JP2892090B2 - Multilayer composite circuit device and multilayer composite circuit component - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a multilayer composite circuit component including a coil layer and a multilayer composite circuit device obtained by combining the same with a substrate.

<Conventional technology> Conventionally, a surface mount type multilayer composite circuit device has been
As shown in FIG. 5 of Japanese Patent Publication No. 547, the heat generated in the laminated composite circuit component is radiated by heat radiation from the surface or heat conduction to the land of the substrate through the connection terminal provided at the edge. I have.

<Problems to be Solved by the Invention> One of the objects of this type of multilayer composite circuit device and multilayer composite circuit component is to achieve high integration and high functionality by combining passive components such as coils and resistors. . As the degree of integration increases, the heat generated by a particular circuit element affects the temperature characteristics of other circuit elements, causing a problem with the temperature characteristics of the multilayer composite circuit component.
The miniaturization of the multilayer composite circuit device and the multilayer composite circuit component is prevented. This is particularly noticeable when used as a transformer component of a DC-DC converter.

In the prior art disclosed in Japanese Utility Model Application Laid-Open No. 63-31547, as shown in FIG. 5, a step and a cavity are formed between the laminated composite circuit component and the substrate due to the thickness of the connection terminal.
For this reason, heat cannot be conducted to the substrate, and the heat radiation characteristics of the laminated composite circuit component are also deteriorated.

Therefore, an object of the present invention is to solve the above-described conventional problems and to prevent a change in temperature characteristics due to heat generation of a specific element, a laminated composite circuit device, and a compact, suitable for configuring the laminated composite circuit device. Another object of the present invention is to provide a highly integrated multilayer composite circuit component.

<Means for Solving the Problems> In order to solve the above-described problems, a multilayer composite circuit device according to the present invention includes a multilayer composite circuit component and a substrate on which the multilayer composite circuit component is mounted.

The multilayer composite circuit component has a multilayer passive composite and connection terminals. The laminated composite includes a coil layer and a capacitor layer, and the coil layer and the capacitor layer are overlapped on one side.

The coil layer has one or more coils embedded in a magnetic body. The capacitor layer has a capacitor network inside the dielectric porcelain layer.

The connection terminal is provided on an edge of the laminated passive composite, and at least one end is provided on the other surface of the coil layer opposite to the superimposed surface, and a step between the other surface and the other surface. Is formed.

A heat conductor that fills the step between the substrate and the other surface of the coil layer;

Further, a multilayer composite circuit component according to the present invention has a multilayer passive composite and connection terminals. The laminated composite includes a coil layer and a capacitor layer, and the coil layer and the capacitor layer are overlapped on one side.

The coil layer has one or more coils embedded in a magnetic body. The capacitor layer has a capacitor network inside the dielectric porcelain layer.

The connection terminal is provided on an edge of the laminated passive composite, and at least one end is provided on the other surface of the coil layer opposite to the superimposed surface, and a step between the other surface and the other surface. Is formed. The coil layer has a heat conductor filling the step on the other surface.

<Operation> The coil layer of the laminated passive composite has one or more coils embedded in a magnetic material, and generates heat from the inside due to iron loss and copper loss. Some of this heat is dissipated by heat radiation from the surface of the respective element or by conduction to the substrate via connection terminals at the edges.

The connection terminal is provided at the edge of the laminated passive composite, at least one end is provided on the other surface of the coil layer opposite to the superimposed surface, forming a step with the other surface I have. Since the heat conductor is configured to fill the cavity formed by the step, the heat generated in the coil layer is conducted to the substrate via the heat conductor. Thereby, the temperature rise of the coil layer is suppressed.

Therefore, a heat radiation characteristic from the multilayer composite circuit component is improved, and a multilayer composite circuit device in which a change in temperature characteristics due to heat generation can be provided, and a further miniaturized or highly integrated multilayer composite circuit device can be provided.

