WO2011148678A1

WO2011148678A1 - Lc co-sintered substrate and method for producing same

Info

Publication number: WO2011148678A1
Application number: PCT/JP2011/053138
Authority: WO
Inventors: 横山　智哉; 純一南條; 大樹足立; 池田　哲也
Original assignee: 株式会社村田製作所
Priority date: 2010-05-26
Filing date: 2011-02-15
Publication date: 2011-12-01

Abstract

Provided is a LC co-sintered substrate which can be produced with a high degree of accuracy and which can prevent reduction of the inductance value of a coil. A LC co-sintered substrate (10) is provided with (a) a substrate main body (12) having magnetic layers (14a, 14b) composed of a magnetic ceramic material, and first and second dielectric layers (16a, 16b) which are laminated on both sides of the magnetic layers (14a, 14b) and which are composed of a dielectric ceramic material, (b) coils (20) formed on the inside of the magnetic layers (14a, 14b), and (c) a capacitor (22) formed on the inside of only the second dielectric layer (16b).

Description

LC co-sintered substrate and manufacturing method thereof

The present invention relates to an LC co-sintered substrate and a method for manufacturing the same, and more particularly to a co-sintered substrate incorporating a coil and a capacitor.

Various technologies have been proposed for co-sintered substrates and non-shrink firing.

For example, in the multilayer ceramic substrate for high frequency disclosed in Patent Document 1, an intermediate layer made of a magnetic material is provided between a plurality of wiring conductors provided in a dielectric layer. The layers are constrained to each other and substantially non-shrink in the principal surface direction. The intermediate layer made of a magnetic material is for shielding.

Patent Document 2 discloses a method for manufacturing a glass ceramic substrate in which a constraining layer is laminated on both upper and lower surfaces of a laminate in which a ferrite layer is sandwiched between glass ceramic layers, and the constraining layer is removed after firing. The ferrite layer is for noise absorption.

In Patent Document 3, as shown in the sectional view of FIG. 4, a magnetic layer 2 is sandwiched between a pair of nonmagnetic layers 1, and a coil layer 3 composed of a plurality of planar coil conductors 3 a to 3 c is formed in the magnetic layer 2. It is disclosed that the formed coil-embedded substrate is produced by firing a laminate.

Patent Document 4 discloses that a plurality of dielectric layers are stacked symmetrically in the vertical direction, and the strength of the substrate is improved by utilizing a difference in linear expansion coefficient (thermal expansion coefficient) between the outermost layer and the inner layer.

JP 2001-119144 A Japanese Patent Laid-Open No. 2004-262741 JP 2008-84921 A JP 2003-55034 A

Recently, module parts in which circuit parts such as a semiconductor integrated circuit, a capacitor, and a resistor are mounted on a substrate including a magnetic body with a built-in coil are used in mobile phones.

In order to reduce the size of such module parts, a substrate having a magnetic layer sandwiched between a pair of dielectric layers as in FIG. 3 is used, a coil is formed inside the magnetic layer, and a pair of dielectrics sandwiching the magnetic layer It is conceivable to form a capacitor inside the layer.

When such a substrate is manufactured by the general manufacturing method disclosed in Patent Document 3, in order to manufacture the substrate with high accuracy, capacitors are respectively formed inside a pair of dielectric layers that sandwich the magnetic layer. It is necessary to make the substrate as symmetrical as possible.

However, if capacitors are arranged on both sides of the coil, the inductance value of the coil decreases.

In view of such circumstances, the present invention is intended to provide an LC co-sintered substrate that can be manufactured with high accuracy and that can prevent a reduction in the inductance value of a coil.

In order to solve the above problems, the present invention provides an LC co-sintered substrate configured as follows.

The LC co-sintered substrate comprises: (a) a substrate body having a magnetic layer containing a magnetic ceramic material; and first and second dielectric layers laminated on both sides of the magnetic layer and containing a dielectric ceramic material; (B) a coil formed in the magnetic layer; and (c) a capacitor formed in only one of the first and second dielectric layers.

