が互いに重ね合わされている。Further, a multilayer composite circuit component according to the present invention has a multilayer passive composite and connection terminals. The laminated composite includes a coil layer and a capacitor layer, and the coil layer and the capacitor layer are overlapped on one side.
前記コイル層は、磁性体中に埋設された一つまたは複
数のコイルを有する。前記コンデンサ層は、誘電体磁器
層の内部にコンデンサネットワークを有する。The coil layer has one or more coils embedded in a magnetic body. The capacitor layer has a capacitor network inside the dielectric porcelain layer.
前記接続端子は、前記積層受動複合体の縁部に設けら
れ、少なくとも一端部が、重ね合わせ面とは反対側の前
記コイル層の他面に設けられていて、前記他面との間に
段差を形成している。前記コイル層は、前記他面に前記
段差を埋める熱伝導体を有する。The connection terminal is provided on an edge of the laminated passive composite, and at least one end is provided on the other surface of the coil layer opposite to the superimposed surface, and a step between the other surface and the other surface. Is formed. The coil layer has a heat conductor filling the step on the other surface.
<作用> 積層受動複合体のコイル層は、磁性体中に埋設された
一つまたは複数のコイルを有しており、鉄損及び銅損の
ため内部から発熱する。これらの熱の一部は、それぞれ
の素子の表面からの熱放射または縁部の接続端子を介し
て基板への熱伝導によって放出される。<Operation> The coil layer of the laminated passive composite has one or more coils embedded in a magnetic material, and generates heat from the inside due to iron loss and copper loss. Some of this heat is dissipated by heat radiation from the surface of the respective element or by conduction to the substrate via connection terminals at the edges.
接続端子は、積層受動複合体の縁部に設けられ、少な
くとも一端部が、重ね合わせ面とは反対側のコイル層の
他面に設けられていて、他面との間に段差を形成してい
る。熱伝導体は、この段差による空洞を埋めるように構
成してあるので、コイル層で発生した熱は、熱伝導体を
介して基板に熱伝導される。これによって、コイル層の
温度上昇が抑止される。The connection terminal is provided at the edge of the laminated passive composite, at least one end is provided on the other surface of the coil layer opposite to the superimposed surface, forming a step with the other surface I have. Since the heat conductor is configured to fill the cavity formed by the step, the heat generated in the coil layer is conducted to the substrate via the heat conductor. Thereby, the temperature rise of the coil layer is suppressed.
従って、積層複合回路部品からの放熱特性が改善さ
れ、発熱による温度特性変化を防止した積層複合回路装
置を提供できると共に、更に小型化または高集積化した
積層複合回路装置を提供できる。Therefore, a heat radiation characteristic from the multilayer composite circuit component is improved, and a multilayer composite circuit device in which a change in temperature characteristics due to heat generation can be provided, and a further miniaturized or highly integrated multilayer composite circuit device can be provided.
また、熱伝導体は、コイル層の他面と基板との間に生
ずる空洞を埋め、熱伝導をさせるものであるから、熱伝
導体を積層複合回路部品側に設けても、基板側に設けて
も同様の操作効果を有する積層複合回路装置が得られ
る。Also, since the heat conductor fills a cavity formed between the other surface of the coil layer and the substrate and conducts heat, even if the heat conductor is provided on the laminated composite circuit component side, it is provided on the substrate side. Thus, a laminated composite circuit device having the same operation effect can be obtained.
更に、積層受動複合体に段差を埋める熱伝導体を設け
た混成積層複合部品においては、積層複合回路部品を基
板に実装した場合に、基板と、積層受動複合体に含まれ
るコイル層の他面との間に形成される空洞が埋められ
る。Further, in a hybrid laminated composite component provided with a heat conductor that fills a step in the laminated passive composite, when the laminated composite circuit component is mounted on the substrate, the other surface of the substrate and the coil layer included in the laminated passive composite are Is filled.
