JP2010016141A - Ceramic board with built-in part and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a ceramic board with a built-in part capable of easily building in a part and improving a degree of freedom in design. <P>SOLUTION: The ceramic board 1 with the built-in parts has a plurality of ceramic members 10 extended in the A direction and formed rectangularly, through-holes 11 formed in at least a part of a plurality of ceramic members 10 and chip-type electronic parts 30 built in the ceramic members 10 by disposition in the through-holes 11 of the ceramic members 10. The ceramic board 1 with the built-in parts further has wiring sections being fitted to the ceramic members 10 and containing wiring conductors 12 electrically connected to the chip-type electronic parts 30. The plurality of ceramic members 10 are configured tabularly by connections in the B direction orthogonal to the A direction. The chip-type electronic parts 30 are disposed substantially in parallel to a main surface 2 in the ceramic members 10. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a ceramic substrate and a manufacturing method thereof, and more particularly to a ceramic substrate with a built-in component and a manufacturing method thereof.

  As electronic devices become more functional and lighter, thinner and smaller, substrates with electronic components mounted thereon are also required to have higher functionality. Conventionally, a ceramic multilayer substrate in which a chip-type electronic component is incorporated is known as a substrate that can cope with higher functionality (for example, see Patent Document 1).

  Patent Document 1 describes a ceramic multilayer substrate in which a plurality of chip-type ceramic electronic components are arranged in an interlayer portion (interface portion between upper and lower ceramic layers) of a multilayer substrate in which a plurality of ceramic layers are laminated. . In this ceramic multilayer substrate, chip-type ceramic electronic components are disposed in a plurality of interlayer portions, and each chip-type ceramic electronic component is electrically connected to an internal conductor of the multilayer substrate. The lower layer internal wiring and the upper layer internal wiring are electrically connected via via conductors.

  The ceramic multilayer substrate has a surface electrode formed on the main surface, and a plurality of surface mount components are mounted on the surface electrode. The chip-type ceramic electronic component is disposed in parallel to the ceramic layer.

JP 2006-128583 A

  However, in the above-described conventional ceramic multilayer substrate, for example, when a chip-type ceramic electronic component disposed on the lower layer side is directly electrically connected to the surface electrode, it is necessary to provide via conductors over a plurality of ceramic layers. For this reason, since it becomes difficult to electrically connect the surface-mounted component to the chip-type ceramic electronic component, there is an inconvenience that it is difficult to design a plurality of applications. As a result, the conventional ceramic multilayer substrate has a problem that it is difficult to increase the degree of freedom in design (mounting freedom) because it is difficult to use the ceramic multilayer substrate for purposes other than a specific purpose.

  When the chip-type ceramic electronic component is arranged in parallel to the ceramic layer as in the ceramic multilayer substrate described in Patent Document 1, it is difficult to incorporate the chip-type ceramic electronic component in the substrate. There is also a problem.

  The present invention has been made to solve the above-described problems. An object of the present invention is to provide a component-embedded ceramic substrate capable of easily incorporating components and increasing the degree of design freedom. It is to provide a manufacturing method.

  To achieve the above object, a component-embedded ceramic substrate according to a first aspect of the present invention is formed on a plurality of ceramic members formed in a strip shape extending in a first direction and at least a part of the plurality of ceramic members. An electronic component housed in the ceramic member by being disposed in the hole portion of the ceramic member, and a wiring portion including a wiring conductor provided in the ceramic member and electrically connected to the electronic component. I have. The plurality of ceramic members are configured in a plate shape by being connected in a second direction that intersects the first direction, and the plurality of ceramic members configured in the plate shape include the first direction and the first direction. It has a main surface along two directions. Further, by providing the hole portion in the predetermined portion of the ceramic member so as to extend along the second direction, the electronic component is disposed substantially parallel to the main surface inside the ceramic member, A part of the wiring conductor is exposed from the main surface.

  In the component-embedded ceramic substrate according to the first aspect, as described above, a plurality of ceramic members formed in a strip shape extending in the first direction are connected in a second direction intersecting the first direction to form a plate shape. By comprising in this, the board | substrate which is not laminated | stacked on the thickness direction can be obtained. For this reason, unlike a ceramic substrate having a multilayer structure, a surface mount component mounted on the main surface and an electronic component built in the ceramic member can be electrically connected without providing a via conductor or the like. . Thereby, since it is possible to easily design a plurality of uses, it can be easily configured to be used for uses other than a specific use. Therefore, by configuring as described above, the degree of freedom in design can be increased. The passive connection and the surface mounting component can be electrically connected by electrically connecting a part of the wiring conductor exposed from the main surface and the surface mounting component. Further, the wiring conductor can be partially exposed from the main surface, for example, via a connecting portion of adjacent ceramic members.