In the above configuration, since the capacitor is formed inside only one of the first and second dielectrics laminated on both sides of the magnetic layer, the capacitor is formed on both sides of the coil formed inside the magnetic layer. As a result, it is possible to prevent the inductance value of the coil formed inside the magnetic layer from decreasing.

According to the above configuration, the LC co-sintered substrate is obtained by firing the laminated body formed by laminating and pressing the unfired magnetic layer and the first and second dielectric layers together with the coil and capacitor portions. Can be formed. Since the capacitor is formed inside only one of the first and second dielectrics, the structure is asymmetrical, but higher than the temperature at which the laminate starts to sinter on both sides in the lamination direction of the unfired laminate. An LC co-sintered substrate is formed by a so-called non-shrinking method, in which the laminate starts to be sintered and the constraining layer is fired at a temperature at which the sintering does not start. It can be manufactured with high accuracy.

Preferably, the substrate body further includes first and second nonmagnetic ferrite layers that are stacked between the magnetic layer and the first and second dielectric layers and include a nonmagnetic ferrite ceramic material.

In this case, the first and second non-magnetic ferrite layers can be formed by laminating and pressing together with the unfired magnetic layer and the first and second dielectric layers in an unfired state, and firing simultaneously. . The first and second nonmagnetic ferrite layers can improve the efficiency of the inductor of the coil formed inside the magnetic layer.

Preferably, the substrate body including at least two first and second magnetic layers further includes an intermediate nonmagnetic ferrite layer including a nonmagnetic ferrite ceramic material between the first and second magnetic layers. .

In this case, the intermediate nonmagnetic ferrite layer can be formed by laminating and pressing the unfired first and second magnetic layers in the unfired state and simultaneously firing them. The intermediate nonmagnetic ferrite layer can improve the characteristics of the coil formed inside the magnetic layer (improvement of voltage conversion efficiency by suppressing iron loss, improvement of inductance value, etc.).

Preferably, a gap is provided between the coil and the magnetic layer.

Magnetostriction due to residual stress occurs in the substrate body after firing due to the difference in the coefficient of linear expansion (thermal expansion coefficient) between the coil and the magnetic layer. Therefore, the voltage conversion efficiency of the coil due to iron loss (decrease in inductance) remains unchanged. ) Is seen. By providing a gap between the coil and the magnetic layer, the stress of the magnetic layer around the coil can be relieved and the characteristics of the coil can be improved.

Preferably, a thin layer of the magnetic layer is provided between the coil and the gap.

Magnetostriction due to residual stress occurs in the substrate body after firing due to the difference in the coefficient of linear expansion (thermal expansion coefficient) between the coil and the magnetic layer. Therefore, the voltage conversion efficiency of the coil due to iron loss (decrease in inductance) remains unchanged. ) Is seen. By providing a gap in the magnetic layer around the coil, the stress of the magnetic layer around the coil can be relieved and the characteristics of the coil can be improved.

Preferably, the thickness of one of the first and second dielectric layers in which the capacitor is formed is different from the thickness of the other of the first and second dielectric layers.

In this case, although the configuration of the LC co-sintered substrate is not symmetrical, the LC co-sintered substrate can be produced with high accuracy by a non-shrinkage method by adjusting the constraining layer.

Preferably, of the first and second dielectric layers, the one of the capacitors in which the capacitor is formed is thicker than the other of the first and second dielectric layers.

In this case, the substrate body can be thinned by reducing the thickness of the other of the first and second dielectric layers.

Preferably, at least one of the first and second dielectric layers and the magnetic layer of the substrate body penetrates in the stacking direction of the first and second dielectric layers and the magnetic layer, and A via hole conductor connected to at least one of the coil and the capacitor is further provided.

In this case, an LC circuit can be configured in the substrate body.

Preferably, a terminal electrode for mounting the LC co-sintered substrate is formed on the one of the first and second dielectric layers in which the capacitor is formed.

In this case, the wiring length between the capacitor formed inside the dielectric layer and the terminal electrode can be made as short as possible.

Preferably, a land electrode for mounting a component on the LC co-sintered substrate is formed on the other of the first and second dielectric layers.