従って、コイル層からの放熱特性が改善され、発熱に
よる温度特性変化を防止した積層複合回路装置を提供で
きると共に、更に小型化または高集積化した積層複合回
路部品を提供できる。Therefore, it is possible to provide a laminated composite circuit device in which the heat radiation characteristic from the coil layer is improved and a change in the temperature characteristic due to heat generation is prevented, and it is possible to provide a laminated composite circuit component which is further downsized or highly integrated.
熱伝導体の全体を金属層を構成するのが理想である
が、表面を金属層で構成することによっても、基板への
熱伝導及びコイル層または基板への熱拡散ができる。Ideally, the entire heat conductor is formed of a metal layer. However, when the surface is formed of a metal layer, heat conduction to the substrate and heat diffusion to the coil layer or the substrate can be achieved.
<実施例> 第1図は本発明に係る第1の実施例である積層複合回
路装置の実装状態を示す断面図、第2図は実装された積
層複合回路部品の積層構造を示す断面図である。本実施
例はDC−DCコンバータに用いられるトランス及びコンデ
ンサを複合した積層複合回路装置の例である。図におい
て、1はコイル層、2はコンデンサ層である。コイル層
1及びコンデンサ層2は積層受動複合体を構成してい
る。5は接続端子、6は熱伝導体、8は基板である。<Embodiment> FIG. 1 is a cross-sectional view showing a mounting state of a multilayer composite circuit device according to a first embodiment of the present invention, and FIG. 2 is a cross-sectional view showing a multilayer structure of the mounted multilayer composite circuit component. is there. This embodiment is an example of a multilayer composite circuit device in which a transformer and a capacitor used in a DC-DC converter are combined. In the figure, 1 is a coil layer and 2 is a capacitor layer. The coil layer 1 and the capacitor layer 2 constitute a laminated passive composite. 5 is a connection terminal, 6 is a heat conductor, and 8 is a substrate.
コイル層1は、フェライト等の磁性体10の内部にN個
のコイルを埋設した構造となっている。本実施例では、
コイル11〜14を埋設した構造となっている。コイル11〜
14の巻回数、個数及び接続関係は要求される回路構成に
応じて任意に選定される。例えば、コイル11とコイル13
を直列に接続してトランスの1次側コイルとし、コイル
12とコイル14を直列に接続してトランスの2次側コイル
とするようにである。コイル11〜14は接続端子5の何れ
かに接続されて外部に引出される。The coil layer 1 has a structure in which N coils are embedded in a magnetic body 10 such as ferrite. In this embodiment,
It has a structure in which coils 11 to 14 are embedded. Coil 11 ~
The number of windings, the number of windings, and the connection relation of 14 are arbitrarily selected according to the required circuit configuration. For example, coil 11 and coil 13
Are connected in series to form a primary coil of a transformer.
12 and the coil 14 are connected in series to form a secondary coil of a transformer. The coils 11 to 14 are connected to any of the connection terminals 5 and are drawn out.
コンデンサ層2は、誘電体磁器20の内部にN個のコン
デンサネットワークを埋設した構造となっている。本実
施例では、コンデンサネットワーク21、22を埋設した構
造となっている。コンデンサネットワーク21、22は、誘
電体磁器層を介して電極を対向させて形成されたコンデ
ンサを、所要のコンデンサ回路を構成するように接続す
ることによって構成されている。コンデンサネットワー
ク21、22のそれぞれの回路構成は、用途に応じて任意に
選択される。これらのコンデンサネットワーク21、22は
接続端子5の何れかに接続されて外部に引出される。The capacitor layer 2 has a structure in which N capacitor networks are embedded in the dielectric ceramic 20. In this embodiment, the structure is such that the capacitor networks 21 and 22 are embedded. The capacitor networks 21 and 22 are configured by connecting capacitors formed with electrodes facing each other via a dielectric ceramic layer so as to form a required capacitor circuit. The circuit configuration of each of the capacitor networks 21 and 22 is arbitrarily selected according to the application. These capacitor networks 21 and 22 are connected to one of the connection terminals 5 and are led out.