  In the component-embedded ceramic substrate according to the first aspect, by providing a hole portion extending along the second direction (connection direction) in a predetermined portion of the ceramic member, and by disposing the electronic component in the hole portion, Even when the electronic component is disposed substantially parallel to the main surface, the electronic component can be easily built in the ceramic substrate.

  In the component-embedded ceramic substrate according to the first aspect, preferably, a pad electrode electrically connected to a portion exposed from the main surface of the wiring conductor is formed on the main surface. If comprised in this way, the surface mounting component mounted on a main surface and the electronic component incorporated can be electrically connected more easily.

  In the ceramic substrate with built-in component according to the first aspect, the ceramic member is preferably made of a glass ceramic material. If constituted in this way, the glass ceramic material can be fired at a low temperature of 1000 ° C. or lower, so that it can be fired simultaneously with silver (Ag) or copper (Cu) having a small specific resistance. For this reason, a wiring part can be formed simultaneously with baking of a ceramic member by comprising a wiring part from silver (Ag), copper (Cu), etc. FIG. Also, with this configuration, it is possible to suppress changes in the characteristics of the electronic component built into the ceramic member. This also facilitates the incorporation of the component and increases the functionality. it can. As the glass ceramic material, for example, a low temperature co-fired ceramics (LTCC) material can be used.

  In the component-embedded ceramic substrate according to the first aspect, the ceramic member includes a plurality of electronic components, and each of the plurality of electronic components may be composed of passive components. Each of the plurality of passive components can be composed of any one of a resistance element, an inductor element, and a capacitor element.

  In the component-embedded ceramic substrate according to the first aspect, the electronic component is preferably composed of a chip-type electronic component.

  In the ceramic substrate with a built-in component according to the first aspect, the electronic component is formed by filling at least one of a resistance material, a capacitor material, and an inductor material in the hole, and then simultaneously firing with the ceramic member. Also good. If comprised in this way, the component built-in ceramic substrate in which the electronic component (passive component) was incorporated can be obtained easily.

  In the component-embedded ceramic substrate according to the first aspect, the electronic component can be provided in one ceramic member or across a plurality of adjacent ceramic members.

  The component-embedded ceramic substrate according to the first aspect described above preferably includes a plurality of ceramic member groups having a plurality of ceramic members connected to each other by firing, and the plurality of ceramic member groups are connected to each other, thereby The member is configured in a plate shape. If comprised in this way, a design freedom can be raised more by combining a ceramic member group.

  In this case, at least some of the plurality of ceramic member groups may be electrically connected to each other. In this case, for example, a part of the wiring part and the terminal part of the electronic component can be exposed to the side end faces (opposite side end faces) of the adjacent ceramic member groups, and these can be electrically connected with solder or the like. .

  In the structure including the plurality of ceramic member groups, a resin material is preferably sealed between one ceramic member group and the other adjacent ceramic member group. If comprised in this way, while the connection strength between ceramic member groups can be improved with a resin material, an electrical connection part can be protected with a resin material.

  In the component-embedded ceramic substrate according to the first aspect, preferably, the plurality of ceramic members include at least one of a first ceramic member having a different dielectric constant and a second ceramic member having a different magnetic permeability. If comprised in this way, when a circuit is comprised using an electronic component and a wiring conductor, reduction of stray capacitance, adjustment of an inductance, etc. can be performed easily. As a result, frequency characteristics and the like can be improved, so that higher functionality can be achieved while increasing the degree of freedom in design. In addition, when such a configuration is applied to the component-embedded ceramic substrate according to the first aspect, a circuit can be configured using only the electronic components embedded in the first ceramic member having a different dielectric constant. In other words, the circuit can be configured without going through any part other than the first ceramic member. Moreover, a circuit can also be comprised using only the electronic component incorporated in the 2nd ceramic member from which magnetic permeability differs. In other words, the circuit can be configured without going through any part other than the second ceramic member. For this reason, it is possible to increase the degree of freedom in design and to easily enhance the functionality of the component-embedded ceramic substrate. Furthermore, if such a configuration is applied to the component-embedded ceramic substrate according to the first aspect, the surface mount component can be easily straddled across ceramic members having different magnetic permeability and dielectric constant, and electrical connection with a desired electronic component can be achieved. Connection can be made. In addition, the dielectric constant and magnetic permeability of a ceramic member can be changed by changing the material system of the constituent material which comprises a ceramic member.