In this case, a module component can be manufactured by mounting a component such as a surface mount component or a semiconductor chip on the land electrode.

The present invention also provides a method for producing an LC co-sintered substrate configured as follows.

The method for producing an LC co-sintered substrate includes (a) a non-magnetic ferrite ceramic material on both sides of a main surface of an unsintered magnetic layer that includes a magnetic ceramic material and includes a portion that becomes a coil therein. An unsintered first and second nonmagnetic ferrite layer including a portion that becomes a capacitor only in one of the layers is laminated and pressure-bonded, and the first and second nonmagnetic ferrite layers are opposite to the magnetic layer. An unsintered first and second dielectric layers containing a dielectric ceramic material are laminated on the principal surface of the first and second dielectric layers of the unsintered laminate, and the magnetic layers of the first and second dielectric layers are bonded together. The magnetic layer, the first and second nonmagnetic ferrite layers, and the first and second dielectric layers are sintered on the main surface opposite to the first and second nonmagnetic ferrite layers. Start sintering at a temperature higher than the sintering start temperature A first step of forming a composite laminate in which a bundle layer is laminated and pressure-bonded; and (b) the composite laminate includes the magnetic layer, the first and second nonmagnetic ferrite layers, and the first and first layers. The dielectric layer 2 is fired at a temperature higher than the sintering start temperature at which sintering starts and lower than the sintering start temperature at which the constraining layer starts sintering. A second step of sintering the layer, the first and second nonmagnetic ferrite layers, and the first and second dielectric layers; and (c) the constrained layer that has not been sintered from the composite laminate. And a third step of taking out the laminated body that has been sintered.

According to the above method, deformation of the laminated body in the interface direction is prevented at the interface between the laminated body and the constraining layer by the constraining layer pressure-bonded to the laminated body. Therefore, since the laminated body contracts only in the lamination direction by firing, a highly accurate LC co-sintered substrate can be produced by the laminated body that has been sintered.

Since the capacitor is formed in only one of the first and second dielectrics laminated on both sides of the magnetic layer, the capacitor is formed on both sides of the coil formed in the magnetic layer. Thus, it is possible to prevent a decrease in inductance value of the coil formed inside the magnetic layer.

According to the present invention, an LC co-sintered substrate can be produced with high accuracy, and a decrease in the inductance value of the coil can be prevented.

It is sectional drawing of LC co-sintered board | substrate. Example 1 It is principal part sectional drawing of LC co-sintered board | substrate. (Example 2) It is principal part sectional drawing of LC co-sintered board | substrate. (Modification) It is sectional drawing of a coil built-in board | substrate. (Conventional example)

Hereinafter, embodiments of the present invention will be described with reference to FIGS.

<Example 1> The LC co-sintered substrate 10 of Example 1 will be described with reference to FIG. FIG. 1 is a cross-sectional view showing a configuration of the LC co-sintered substrate 10.

As shown in FIG. 1, in the LC co-sintered substrate 10, land electrodes 26a to 26c for mounting components on the LC co-sintered substrate 10 are formed on one main surface 12a of the substrate main body 12.

Terminal electrodes

28a and 28b for mounting the LC co-sintered substrate 10 on another circuit board or the like are formed on the other main surface 12b. When no components are mounted on the LC co-sintered substrate 10, the land electrodes 26a to 26c can be eliminated. Further, a part of the via-hole conductors 24a to 24c connected to the land electrodes 26a to 26c can be eliminated.

The substrate body 12 includes, in order, a first dielectric layer 16a, a first nonmagnetic ferrite layer 18a, a first magnetic layer 14a, an intermediate nonmagnetic ferrite layer 18c, a second magnetic layer 14b, and a second nonmagnetic. A ferrite layer 18b and a second dielectric layer 16b are laminated. The first and second

magnetic layers

14a and 14b include, for example, magnetic ferrite mainly composed of iron oxide, zinc oxide, nickel oxide, and copper oxide, and a ceramic material. That is, the first and second

magnetic layers

14a and 14b include a magnetic ceramic material. The first and second

dielectric layers

16a and 16b include a dielectric ceramic material. The first and second nonmagnetic ferrite layers 18a and 18b and the intermediate nonmagnetic ferrite layer 18c include, for example, nonmagnetic ferrite mainly composed of iron oxide, zinc oxide, and copper oxide, and a ceramic material.