接続端子5は、積層受動複合体の各層間の接続及び外
部との接続のため、積層受動複合体の縁部に一方の面か
ら他方の面に亙って設けられており、積層受動複合体の
コイル層1との間に、厚み分の段差G1を生じている。接
続端子5の端子数は回路構成に応じて決定される。The connection terminals 5 are provided from one surface to the other surface at the edge of the multilayer passive composite for connection between each layer of the multilayer passive composite and connection to the outside. A step G1 corresponding to the thickness is formed between the coil layer 1 and the coil layer 1. The number of connection terminals 5 is determined according to the circuit configuration.
熱伝導体6は、段差G1により、基板8と積層受動複合
体のコイル層1との間に形成される空洞を埋めるもので
あり、金属等の電気的な導体材料、シリコン・コンパウ
ンド等の熱伝導性の良い樹脂材料等が用いられている。The heat conductor 6 fills a cavity formed between the substrate 8 and the coil layer 1 of the laminated passive composite due to the step G1, and is formed of an electric conductor material such as a metal or a heat compound such as a silicon compound. A resin material or the like having good conductivity is used.
基板8は誘電体磁器またはガラスエポキシ等の材料基
板の上に導体で形成されたランド81及び82、導体部83及
び回路パターン(図示せず)を有している。The substrate 8 has lands 81 and 82, conductor portions 83, and a circuit pattern (not shown) formed of conductors on a material substrate such as dielectric porcelain or glass epoxy.
本実施例ではコイル11〜14が多く発熱するので、コイ
ル層1は基板8に接する側に設けられている。In this embodiment, since the coils 11 to 14 generate much heat, the coil layer 1 is provided on the side in contact with the substrate 8.
コイル11〜14はトランスを形成するので、鉄損及び銅
損により発熱する。この熱は、接続端子5及び半田7を
介して基板8のランド81、82への熱伝導またはコイル層
1の表面からの熱放射によって放出される。Since the coils 11 to 14 form a transformer, they generate heat due to iron loss and copper loss. This heat is released by heat conduction to the lands 81 and 82 of the substrate 8 or heat radiation from the surface of the coil layer 1 via the connection terminals 5 and the solder 7.
更に、熱伝導体6が基板8の導体部83と接触している
ので、コイル層1で発生した熱は熱伝導体6を介して導
体部83へ熱伝導される。特に、積層複合回路部品が集積
化されて表面積が小さくなり、熱放射による放熱は期待
できなくなった場合でも、熱伝導体6による放熱によっ
て温度上昇を防止できるため、集積度を上げることが可
能になる。Further, since the heat conductor 6 is in contact with the conductor 83 of the substrate 8, the heat generated in the coil layer 1 is conducted to the conductor 83 via the heat conductor 6. In particular, even when the laminated composite circuit components are integrated and the surface area is reduced and heat radiation by heat radiation cannot be expected, the temperature rise can be prevented by heat radiation by the heat conductor 6, so that the degree of integration can be increased. Become.
この場合、基板8へ多くの熱伝導をさせるため、導体
部83はできるだけ広くとることが望ましい。これによっ
て、コイル層1の温度上昇が少なくなり、コイル11〜14
及びコンデンサネットワーク21、22への温度影響が少な
くなる。また、放熱特性は悪くなるが、基盤8に導体部
83を設けない場合、その分を熱伝導体6で隙間を補って
やれば基板8へ熱伝導ができる。In this case, it is desirable to make the conductor portion 83 as wide as possible in order to conduct much heat to the substrate 8. Thereby, the temperature rise of the coil layer 1 is reduced, and the coils 11 to 14 are reduced.