  In the component-embedded ceramic substrate according to the first aspect, the ceramic member configured in a plate shape has a first side end surface along the first direction and a second side end surface along the second direction, and the first side end surface and The second side end face is provided with a first terminal electrode and a second terminal electrode, respectively, and exhibits different functions or different performances when using the first terminal electrode and when using the second terminal electrode. Thus, it is preferable that the electronic component and the wiring part are connected. If comprised in this way, a design freedom can further be raised.

  In the component-embedded ceramic substrate according to the first aspect, a filter circuit can be configured by the electronic component and the wiring portion.

  In this case, the filter circuit preferably includes at least one of a low-pass filter and a high-pass filter.

  A method of manufacturing a component-embedded ceramic substrate according to a second aspect of the present invention includes a step of forming a hole portion penetrating in a thickness direction in at least a part of a plurality of ceramic green sheets, and an electronic component is disposed in the hole portion Forming a wiring portion including a wiring conductor having a predetermined pattern on at least a part of a plurality of ceramic green sheets; and forming an unfired ceramic laminate by laminating the plurality of ceramic green sheets A step of firing the unfired ceramic laminate at a predetermined temperature, and a step of cutting the fired ceramic laminate substantially parallel to the lamination direction with a predetermined thickness.

  In the method for manufacturing a component-embedded ceramic substrate according to the second aspect, as described above, the degree of freedom in design is increased by cutting the fired ceramic laminate with a predetermined thickness substantially parallel to the lamination direction. It is possible to manufacture a ceramic substrate with built-in components that can be

  Further, in the method for manufacturing a component-embedded ceramic substrate according to the second aspect, an electronic component can be easily formed by forming a hole portion penetrating in the thickness direction in the ceramic green sheet and disposing the electronic component in the hole portion. Can be built in.

  The method for manufacturing a component-embedded ceramic substrate according to the second aspect further includes a step of forming a via hole in at least a part of the plurality of ceramic green sheets, and the step of forming the wiring portion fills the via hole with a conductive paste. Preferably, the method includes a step of forming a via conductor.

  In the method for manufacturing a component-embedded ceramic substrate according to the second aspect, the electronic component can be composed of a chip-type electronic component. In this case, it is preferable to provide a step of pressing the unfired ceramic laminate with an isostatic press prior to the step of firing the ceramic laminate. If comprised in this way, a press work can be performed with a sufficient yield, without damaging a chip-type electronic component.

  In the method of manufacturing a component-embedded ceramic substrate according to the second aspect, the step of disposing the electronic component in the hole includes a step of filling the hole with a constituent material constituting the electronic component, and the hole is filled You may comprise so that an electronic component may be formed when a constituent material is simultaneously fired with a ceramic laminated body.

  In this case, preferably, the constituent material includes a resistance material constituting the resistance element, a capacitor material constituting the capacitor element, and an inductor material constituting the inductor element. If comprised in this way, a resistive element, a capacitor | condenser element, or an inductor element can be easily formed in the inside of a ceramic substrate.

  In this case, the ceramic laminate is preferably cut at a predetermined thickness for dividing the constituent material filled in the hole. If comprised in this way, the performance of an electronic component (passive component) can be changed with a cutting position. For example, the resistance value of the resistance element can be changed.

  As described above, according to the present invention, it is possible to easily obtain a component-embedded ceramic substrate and a method for manufacturing the same, which can easily incorporate components and increase the degree of design freedom.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments embodying the present invention will be described in detail with reference to the drawings.

(First embodiment)
FIG. 1 is an overall perspective view of a component-embedded ceramic substrate according to a first embodiment of the present invention. FIG. 2 is a perspective view showing a part-embedded ceramic substrate according to the first embodiment of the present invention with a part thereof omitted. FIG. 3 is a plan sectional view of the ceramic substrate with built-in component according to the first embodiment of the present invention. 4 to 6 are views for explaining the structure of the component-embedded ceramic substrate according to the first embodiment of the present invention. First, the structure of the component-embedded ceramic substrate 1 according to the first embodiment of the present invention will be described with reference to FIGS.