In the substrate body 12, via-hole conductors 24a to 24c, a coil 20, and a capacitor 22 are formed. The coil 20 is connected to the via-

hole conductors

24b and 24c via the

wiring conductors

21a and 21b. The capacitor 22 is connected to the via-

hole conductors

24a and 24c.

The coil 20 is formed inside the first and second

magnetic layers

14a and 14b and the intermediate nonmagnetic ferrite layer 18c. By forming the intermediate nonmagnetic ferrite layer 18c between the first and second

magnetic layers

14a and 14b, the characteristics of the inductor can be improved as compared with the case where the coil is formed only in the magnetic layer without the intermediate nonmagnetic ferrite layer 18c. Can be improved.

The capacitor 22 is formed only in one 16b of the first and second

dielectric layers

16a and 16b, and no capacitor is formed in the other 16a. Since the capacitor 22 is formed only on one side of the coil 20, a better inductance value can be obtained than in the case where the capacitor is formed on both sides of the coil 20.

Since no capacitor is formed on the first dielectric layer 16a, the thickness of the first dielectric layer 16a can be made smaller than the thickness of the second dielectric layer 16b to make the substrate body 12 thinner. .

The LC co-sintered substrate 10 is mainly composed of alumina or the like on both upper and lower main surfaces of an unfired multilayer ceramic body (laminated body) formed by laminating a ceramic green sheet that can be fired at a low temperature and a conductor pattern made of a low melting point metal. The shrinkage-suppressing layers to be adhered are brought into close contact with each other, fired at the firing temperature of the multilayer ceramic body (laminated body), and then the unsintered shrinkage-suppressing layer is removed. When manufactured by the non-shrinking method, the thickness of the first dielectric layer 16a and the thickness of the second dielectric layer 16b are different, and the substrate body 12 can be manufactured with high accuracy even if the configuration of the substrate body 12 is not symmetric. Even if the configuration of the substrate body 12 is not symmetrical, manufacturing variations such as warpage and distortion are reduced.

Next, a manufacturing process in the case where the LC co-sintered substrate 10 is produced in an aggregate substrate state will be described.

(1) First, to form each layer of the substrate body 12 and the constraining layer, an unsintered ceramic green sheet containing ceramic material powder and formed into a sheet shape is prepared.

For the ceramic green sheets used as the first and second

magnetic layers

14a and 14b, for example, magnetic ferrite containing iron oxide, zinc oxide, nickel oxide and copper oxide as main components is used. For the ceramic green sheet that becomes the first and second nonmagnetic ferrite layers 18a, 18b and the intermediate nonmagnetic ferrite layer 18c, for example, nonmagnetic ferrite containing iron oxide, zinc oxide, and copper oxide as main components is used.

In the ceramic green sheet, a through hole is processed at an appropriate position by laser processing, punching processing, or the like, and a conductor paste is embedded in the through hole by printing or the like, thereby arranging a portion that becomes a via hole conductor after firing. Also, the coil 20, the capacitor 22, the wiring conductor 21a, the conductor paste is printed on one main surface of the ceramic green sheet by screen printing or gravure printing, or by transferring a metal foil having a predetermined pattern shape. A conductor pattern for forming 21b is formed.

The shrinkage-suppressing green sheet used for the constraining layer is an unsintered green sheet formed into a sheet shape. The green sheet for shrinkage suppression includes an inorganic material powder such as alumina that is sintered at a temperature higher than the firing temperature of the ceramic green sheet for forming each layer of the substrate body 12, and a ceramic for forming each layer of the substrate body 12. The green sheet is not substantially sintered at the sintering temperature.