Also, since the heat conductor fills a cavity formed between the other surface of the coil layer and the substrate and conducts heat, even if the heat conductor is provided on the laminated composite circuit component side, it is provided on the substrate side. Thus, a laminated composite circuit device having the same operation effect can be obtained.

Further, in a hybrid laminated composite component provided with a heat conductor that fills a step in the laminated passive composite, when the laminated composite circuit component is mounted on the substrate, the other surface of the substrate and the coil layer included in the laminated passive composite are Is filled.

Therefore, it is possible to provide a laminated composite circuit device in which the heat radiation characteristic from the coil layer is improved and a change in the temperature characteristic due to heat generation is prevented, and it is possible to provide a laminated composite circuit component which is further downsized or highly integrated.

Ideally, the entire heat conductor is formed of a metal layer. However, when the surface is formed of a metal layer, heat conduction to the substrate and heat diffusion to the coil layer or the substrate can be achieved.

<Embodiment> FIG. 1 is a cross-sectional view showing a mounting state of a multilayer composite circuit device according to a first embodiment of the present invention, and FIG. 2 is a cross-sectional view showing a multilayer structure of the mounted multilayer composite circuit component. is there. This embodiment is an example of a multilayer composite circuit device in which a transformer and a capacitor used in a DC-DC converter are combined. In the figure, 1 is a coil layer and 2 is a capacitor layer. The coil layer 1 and the capacitor layer 2 constitute a laminated passive composite. 5 is a connection terminal, 6 is a heat conductor, and 8 is a substrate.

The coil layer 1 has a structure in which N coils are embedded in a magnetic body 10 such as ferrite. In this embodiment,
It has a structure in which coils 11 to 14 are embedded. Coil 11 ~
The number of windings, the number of windings, and the connection relation of 14 are arbitrarily selected according to the required circuit configuration. For example, coil 11 and coil 13
Are connected in series to form a primary coil of a transformer.
12 and the coil 14 are connected in series to form a secondary coil of a transformer. The coils 11 to 14 are connected to any of the connection terminals 5 and are drawn out.

The capacitor layer 2 has a structure in which N capacitor networks are embedded in the dielectric ceramic 20. In this embodiment, the structure is such that the capacitor networks 21 and 22 are embedded. The capacitor networks 21 and 22 are configured by connecting capacitors formed with electrodes facing each other via a dielectric ceramic layer so as to form a required capacitor circuit. The circuit configuration of each of the capacitor networks 21 and 22 is arbitrarily selected according to the application. These capacitor networks 21 and 22 are connected to one of the connection terminals 5 and are led out.

The connection terminals 5 are provided from one surface to the other surface at the edge of the multilayer passive composite for connection between each layer of the multilayer passive composite and connection to the outside. A step G1 corresponding to the thickness is formed between the coil layer 1 and the coil layer 1. The number of connection terminals 5 is determined according to the circuit configuration.

The heat conductor 6 fills a cavity formed between the substrate 8 and the coil layer 1 of the laminated passive composite due to the step G1, and is formed of an electric conductor material such as a metal or a heat compound such as a silicon compound. A resin material or the like having good conductivity is used.

The substrate 8 has lands 81 and 82, conductor portions 83, and a circuit pattern (not shown) formed of conductors on a material substrate such as dielectric porcelain or glass epoxy.

In this embodiment, since the coils 11 to 14 generate much heat, the coil layer 1 is provided on the side in contact with the substrate 8.

Since the coils 11 to 14 form a transformer, they generate heat due to iron loss and copper loss. This heat is released by heat conduction to the lands 81 and 82 of the substrate 8 or heat radiation from the surface of the coil layer 1 via the connection terminals 5 and the solder 7.

Further, since the heat conductor 6 is in contact with the conductor 83 of the substrate 8, the heat generated in the coil layer 1 is conducted to the conductor 83 via the heat conductor 6. In particular, even when the laminated composite circuit components are integrated and the surface area is reduced and heat radiation by heat radiation cannot be expected, the temperature rise can be prevented by heat radiation by the heat conductor 6, so that the degree of integration can be increased. Become.