  The component-embedded ceramic substrate 1 according to the first embodiment has a structure in which a plurality of ceramic members 10 formed in a strip shape are connected, as shown in FIGS. Specifically, the component-embedded ceramic substrate 1 has a plurality of strip-shaped ceramic members 10 having a predetermined thickness and extending in the B direction (first direction). 10 are connected in the A direction (second direction) orthogonal to the B direction to form a plate shape. For this reason, the component built-in ceramic substrate 1 has a main surface 2 along the A direction and the B direction.

  Further, as shown in FIGS. 2 and 3, the component built-in ceramic substrate 1 is formed in a quadrangular shape when seen in a plan view. For this reason, the component built-in ceramic substrate 1 has a pair of first side end faces 3 along the B direction and a pair of second side end faces 4 along the A direction.

  A plurality of chip-type electronic components (chip components) 30 are disposed inside the ceramic member 10. As shown in FIG. 3, the chip-type electronic component 30 has a ceramic sintered body as a base body and has external terminal electrodes 31 at both ends thereof. In addition, a ceramic sintered body fired at a temperature of 1200 ° C. or higher, such as barium titanate or ferrite, is used for the element body of the chip-type electronic component 30. The chip-type electronic component 30 is an example of the “electronic component” and “passive component” in the present invention.

  Here, in the first embodiment, the chip-type electronic component 30 is ceramic member 10 so as to be substantially parallel to the main surface 2 of the component-embedded ceramic substrate 1 (along the main surface 2). Is disposed inside. The chip-type electronic component 30 is disposed along the connecting direction (A direction) of the ceramic member 10. Specifically, the chip-type electronic component 30 has one external terminal electrode 31 located on one second side end face 4 side (A1 side) and the other external terminal electrode 31 on the other side as viewed in a plan view. It is arrange | positioned so that it may be located in the 2nd side end surface 4 side (A2 side). That is, the chip-type electronic component 30 is disposed in the ceramic member 10 so that the external terminal electrode 31 is positioned in the vicinity of the connection portion (interface portion) of the ceramic member 10.

  In the first embodiment, a through hole 11 extending in the connecting direction (direction A) is provided in a predetermined portion of the ceramic member 10. The through-hole 11 is formed in a size corresponding to the chip-type electronic component 30. By disposing the chip-type electronic component 30 in the through-hole 11, the chip-type electronic is formed inside the ceramic substrate. A component 30 is incorporated. Further, by forming the through hole 11 continuously over the plurality of ceramic members 10, the chip electronic component 30 can be provided across the plurality of adjacent ceramic members 10. Thereby, even a relatively large chip-type electronic component 30 can be built in the ceramic substrate. The through hole 11 is an example of the “hole” in the present invention.

  Further, in the first embodiment, the wiring conductor 12 that is electrically connected to the external terminal electrode 31 of the chip-type electronic component 30 is provided at the connecting portion (interface portion) of the ceramic members 10 adjacent to each other. The wiring conductor 12 is made of a conductive material having a small specific resistance such as Ag (silver) or Cu (copper).

  On the other hand, the plurality of chip-type electronic components 30 include a resistance element (R), an inductor element (L), and a capacitor element (C), and these chip-type electronic components 30 are electrically connected to the wiring conductor 12. Thus, a circuit is formed. Specifically, a filter circuit (for example, an RC filter, an LC filter, or an LR filter) such as a low-pass filter (LPF) or a high-pass filter (HPF) is formed by the chip-type electronic component 30 and the wiring conductor 12. Further, as shown in FIG. 3, via conductors 13 are provided in predetermined portions of the ceramic member 10, thereby providing electrical continuity between the wiring conductors (between chip-type electronic components). The via conductor 13 is formed by filling a wiring conductor in a via hole provided in a predetermined portion of the ceramic member 10 so as to extend in the A direction. Further, at least some of the via conductors 13 among the plurality of via conductors 13 are exposed from the main surface 2. The wiring conductor 12 and the via conductor 13 constitute a wiring portion.