(2) Next, an unsintered ceramic green sheet that forms each layer of the substrate body 12 is laminated to produce a composite laminate in which constraining layers including shrinkage-suppressing green sheets are arranged on both sides in the lamination direction of the laminate. To do. A relatively small pressure is applied in the stacking direction to temporarily press-bond each layer of the stack and the constraining layer.

The composite laminate may be prepared by preparing a temporarily bonded laminate and then laminating the shrinkage-suppressing green sheets and further temporarily pressing, or the ceramic green sheets that form the layers of the substrate body 12 and the shrinkage suppression. It may be produced by laminating the green sheets for use and then temporarily pressing them together.

The constraining layer may be formed by applying a slurry for producing a shrinkage-suppressing green sheet by screen printing on a laminate in which unsintered ceramic green sheets forming each layer of the substrate body 12 are laminated. . You may form by forming the green sheet for shrinkage | contraction suppression on a support body, and transferring it on the laminated body which laminated | stacked the unsintered ceramic green sheet which forms each layer of the board | substrate body 12. FIG.

(3) Next, a relatively large pressure is applied to the composite laminate, and a constraining layer is finally bonded to the laminate.

(4) Next, the composite laminate in which the constraining layer is finally bonded to the laminate is fired. Firing is performed under the conditions in which the ceramic material powder included in the ceramic green sheet forming each layer of the laminate that becomes the substrate body 12 is sintered and the inorganic material powder included in the green sheet for suppressing shrinkage of the constraining layer is not sintered. Do. That is, the firing is performed at a temperature higher than the firing temperature of the ceramic green sheet forming each layer of the laminated body that becomes the substrate body 12 and lower than the firing temperature of the green sheet for suppressing shrinkage of the constraining layer.

(5) Next, by removing the constraining layer from the fired composite laminate, the fired laminate, that is, the LC co-sintered substrate 10 is taken out, and the

main surfaces

12a and 12b of the substrate body 12 are removed as necessary. The land electrodes 26a to 26c and the

terminal electrodes

28a and 28b formed in the above are plated.

(6) Mount components such as surface mount components and IC chips on the land electrodes 26a to 26c of the LC co-sintered substrate 10 completed in the above process, and divide it into individual pieces of the LC teaching substrate. To do.

<Production Example 1>
The first and second

magnetic layers

14a and 14b each have a thickness after firing of 100 to 2000 μm and a permeability μ = about 290. The first and second nonmagnetic ferrite layers 18a and 18b and the intermediate nonmagnetic ferrite layer 18c each have a thickness after firing of 10 to 100 μm and a magnetic permeability μ = 1. Each of the first and second

dielectric layers

16a and 16b is a glass ceramic having a thickness after firing of 10 to 400 μm and a relative dielectric constant ε = 8.8. The material of the land electrodes 26a to 26c and the

terminal electrodes

28a and 28b is Ag, Cu or the like.

For example, the first and second

magnetic layers

14a and 14b have a linear expansion coefficient α = 10, and the first and second nonmagnetic ferrite layers 18a and 18b and the intermediate nonmagnetic ferrite layer 18c have a linear expansion coefficient α = 9. .4, and the first and second

dielectric layers

16a and 16b have a linear expansion coefficient α = 7.7. Thereby, the thermal deformation difference between the layers of the laminated body at the time of firing can be relaxed, and the occurrence of cracks and the like can be prevented.

After sintering the laminate before firing with a constraining layer having a thickness of 50 to 1000 μm made of alumina material or the like at a maximum temperature of 850 to 990 ° C., the constraining layer is removed.

When the capacitor 22 is formed only inside the second dielectric layer 16b on one side with respect to the

magnetic layers

14a and 14b, an asymmetric structure is obtained. In this case, warpage of the substrate body 12 after firing can be suppressed by adjusting the number and thickness of the constraining layers on the front and back of the laminate.

For example, in Production Example 1 of the substrate body 12 whose main surface is a square of 135 mm × 135 mm, the deviation of each side of the main surface from the straight line (nonlinear distortion) is within 50 μm, and the firing shrinkage rate is 99.5 to 100%, that is, the area after firing of the main surface constrained by the constraining layer is 99.0 to 100% of the area before firing, and a highly accurate substrate body 12 can be obtained even with an asymmetric configuration. Can do.