In this case, it is desirable to make the conductor portion 83 as wide as possible in order to conduct much heat to the substrate 8. Thereby, the temperature rise of the coil layer 1 is reduced, and the coils 11 to 14 are reduced.
In addition, the temperature influence on the capacitor networks 21 and 22 is reduced. In addition, although the heat radiation characteristics deteriorate,
When the 83 is not provided, the gap can be compensated for by the heat conductor 6 so that heat can be conducted to the substrate 8.

As a result, the heat dissipation characteristics of the multilayer composite circuit component are improved, and a multilayer composite circuit device in which a change in characteristics due to a rise in temperature can be provided, and a further miniaturized or highly integrated multilayer composite circuit device can be provided.

FIG. 3 is a diagram showing an example of a winding method of the coils 11 to 14 shown in FIG.

The coil conductors 111 and 112 are helically displaced in the winding axis direction O, and are arranged such that the respective winding axes are located within the respective winding diameter planes.

The winding direction a1 of the coil conductor 111 and the winding direction b1 of the coil conductor 112 are opposite to each other when viewed in the same winding axis direction O. That is, when viewed in the winding axis direction O, the winding direction a1 of the coil conductor 111 is clockwise, and the winding direction b1 of the coil conductor 112 is counterclockwise.

The coil conductors 111 and 112 are connected to each other by a connecting portion 113 so that a magnetic field in the same direction is generated by the coil current. Since the winding direction of the coil conductor 111 and the winding direction of the coil conductor 112 are opposite to each other, when the terminal portion of the coil 111 and the start end of the coil conductor 112 are connected to each other by the connection portion 113, the coil conductor 111 , 112, a coil having the same current direction is formed, and a magnetic field in the same direction is generated. Therefore, a coil having twice the number of turns for the same coil length can be obtained, and the degree of integration can be doubled. When the degree of integration of the coil is increased in this way, the heat generation of the coil layer 1 also increases, and the present invention is more effective.

FIG. 4 is a sectional view showing a preferred mounting state of the hybrid laminated circuit device according to the second embodiment of the present invention. The same reference numerals as those in FIG. 1 indicate the same components. This is an embodiment in which the heat conductor 6 is provided on the substrate 8 side. In this embodiment, a thick film is formed on the dielectric ceramic substrate by printing, but it may be formed by vapor deposition, sputtering, plating or the like. Further, a thin metal plate may be bonded on the epoxy substrate with an adhesive. When the multilayer composite circuit component is mounted on the substrate 8, the first
Since the mounting state is the same as that of the embodiment, similar effects can be obtained.

FIG. 5 is a sectional view of a multilayer composite circuit component suitable as a component of the multilayer composite circuit device according to the third embodiment. The same reference numerals as those in FIG. 1 indicate the same components. This is one in which the heat conductor 6 in the first embodiment is provided on one surface of the coil layer 1 of the laminated passive composite. In the present embodiment, the heat conductor 6 is formed by thick-film printing of an electric conductor, but may be formed by vapor deposition, sputtering, plating, or the like. Further, a thin metal plate may be bonded with an adhesive.

If the multilayer composite circuit component of this embodiment is mounted on the substrate 8,
Since the state is similar to that of the first embodiment, the same effect can be obtained.

Further, the heat conductor 6 may be formed so as to cover the outer periphery of the laminated passive composite including the upper and lower surfaces with an electric conductor. Fifth
Although the figure shows a cross section, it is not shown, but a heat conductor 6 is also formed on a side surface having no connection terminal 5.

As a result, heat conduction from the capacitor layer 2 to the substrate 8 and heat radiation from the top and side surfaces of the laminated passive composite are added, so that the heating characteristics are further improved. Further, since the coil of the coil layer 1 is embedded in the magnetic material, the coil layer 1 itself has a magnetic shielding effect, but also has a magnetic shielding effect by using the heat conductor 6 as an electric conductor. Become like Therefore, it is possible to provide a multilayer composite circuit component having excellent heat radiation characteristics and a magnetic shielding effect, which is suitable as a component of the multilayer composite circuit device.