Each of the ceramic members 10 is made of an LTCC material (low temperature fired ceramic material) that is a glass ceramic material. This LTCC material is a ceramic material that can be fired at a temperature of 1000 ° C. or less and can be simultaneously fired with Ag (silver), Cu (copper), or the like having a small specific resistance. Specifically, the LTCC material is, for example, a glass composite LTCC material obtained by mixing borosilicate glass with ceramic powder such as alumina or forsterite, and ZnO—MgO—Al ₂ O ₃ —SiO ₂ crystallization. Non-glass system using crystallized glass LTCC material using glass, BaO—Al ₂ O ₃ —SiO ₂ ceramic powder, Al ₂ O ₃ —CaO—SiO ₂ —MgO—B ₂ O ₃ ceramic powder, etc. It is composed of LTCC material. The LTCC material can be appropriately selected according to the purpose.

  As described above, by configuring the ceramic member 10 from a glass ceramic material, it is possible to use a conductive material having a small specific resistance such as Ag (silver) or Cu (copper) for the wiring conductor 12. The wiring conductor 12 (wiring portion) can be simultaneously fired at a low temperature of 1000 ° C. or lower. Further, since the glass ceramic material has a dielectric constant lower than that of alumina, the signal delay is small, and the thermal expansion coefficient is close to that of silicon, so that the surface mount component 500 described later can be easily mounted on the main surface 2. It becomes possible.

  In the first embodiment, the plurality of ceramic members 10 are divided into a plurality of ceramic member groups 20 in which a relatively small number (about 2 to 10) of ceramic members 10 are connected by firing. These ceramic member groups 20 are connected to each other in the A direction, whereby the component built-in ceramic substrate 1 is configured.

  A part of the external terminal electrode 31, a part of the wiring conductor 12, or a part of the via conductor 13 of the chip type electronic component 30 is exposed on the side end face along the B direction of the ceramic member group 20. The external terminal electrode 31, wiring conductor 12 or via conductor 13 of one ceramic member group 20 and the external terminal electrode 31, wiring conductor 12 or via conductor 13 of the other adjacent ceramic member group 20 are, for example, soldered. 21 and the like. A sealing resin (resin material) 22 is sealed between one ceramic member group 20 and the other adjacent ceramic member group 20 (boundary portion). The sealing resin 22 is made of, for example, a resin material in which a filler such as silica is mixed with an epoxy resin.

  Further, a part of the wiring conductor 12 is exposed on the main surface 2 of the ceramic member 10 configured in a plate shape via a connecting portion (interface portion) of the ceramic members 10 adjacent to each other. A wiring layer (not shown) having a predetermined pattern and including the pad electrode 14 is formed on the main surface 2 of the ceramic member 10 configured in a plate shape. The wiring layer (pad electrode 14) is electrically connected to the wiring conductor 12 exposed from the main surface 2 and the via conductor 13 exposed from the main surface 2, and the pad electrode 14 is connected to FIG. As shown in FIG. 3, a surface mount component 500 is mounted. Thereby, the chip-type electronic component 30 incorporated in the ceramic substrate and the surface mount component 500 are electrically connected. Examples of the surface mount component 500 include semiconductor integrated circuit elements such as flip chip ICs and bare chip ICs, and passive elements such as resistor elements, inductor elements, and capacitor elements. The pad electrode 14 (wiring layer) can be formed using Ag (silver), Cu (copper), or the like, similarly to the wiring conductor 12.

  Further, as shown in FIG. 2, a part of the external terminal electrode 31 of the chip type electronic component 30, a part of the wiring conductor 12 or a part of the via conductor 13 is formed on the first side end surface 3 of the component built-in ceramic substrate 1. Is exposed. A first terminal electrode 15 electrically connected to these is formed on the first side end face 3. On the other hand, a part of the wiring conductor 12 is exposed on the second side end face 4 of the component-embedded ceramic substrate 1 through a connecting portion (interface portion) of the ceramic members 10 adjacent to each other. A second terminal electrode 16 electrically connected to these is formed on the second side end face 4.

  As shown in FIG. 1, the component-embedded ceramic substrate 1 having the above-described configuration has a surface-mounted component 500 mounted on the main surface 2, and the component-embedded ceramic substrate 1 itself is mounted on a mounting substrate 600. (Not shown). At this time, the terminal electrode (for example, the first terminal electrode 15) of the component built-in ceramic substrate 1 is electrically connected to the wiring pattern of the mounting substrate 600 by solder or the like, so that the component built-in ceramic substrate 1 and the mounting substrate 600 are connected to each other. Are electrically connected to each other.