When a capacitor is formed on both sides of the coil 20, the inductance value of the coil 20 is lowered. However, since the capacitor 22 is formed only on one side of the coil 20, the inductance value of the coil 20 can be improved. Since the first dielectric layer 16a on which the capacitor 22 is not formed can be made thinner, the thickness of the substrate body 12 can be made thinner than when capacitors are formed on both sides of the coil 20.

<Production Example 2> The magnetic material of the

magnetic layers

14a and 14b has a permeability μ = 2 to 500, and the nonmagnetic ferrite contained in the nonmagnetic ferrite layers 18a to 18c has a permeability μ = 1, and the dielectric layer 16a. , 16b is a glass ceramic having a relative dielectric constant ε = 5 to 80. In this case as well, even in the case of the asymmetric configuration, the highly accurate substrate body 12 can be obtained and the thickness of the substrate body 12 can be reduced as in the case of the manufacturing example 1.

<Production Example 3> FIG. 3 shows a cross-sectional view of the main part of the configuration of a modification example in which a gap 29 is provided between the coil 20 and the

magnetic layers

14a and 14b in Production Examples 1 and 2.

A carbon paste is applied by screen printing so as to be in contact with the conductor pattern forming the coil 20, and the carbon burns and disappears by firing, thereby forming a gap 29 at the boundary between the coil 20 and the

magnetic layers

14a and 14b. Magnetostriction due to residual stress occurs in the substrate body 12 after firing due to the difference in the linear expansion coefficient (thermal expansion coefficient) between the coil 20 and the

magnetic layers

14a and 14b, and thus the voltage conversion efficiency of the coil 20 is reduced due to iron loss. It can be seen. By providing the air gap 29 between the coil 20 and the

magnetic layers

14a and 14b, the stress of the magnetic layer around the coil 20 can be relieved and the characteristics of the coil 20 can be improved.

Note that a thin magnetic layer may be provided between the coil 20 and the gap 29. Even in this case, by providing the air gap 29, the stress in the magnetic layer around the coil 20 can be relieved and the characteristics of the coil 20 can be improved.

<Example 2> The LC co-sintered substrate of Example 2 will be described with reference to FIG. The LC co-sintered substrate of Example 2 is configured in substantially the same manner as the LC co-sintered substrate 10 of Example 1. In the following, the same reference numerals are used for the same components as in the first embodiment, and differences from the first embodiment will be mainly described.

FIG. 2 is a cross-sectional view of the main part showing the configuration of the LC co-sintered substrate of Example 2. As shown in FIG. 2, in the LC co-sintered substrate of Example 2, the configuration of the coil 20a formed on the first and second

magnetic layers

14a and 14b and the intermediate nonmagnetic ferrite layer 18c is the same as that of Example 1. Is different.

That is, in the coil 20a, large and

small conductor patterns

20s and 20t formed in a substantially C shape are arranged concentrically and alternately in the stacking direction of each layer of the substrate body 12, and are connected via via hole conductors (not shown). Yes. The large and

small conductor patterns

20 s and 20 t are arranged so as not to overlap each other when seen through from the stacking direction of each layer of the substrate body 12. Since the

conductor patterns

20s and 20t of the coil 20a are arranged at different positions, the thickness change in the stacking direction of the substrate body 12 can be reduced. Therefore, the flatness of the surface of the substrate body 12 can be improved. Moreover, the cracking can be prevented by dispersing the firing stress generated between the

conductor patterns

20s and 20t of the coil 20a and the

magnetic layers

14a and 14b.

Also in Example 2, by providing the air gap 29 between the coil 20a and the

magnetic layers

<Summary> As described above, among the first and second

dielectric layers

16a and 16b arranged on both sides of the

magnetic layers

14a and 14b in which the coil 20 is formed, the capacitor 22 is provided only on one 16b. By using the formed asymmetric configuration, it is possible to prevent a decrease in the inductance value of the coil 20. Even with an asymmetric configuration, an LC co-sintered substrate can be produced with high accuracy by a non-shrinking method in which the constraining layer is baked in a pressure-bonded state.