Further, although not shown, the coil layer 1 of the laminated passive composite
A protrusion may be provided on the magnetic material constituting the above-described method, and may be used instead of the heat conductor 6. This is effective when the step G1 formed by the connection terminal 5 and the laminated passive composite is small.

In each of the above embodiments, it is ideal that the entire heat conductor 6 is formed of a metal layer. However, the heat conduction to the substrate 8 and the coil layer 1 or the It is effective because it can diffuse heat to the surface.

<Effects of the Invention> As described above, according to the present invention, the following effects can be obtained.

(A) Since the heat radiation from the coil layer is promoted and the temperature rise of the laminated composite circuit component is reduced, a laminated composite circuit device in which a change in temperature characteristics due to heat generation is prevented can be provided.

(B) Since the temperature rise of the multilayer composite circuit component is reduced,
It is possible to use a laminated composite circuit component that is further reduced in size or highly integrated, and as a result, it is possible to provide a laminated composite circuit device that is more compact and more sophisticated.

(C) Since the heat conductor is provided on the laminated composite circuit component, a laminated composite circuit component excellent in heat dissipation characteristics and mountability and suitable for forming the laminated composite circuit device can be provided.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a mounting state of a multilayer composite circuit device according to a first embodiment of the present invention, FIG. 2 is a cross-sectional view showing a multilayer structure of a mounted multilayer composite circuit component, and FIG. FIG. 4 is a view showing an example of a winding method of a coil shown in FIG. 1, FIG. 4 is a sectional view showing a mounted state of a laminated composite circuit device according to a second embodiment of the present invention, and FIG. It is sectional drawing of the laminated composite circuit component suitable as a component of the laminated composite circuit device which concerns on an Example. DESCRIPTION OF SYMBOLS 1 ... Coil layer, 2 ... Capacitor layer 5 ... Connection terminal, 6 ... Heat conductor 8 ... Substrate

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Claims (6)

(57) [Claims] 1. A multilayer composite circuit device having a multilayer composite circuit component and a substrate on which the multilayer composite circuit component is mounted, wherein the multilayer composite circuit component has a multilayer passive composite and a connection terminal. The laminated composite includes a coil layer and a capacitor layer, wherein the coil layer and the capacitor layer are overlapped on one side, and the coil layer is one or more embedded in a magnetic material. The capacitor layer has a capacitor network inside a dielectric ceramic layer, The connection terminal is provided at an edge of the laminated passive composite, at least one end, It is provided on the other surface of the coil layer on the side opposite to the superimposed surface, and forms a step between the other surface and the substrate, and the other surface of the coil layer. Heat transfer to fill steps Laminated composite circuit device characterized by having a body. 2. The multilayer composite circuit device according to claim 1, wherein said heat conductor is provided on the other surface of said capacitor layer opposite to said superposed surface. 3. The multilayer composite circuit device according to claim 1, wherein said heat conductor is provided on said substrate side. 4. The multilayer composite circuit device according to claim 1, wherein said heat conductor includes a metal layer. 5. A multilayer composite circuit component having a multilayer passive composite and a connection terminal, wherein the multilayer composite includes a coil layer and a capacitor layer, and the coil layer and the capacitor layer have one surface facing each other. Wherein the coil layer has one or more coils embedded in a magnetic material, the capacitor layer has a capacitor network inside a dielectric ceramic layer, The connection terminal is provided at an edge of the laminated passive composite, and at least one end is provided on the other surface of the coil layer opposite to the superposed surface, and a step is formed between the other surface and the other surface. The laminated composite circuit component, wherein the coil layer has a heat conductor that fills the step on the other surface. 6. The multilayer composite circuit component according to claim 5, wherein said heat conductor includes a metal layer.