In addition, the temperature influence on the capacitor networks 21 and 22 is reduced. In addition, although the heat radiation characteristics deteriorate,
When the 83 is not provided, the gap can be compensated for by the heat conductor 6 so that heat can be conducted to the substrate 8.
これによって、積層複合回路部品の放熱特性が改善さ
れ、温度上昇による特性変化を防止した積層複合回路装
置を提供できると共に、更に小型化または高集積化した
積層複合回路装置を提供できる。As a result, the heat dissipation characteristics of the multilayer composite circuit component are improved, and a multilayer composite circuit device in which a change in characteristics due to a rise in temperature can be provided, and a further miniaturized or highly integrated multilayer composite circuit device can be provided.
第3図は、第1図に示すコイル11〜14のコイルの巻方
の1例を示す図である。FIG. 3 is a diagram showing an example of a winding method of the coils 11 to 14 shown in FIG.
コイル導体111、112は、巻軸方向Oに変位する螺旋状
となっていて、各巻軸が互いの巻径面内に位置するよう
に配置されている。The coil conductors 111 and 112 are helically displaced in the winding axis direction O, and are arranged such that the respective winding axes are located within the respective winding diameter planes.
また、コイル導体111の巻方向a1とコイル導体112の巻
方向b1とは、同一の巻軸方向Oで見て、互いに逆になっ
ている。即ち、巻軸方向Oで見て、コイル導体111の巻
方向a1は時計方向であり、コイル導体112の巻方向b1は
反時計方向である。The winding direction a1 of the coil conductor 111 and the winding direction b1 of the coil conductor 112 are opposite to each other when viewed in the same winding axis direction O. That is, when viewed in the winding axis direction O, the winding direction a1 of the coil conductor 111 is clockwise, and the winding direction b1 of the coil conductor 112 is counterclockwise.
コイル導体111、112は、コイル電流により同一方向の
磁界を生じるように、接続部113によって互いに接続さ
れている。コイル導体111の巻方向とコイル導体112の巻
方向とは、互いに逆になっているので、コイル111の終
端部と、コイル導体112始端部とを接続部113によって互
いに接続した場合、コイル導体111、112により、電流方
向が同一のコイルが形成され、同一方向の磁界を生じ
る。従って、同一のコイル長に対して倍の巻回数のコイ
ルが得られ、集積度も倍にできる。このようにコイルの
集積度を上げた場合、コイル層1の発熱も増加するの
で、本発明は更に効果的となる。The coil conductors 111 and 112 are connected to each other by a connecting portion 113 so that a magnetic field in the same direction is generated by the coil current. Since the winding direction of the coil conductor 111 and the winding direction of the coil conductor 112 are opposite to each other, when the terminal portion of the coil 111 and the start end of the coil conductor 112 are connected to each other by the connection portion 113, the coil conductor 111 , 112, a coil having the same current direction is formed, and a magnetic field in the same direction is generated. Therefore, a coil having twice the number of turns for the same coil length can be obtained, and the degree of integration can be doubled. When the degree of integration of the coil is increased in this way, the heat generation of the coil layer 1 also increases, and the present invention is more effective.
第4図は本発明の第2の実施例に係る混成積層型回路
装置の好適な実装状態を示す断面図である。第1図と同
一参照符号は同一性のある構成部品を示す。これは、熱
伝導体6を基板8側に設けた実施例である。本実施例で
は、誘電体磁器基板上に厚膜印刷により形成している
が、蒸着、スパッタ、メッキ等で形成してもよい。更
に、エポキシ基板上に金属の薄板を接着剤で接着しても
よい。この基板8に積層複合回路部品を実装すると第1
の実施例と同様の実装状態になるので、同様の効果が得
られる。FIG. 4 is a sectional view showing a preferred mounting state of the hybrid laminated circuit device according to the second embodiment of the present invention. The same reference numerals as those in FIG. 1 indicate the same components. This is an embodiment in which the heat conductor 6 is provided on the substrate 8 side. In this embodiment, a thick film is formed on the dielectric ceramic substrate by printing, but it may be formed by vapor deposition, sputtering, plating or the like. Further, a thin metal plate may be bonded on the epoxy substrate with an adhesive. When the multilayer composite circuit component is mounted on the substrate 8, the first
Since the mounting state is the same as that of the embodiment, similar effects can be obtained.
第5図は第3の実施例に係る積層複合回路装置の部品
として好適な積層複合回路部品の断面図である。第1図
と同一参照符号は同一性のある構成部品を示す。これ
は、第1の実施例における熱伝導体6を積層受動複合体
のコイル層1の一方の面に設けたものである。本実施例
では、熱伝導体6を電気的導体の厚膜印刷により形成し
ているが、蒸着、スパッタ、メッキ等で形成してもよ
い。更に、金属の薄板を接着剤で接着してもよい。FIG. 5 is a sectional view of a multilayer composite circuit component suitable as a component of the multilayer composite circuit device according to the third embodiment. The same reference numerals as those in FIG. 1 indicate the same components. This is one in which the heat conductor 6 in the first embodiment is provided on one surface of the coil layer 1 of the laminated passive composite. In the present embodiment, the heat conductor 6 is formed by thick-film printing of an electric conductor, but may be formed by vapor deposition, sputtering, plating, or the like. Further, a thin metal plate may be bonded with an adhesive.
本実施例の積層複合回路部品を基板8に実装すれば、
第1の実施例と同様の状態になるので、同一の効果が得
られる。If the multilayer composite circuit component of this embodiment is mounted on the substrate 8,
Since the state is similar to that of the first embodiment, the same effect can be obtained.
また、上下の面を含む積層受動複合体の外周を電気的
な導体で覆うように熱伝導体6を形成してもよい。第5
図は断面を示しているので図示されていないが、接続端
子5を有しない側面にも熱伝導体6が形成されている。Further, the heat conductor 6 may be formed so as to cover the outer periphery of the laminated passive composite including the upper and lower surfaces with an electric conductor. Fifth
Although the figure shows a cross section, it is not shown, but a heat conductor 6 is also formed on a side surface having no connection terminal 5.
これによって、コンデンサ層2から基板8への熱伝導
と積層受動複合体の上面及び側面からの熱放射が加わる
ので、加熱特性が更に向上する。また、コイル層1はコ
イルが磁性体中に埋設されているので、コイル層1自身
が磁気シールド効果を有するが、更に、熱伝導体6を電
気的な導体にしたことによる磁気シールド効果も有する
ようになる。従って、放熱特性が優れ、かつ、磁気シー
ルド効果を持たせた、積層複合回路装置の部品として好
適な積層複合回路部品を提供できる。As a result, heat conduction from the capacitor layer 2 to the substrate 8 and heat radiation from the top and side surfaces of the laminated passive composite are added, so that the heating characteristics are further improved. Further, since the coil of the coil layer 1 is embedded in the magnetic material, the coil layer 1 itself has a magnetic shielding effect, but also has a magnetic shielding effect by using the heat conductor 6 as an electric conductor. Become like Therefore, it is possible to provide a multilayer composite circuit component having excellent heat radiation characteristics and a magnetic shielding effect, which is suitable as a component of the multilayer composite circuit device.
更に、図示はしないが、積層受動複合体のコイル層1
を構成する磁性体に突起部を設け、熱伝導体6の代りと
してもよい。接続端子5と積層受動複合体とが形成する
段差G1が小さいときは有効である。Further, although not shown, the coil layer 1 of the laminated passive composite
A protrusion may be provided on the magnetic material constituting the above-described method, and may be used instead of the heat conductor 6. This is effective when the step G1 formed by the connection terminal 5 and the laminated passive composite is small.