It should be noted that the present invention is not limited to the above embodiment, and can be implemented with various modifications.

10 LC co-sintered substrate 12

Substrate body

14a, 14b

Magnetic layer

16a,

16b Dielectric layer

18a, 18b, 18c

Nonmagnetic ferrite layer

20, 20a Coil 22 Capacitor 24a-24c Via-hole conductor 26a-

26c Land electrode

28a, 28b Terminal electrode

Claims

A substrate body having a magnetic layer containing a magnetic ceramic material, and first and second dielectric layers laminated on both sides of the magnetic layer and containing a dielectric ceramic material;
A coil formed inside the magnetic layer;
A capacitor formed within only one of the first and second dielectric layers;
An LC co-sintered substrate, comprising:
The substrate body further includes first and second nonmagnetic ferrite layers that are laminated between the magnetic layer and the first and second dielectric layers and include a nonmagnetic ferrite ceramic material. The LC co-sintered substrate according to claim 1.
The magnetic layer of the substrate body includes at least two first and second magnetic layers,
The LC co-firing according to claim 1 or 2, wherein the substrate body further includes an intermediate nonmagnetic ferrite layer containing a nonmagnetic ferrite ceramic material between the first and second magnetic layers. Bonding board.
The LC co-sintered substrate according to any one of claims 1 to 3, wherein a gap is provided between the coil and the magnetic layer.
The LC co-sintered substrate according to claim 4, wherein a thin layer of the magnetic layer is provided between the coil and the gap.
The thickness of the one of the first and second dielectric layers in which the capacitor is formed is different from the thickness of the other of the first and second dielectric layers. The LC co-sintered substrate according to any one of claims 1 to 5.
The one of the first and second dielectric layers having the capacitor formed therein is thicker than the other of the first and second dielectric layers. The LC co-sintered substrate according to any one of claims 1 to 5.
Passing through at least one of the first and second dielectric layers and the magnetic layer of the substrate body in the stacking direction of the first and second dielectric layers and the magnetic layer, the coil and the magnetic layer The LC co-sintered substrate according to claim 7, further comprising a via-hole conductor connected to at least one of the capacitors.
The terminal electrode for mounting the LC co-sintered substrate is formed on the one of the first and second dielectric layers in which the capacitor is formed. The LC co-sintered substrate according to any one of 1 to 8.
The land electrode for mounting a component on the LC co-sintered substrate is formed on the other of the first and second dielectric layers, according to any one of claims 1 to 9, The LC co-sintered substrate as described.
Non-sintered that includes a magnetic ceramic material and includes a non-magnetic ferrite ceramic material on both sides of the main surface of the unsintered magnetic layer including a part that becomes a coil inside, and a part that becomes a capacitor only inside one of them The first and second non-magnetic ferrite layers are laminated and pressure-bonded, and the first and second non-magnetic ferrite layers on the main surface opposite to the magnetic layer contain a dielectric ceramic material. The first and second dielectric layers of the unfired laminate in which the first and second dielectric layers are laminated and pressure-bonded are the magnetic layer and the first and second non-magnetic ferrite layers. On the opposite main surface, the magnetic layer, the first and second nonmagnetic ferrite layers, and the first and second dielectric layers are sintered at a temperature higher than a sintering start temperature at which the sintering starts. A composite laminate in which a constraining layer that initiates bonding is laminated and pressure-bonded A first step of forming,
The composite laminate is higher than the sintering start temperature at which the magnetic layer, the first and second nonmagnetic ferrite layers, and the first and second dielectric layers start sintering, and the The constraining layer is fired at a temperature lower than a sintering start temperature at which sintering starts, and the magnetic layer, the first and second nonmagnetic ferrite layers, and the first and second dielectrics of the laminated body. A second step of sintering the layers;
A third step of removing the unsintered constraining layer from the composite laminate and taking out the laminate that has been sintered;
A method for producing an LC co-sintered substrate, comprising: