JPH0786754A - Laminated hybrid integrated circuit component - Google Patents

Abstract

PURPOSE:To provide a multilayered hybrid integrated circuit component having a means for protecting malfunction of a mounted semiconductor component, by reducing the noise generated by the action of a laminated inductor or a laminated capacitor and a land. CONSTITUTION:A laminated inductor 1A wherein a transformer is formed by alternately laminating insulator layers 2 and conductive layers 3 is constituted. A laminated capacitor is laminated on the laminated inductor 1A, or individually consituted as a capacitor formed by alternately laminating dielectric layers and electrode layers. A semiconductor component 8 is mounted on the above laminated component. A shield layer 15 is formed interposing an insulator layer 16 under a land 7 with which the lead 9 of the semiconductor component 8 and/or a land with which other constituent components relative to the semiconductor components are connected. Further a shield layer 15 may be formed under a resistance layer connected directly or indirectly with the semiconductor component 8.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated inductor (in this specification, not only one having an inductor internally formed by a laminated structure, but also one having only a transformer or both a transformer and an inductor formed by a laminated structure are laminated. Type inductor) and a multilayer capacitor as a substrate, and a multilayer hybrid integrated circuit component in which a semiconductor component is mounted on the substrate, and particularly, for example, DC-DC The present invention relates to a noise prevention structure in a case where a semiconductor component may malfunction due to a weak noise placed on a lead of the semiconductor component due to a leakage magnetic flux from the inside of the laminated component, such as that used in a converter.

[0002]

2. Description of the Related Art FIG. 4A is a perspective view showing an example of a conventional laminated hybrid integrated circuit, which is used in a DC-DC converter. Reference numeral 1A denotes a laminated component in which an inductor or a transformer is formed, and the laminated component 1A is printed with a magnetic layer 2 such as magnetic ferrite and a conductor layer 3 serving as a coil as shown in FIG. 4B. Method or sheet method, for example, the method disclosed in Japanese Patent Laid-Open No. 60-244097 is laminated and fired to form one or more inductors 4 (or transformers) inside, and external electrodes 5 are formed on the side surfaces by baking or plating. Then, the laminated component 1A including the laminated inductor is configured. The laminated component 1A
In order to utilize as a substrate, a resistance layer in which an insulating layer 6 is formed on the front surface or the front and back surfaces, and a wiring pattern including a land 7 or the like partially connected to the external electrode 5 is provided on the resistance layer 6 as necessary. And a resin-molded electronic component such as a semiconductor component 8 which forms a switching element, an amplifier circuit or the like in the case of a DC-DC converter, and its lead 9 is soldered to the land 7 or a conductive resin. It is mounted by being fixed by adhesion or the like to form a hybrid integrated circuit component.

FIG. 5 shows another example of a laminated component 1B on which a semiconductor component 8 is mounted. A dielectric layer 10 and internal electrodes 11 are laminated in the same manner as described above to form one or more capacitors 12. It is a thing.

[0004]

In the conventional laminated type hybrid integrated circuit component shown in FIG. 4, particularly in the case where a transformer is formed, a part of the magnetic flux Φ generated in the transformer leaks and is interlinked with the land 7. The land 7 by the electromagnetic induction action.
However, there is a problem in that a signal may be added as noise to cause malfunction of the semiconductor component 8. Also, FIG.
Also in the case shown in (1), signal land 7 is generated by electrostatic induction between uppermost electrode 11 of capacitor 12 and land 7.
There is a problem in that the semiconductor component 8 may malfunction due to the leakage to the semiconductor component 8.

The present invention has means for preventing malfunction of the mounted semiconductor component by reducing noise generated by the action of the laminated inductor or laminated capacitor and the land in the laminated hybrid integrated circuit component as described above. An object is to provide a laminated hybrid integrated circuit component.

[0006]

In order to achieve the above-mentioned object, the present invention provides a laminated inductor and / or one or more inductors or transformers formed by alternately laminating an insulator layer and a conductor layer. Alternatively, in a laminated hybrid integrated circuit component in which a semiconductor component is mounted on a laminated component composed of a laminated capacitor in which one or more capacitors are formed by alternately laminating dielectric layers and conductor layers, the leads of the semiconductor component are connected. An insulating layer under a land to which the semiconductor component and / or other components related to the semiconductor component are connected, or further below a resistance layer directly or indirectly connected to the semiconductor component. It is characterized in that a shield layer is provided.

[0007]

According to the present invention, the leakage magnetic flux of the laminated inductor is reduced or eliminated by reaching the land by the shield layer formed under the land, thereby reducing noise and preventing malfunction of semiconductor parts and the like. It can be prevented. Also, in the case where a semiconductor component is mounted on the multilayer capacitor, a shield layer is interposed between the internal electrode and the land, and similarly noise generated by electrostatic induction is generated between the internal electrode and the land. Is reduced.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1A is a sectional view showing an embodiment of a laminated hybrid integrated circuit component according to the present invention and is a drawing corresponding to FIG. 4B. 14 is the laminated inductor 1
An insulating layer made of glass or the like formed on A, and a shield layer 15 made of silver, silver-palladium, copper, gold or the like formed on the insulating layer 14 at a position corresponding to the lower portion of the land 7. , 16 are the shield layer 15 and the insulating layer 14
Insulating layer formed overlying, 7 is a similar shield layer 15
And lands made of the same material as or different from the above, and these are formed by laminating on the inductor 1A by a printing method or a shield method. In this way, after these layers are laminated and fired, the external electrode 5 is formed by baking or plating. After forming silver, silver-palladium, copper, and gold, which will be the base layer of the land 7, by a printing method, a sheet method or the like on the insulating layer 16, a nickel layer and a soldering layer such as Sn are sequentially laminated thereon. To form. In the embodiment, the thickness of the insulating layers 14 and 16 as products is about 20 μm, and the thickness of the shield layer 15 and the base layer of the land 7 is about 5 μm.

With this structure, a part of the leakage flux of the magnetic flux Φ generated in the inductor 4 or the transformer is linked with the shield layer 15 before reaching the land 7, and is consumed as an eddy current. The land 7 is hardly reached, noise due to the action of the leakage magnetic flux is prevented from being placed on the lead 9, and malfunction of the semiconductor component 8 is prevented.

FIG. 1B shows another embodiment of the present invention.
A resistance layer 1 connected to the semiconductor component 8 on the insulating layer 16
7 has a circuit in which the resistor 7 is formed from the land 7 to the resistance layer 1.
7 or the land 18 to which the resistance layer 17 is connected, the shield layer 15 is formed under these, and with this structure, noise generated in the resistance layer 17 by electromagnetic induction due to leakage magnetic flux is a semiconductor component. 8 to prevent the semiconductor component 8 from malfunctioning. In addition, as shown in the drawing, not only when the resistance layer 17 is directly connected to the lead 9, but also when the resistance layer 17 is connected through another component and there is a possibility that the semiconductor component 8 malfunctions due to signal propagation. In this case, the shield layer 15 is provided below the resistance layer 17 as necessary.

FIG. 2A shows a semiconductor component 8 including another component 20 such as a diode and a transistor, which is related to the semiconductor component 8. In FIG.
1 is another embodiment of the present invention in which a shield layer 15 is provided below the lands 22 for fixing 1 and, according to this embodiment, electromagnetic induction due to a leakage magnetic flux is applied to another component 20 mounting land 22. This prevents noise from being carried and prevents malfunction of the semiconductor component 8. Depending on the arrangement of the internal inductor 4 or transformer and the leads 9 and 21, only the lower part of the land 7 or the lower part of the land 22 where the influence of the leakage magnetic flux is large is provided.
May be provided. Further, as shown in FIG. 1B, when the resistance layer 17 is further formed, the shield layer 15 may be further provided below the resistance layer 17.

FIG. 2 (B) shows an embodiment in which the present invention is applied to a semiconductor component 8 mounted on a laminated component 1B composed of a multilayer capacitor. As in the embodiment shown in FIG. 7, a shield layer 15 is provided below the electrode 7, noise is prevented from being placed on the land 7 due to electrostatic induction between the electrode 11 of the capacitor 12 and the land 7, and malfunction of the semiconductor component 8 is prevented.

FIG. 3 shows a laminated inductor having an inductor 4 or a transformer formed therein and a capacitor 12 inside.
Multilayered component 1 integrated with multilayer capacitor
This is an example in which the present invention is applied to a semiconductor component 8 mounted on C. In the case where the multilayer inductor is on the top (mounting surface of the semiconductor component 8) and the multilayer capacitor is on the bottom as shown in the figure, on the contrary, the multilayer capacitor is on the top and the multilayer inductor is on the bottom, As is clear from the description of the embodiment, the malfunction of the semiconductor component 8 is prevented.

In the above embodiment, the shield layer 15 is provided in the form of a floating island only under the land 7 etc.
The shield layer 15 may be formed on almost the entire surface except the periphery of A to 1C, and the shield layer 15 may be connected to the ground pattern. The inductor 4 may be a non-magnetic material instead of the magnetic material 2 depending on the application.

[0015]

According to the first aspect of the present invention, the shield layer is provided below the semiconductor component and / or other component mounting land with the insulating layer interposed therebetween. It is possible to prevent noise from landing on the land, and prevent malfunction of semiconductor components.

According to the second aspect, since the shield layer is also provided under the resistance layer, it is possible to prevent malfunction of the semiconductor component due to noise on the resistance layer.

[Brief description of drawings]

1A is a sectional view showing an embodiment of a laminated hybrid integrated circuit component according to the present invention, and FIG. 1B is a sectional view showing another embodiment of the present invention.

2A and 2B are cross-sectional views each showing another embodiment of the present invention.

FIG. 3 is a sectional view further showing another embodiment of the present invention.

4A is a perspective view showing an embodiment of a conventional laminated hybrid integrated circuit component, and FIG. 4B is a sectional view thereof.

FIG. 5 is a cross-sectional view showing another example of a conventional laminated hybrid integrated circuit component.

[Explanation of symbols]

 1A Multilayer Inductor 1B Multilayer Capacitor 1C Multilayer Component Including Inductor and Capacitor 2 Magnetic Layer 3 Conductor Layer 4 Inductor 5 External Electrode 7, 18, 22 Land 8 Semiconductor Component 9, 21 Lead 10 Dielectric Layer 11 Internal Electrode 12 Capacitors 14 and 16 Insulating layer 15 Shield layer 17 Resistive layer 20 Other components

Claims (2)

[Claims] 1. A laminated inductor in which at least one inductor or transformer is formed by alternately laminating an insulating layer and a conductor layer, and / or one or more layers by alternately laminating a dielectric layer and a conductor layer. In a laminated hybrid integrated circuit component in which a semiconductor component is mounted on a laminated component formed of a laminated capacitor in which a capacitor is formed, a land to which a lead of the semiconductor component is connected and / or another configuration related to the semiconductor component A laminated hybrid integrated circuit component, characterized in that a shield layer is provided below the land to which the component is connected, with an insulating layer interposed therebetween. 2. The laminated hybrid integrated circuit component according to claim 1, further comprising a shield layer provided below the resistance layer connected to the semiconductor component with an insulating layer interposed therebetween.