上記の各実施例において、熱伝導体6の全体を金属層
で構成するのが理想であるが、表面を金属層で構成する
ことによっても、基板8への熱伝導及びコイル層1また
は基板8への熱拡散ができるので効果的である。In each of the above embodiments, it is ideal that the entire heat conductor 6 is formed of a metal layer. However, the heat conduction to the substrate 8 and the coil layer 1 or the It is effective because it can diffuse heat to the surface.
<発明の効果> 以上述べたように、本発明によれば、次のような効果
が得られる。<Effects of the Invention> As described above, according to the present invention, the following effects can be obtained.
(a)コイル層からの放熱が促進され、積層複合回路部
品の温度上昇が少なくなるので、発熱による温度特性変
化を防止した積層複合回路装置を提供できる。(A) Since the heat radiation from the coil layer is promoted and the temperature rise of the laminated composite circuit component is reduced, a laminated composite circuit device in which a change in temperature characteristics due to heat generation is prevented can be provided.
(b)積層複合回路部品の温度上昇が少なくなるので、
更に小型化または高集積化した積層複合回路部品の使用
が可能となり、結果として、更に小型、かつ、高機能化
した積層複合回路装置が提供できる。(B) Since the temperature rise of the multilayer composite circuit component is reduced,
It is possible to use a laminated composite circuit component that is further reduced in size or highly integrated, and as a result, it is possible to provide a laminated composite circuit device that is more compact and more sophisticated.
(c)積層複合回路部品に熱伝導体を設けたので、放熱
特性及び実装性が優れ、積層複合回路装置を構成するの
に適した積層複合回路部品を提供できる。(C) Since the heat conductor is provided on the laminated composite circuit component, a laminated composite circuit component excellent in heat dissipation characteristics and mountability and suitable for forming the laminated composite circuit device can be provided.
第1図は本発明に係る第1の実施例である積層複合回路
装置の実装状態を示す断面図、第2図は実装された積層
複合回路部品の積層構造を示す断面図、第3図は第1図
に示すコイルの巻方の1例を示す図、第4図は本発明に
係る第2の実施例である積層複合回路装置の実装状態を
示す断面図、第5図は第3の実施例に係る積層複合回路
装置の部品として好適な積層複合回路部品の断面図であ
る。 1……コイル層、2……コンデンサ層 5……接続端子、6……熱伝導体 8……基板FIG. 1 is a cross-sectional view showing a mounting state of a multilayer composite circuit device according to a first embodiment of the present invention, FIG. 2 is a cross-sectional view showing a multilayer structure of a mounted multilayer composite circuit component, and FIG. FIG. 4 is a view showing an example of a winding method of a coil shown in FIG. 1, FIG. 4 is a sectional view showing a mounted state of a laminated composite circuit device according to a second embodiment of the present invention, and FIG. It is sectional drawing of the laminated composite circuit component suitable as a component of the laminated composite circuit device which concerns on an Example. DESCRIPTION OF SYMBOLS 1 ... Coil layer, 2 ... Capacitor layer 5 ... Connection terminal, 6 ... Heat conductor 8 ... Substrate
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6,DB名) H05K 1/18 H01G 4/40 H01F 17/00 H01F 27/00 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 6 , DB name) H05K 1/18 H01G 4/40 H01F 17/00 H01F 27/00
Claims (6)
品を実装する基板とを有する積層複合回路装置であっ
て、 前記積層複合回路部品は、積層受動複合体と、接続端子
とを有しており、 前記積層複合体は、コイル層と、コンデンサ層とを含
み、前記コイル層及びコンデンサ層は一面側が互いに重
ね合わされており、 前記コイル層は、磁性体中に埋設された一つまたは複数
のコイルを有しており、 前記コンデンサ層は、誘電体磁器層の内部にコンデンサ
ネットワークを有しており、 前記接続端子は、前記積層受動複合体の縁部に設けら
れ、少なくとも一端部が、重ね合わせ面とは反対側の前
記コイル層の他面に設けられていて、前記他面との間に
段差を形成しており、 前記基板と、前記コイル層の前記他面との間に前記段差
を埋める熱伝導体を有すること を特徴とする積層複合回路装置。1. A multilayer composite circuit device having a multilayer composite circuit component and a substrate on which the multilayer composite circuit component is mounted, wherein the multilayer composite circuit component has a multilayer passive composite and a connection terminal. The laminated composite includes a coil layer and a capacitor layer, wherein the coil layer and the capacitor layer are overlapped on one side, and the coil layer is one or more embedded in a magnetic material. The capacitor layer has a capacitor network inside a dielectric ceramic layer, The connection terminal is provided at an edge of the laminated passive composite, at least one end, It is provided on the other surface of the coil layer on the side opposite to the superimposed surface, and forms a step between the other surface and the substrate, and the other surface of the coil layer. Heat transfer to fill steps Laminated composite circuit device characterized by having a body.
対側の前記コンデンサ層の他面に設けられていることを
特徴とする請求項1に記載の積層複合回路装置。2. The multilayer composite circuit device according to claim 1, wherein said heat conductor is provided on the other surface of said capacitor layer opposite to said superposed surface.
を特徴とする請求項1に記載の積層複合回路装置。3. The multilayer composite circuit device according to claim 1, wherein said heat conductor is provided on said substrate side.
とする請求項1、2または3に記載の積層複合回路装
置。4. The multilayer composite circuit device according to claim 1, wherein said heat conductor includes a metal layer.
層複合回路部品であって、 前記積層複合体は、コイル層と、コンデンサ層とを含
み、前記コイル層及びコンデンサ層は一面側が互いに重
ね合わされており、 前記コイル層は、磁性体中に埋設された一つまたは複数
のコイルを有しており、 前記コンデンサ層は、誘電体磁器層の内部にコンデンサ
ネットワークを有しており、 前記接続端子は、前記積層受動複合体の縁部に設けら
れ、少なくとも一端部が、重ね合わせ面とは反対側の前
記コイル層の他面に設けられていて、前記他面との間に
段差を形成しており、 前記コイル層は、前記他面に前記段差を埋める熱伝導体
を有すること を特徴とする積層複合回路部品。5. A multilayer composite circuit component having a multilayer passive composite and a connection terminal, wherein the multilayer composite includes a coil layer and a capacitor layer, and the coil layer and the capacitor layer have one surface facing each other. Wherein the coil layer has one or more coils embedded in a magnetic material, the capacitor layer has a capacitor network inside a dielectric ceramic layer, The connection terminal is provided at an edge of the laminated passive composite, and at least one end is provided on the other surface of the coil layer opposite to the superposed surface, and a step is formed between the other surface and the other surface. The laminated composite circuit component, wherein the coil layer has a heat conductor that fills the step on the other surface.
とする請求項5に記載の積層複合回路部品。6. The multilayer composite circuit component according to claim 5, wherein said heat conductor includes a metal layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2065756A JP2892090B2 (en) | 1990-03-16 | 1990-03-16 | Multilayer composite circuit device and multilayer composite circuit component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2065756A JP2892090B2 (en) | 1990-03-16 | 1990-03-16 | Multilayer composite circuit device and multilayer composite circuit component |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH03266492A JPH03266492A (en) | 1991-11-27 |
JP2892090B2 true JP2892090B2 (en) | 1999-05-17 |
Family
ID=13296194
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2065756A Expired - Fee Related JP2892090B2 (en) | 1990-03-16 | 1990-03-16 | Multilayer composite circuit device and multilayer composite circuit component |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2892090B2 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6631382B2 (en) * | 2016-04-20 | 2020-01-15 | Tdk株式会社 | Coil parts |
JP2020088127A (en) * | 2018-11-22 | 2020-06-04 | ヤマハ株式会社 | Electrical component and electrical equipment |
-
1990
- 1990-03-16 JP JP2065756A patent/JP2892090B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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JPH03266492A (en) | 1991-11-27 |
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