  Note that, as shown in FIG. 5, the function or difference between the case where the first terminal electrode 15 (see FIG. 2) is used and the case where the second terminal electrode 16 (see FIG. 2) is used as shown in FIG. If the internal circuit of the component-embedded ceramic substrate 1 is configured so as to exhibit different performances, the component-embedded ceramic substrate 1 can be changed by simply changing the mounting direction of the component-embedded ceramic substrate 1 when mounted on the mounting substrate 600. It can be used for different purposes.

  In the first embodiment, as described above, a plurality of ceramic members 10 formed in a strip shape extending in the B direction are configured in a plate shape by connecting them in the A direction orthogonal to (intersecting) the B direction. A ceramic substrate that is not laminated in the thickness direction can be obtained. For this reason, unlike a ceramic substrate having a multilayer structure, the surface mount component 500 mounted on the main surface 2 without providing via conductors and the chip-type electronic component 30 built in the ceramic member 10 are electrically connected. Can be connected to. This makes it possible to easily design a plurality of applications, so that the component built-in ceramic substrate 1 can be easily configured to be used for applications other than specific applications. Therefore, by configuring as described above, the degree of freedom in design can be increased.

  In the first embodiment, the chip-type electronic component 30 can be arranged in a planar shape inside the ceramic substrate by arranging the chip-type electronic component 30 along the main surface 2. Thereby, the surface-mounted component 500 mounted on the main surface 2 can be disposed in the vicinity of the desired chip-type electronic component 30 and can be easily electrically connected to the chip-type electronic component 30.

  In the first embodiment, the through hole 11 extending along the A direction (connection direction) is provided in a predetermined portion of the ceramic member 10, and the chip-type electronic component 30 is disposed in the through hole 11. Even when the chip-type electronic component 30 is disposed substantially parallel to the main surface 2, the chip-type electronic component 30 can be easily incorporated in the ceramic substrate.

  In the first embodiment, the chip-type electronic component 30 disposed on the ceramic member 10 is composed of a resistance element, an inductor element, and a capacitor element, respectively, thereby providing a filter circuit such as a low-pass filter or a high-pass filter. It can be easily configured. Here, since the component-embedded ceramic substrate 1 is made of ceramic, the component-embedded ceramic substrate 1 is excellent in heat resistance and moisture resistance and can obtain good loss characteristics (frequency characteristics) in a high-frequency circuit. In addition to this, it is possible to obtain better frequency characteristics by forming the above-described filter circuit inside.

  Moreover, in 1st Embodiment, by combining the several ceramic member group 20 which has the several ceramic member 10 mutually connected by baking and connecting together, it is combining the ceramic member group 20 by comprising in plate shape. Therefore, the degree of design freedom can be further increased.

  In the first embodiment, the sealing resin 22 is sealed between the one ceramic member group 20 and the other adjacent ceramic member group 20, so that the sealing resin 22 allows the ceramic member groups 20 to be separated. The connection strength of the resin can be increased, and the electrical connection portion (solder portion) can be protected by the sealing resin 22.

  7 to 19 are views for explaining a method of manufacturing a component-embedded ceramic substrate according to the first embodiment of the present invention. Next, with reference to FIG. 1, FIG. 2 and FIGS. 7-19, the manufacturing method of the component built-in ceramic substrate 1 by 1st Embodiment of this invention is demonstrated.

First, a predetermined number of ceramic green sheets are produced using a slurry containing an LTCC material. Specifically, for example, the ceramic powder of the Al ₂ O _3, using low-temperature co-fired ceramic material that the borosilicate glass as a sintering aid to prepare a slurry, predetermined and coating the slurry on a carrier film A plurality of ceramic green sheets having a thickness are produced. At this time, the thickness of the ceramic green sheet is preferably determined in consideration of shrinkage in the subsequent steps (hydrostatic pressure pressing step and firing step), the size and the number of built-in chip-type electronic components 30, and the like. .

  Next, a via hole for forming the via conductor 13 and a through hole 11 for disposing the chip-type electronic component 30 are formed in a predetermined region of the produced ceramic green sheet as necessary. Specifically, a through hole penetrating in the thickness direction is formed using a laser processing method. Note that the through hole may be formed by using, for example, punching, photolithography, a drilling method, or the like other than the laser processing method. Then, as shown in FIG. 7, a conductive paste mainly composed of Ag powder or Cu powder is screen-printed on the ceramic green sheet 10a of the first layer to form the wiring conductor 12 having a predetermined pattern. At this time, the via conductor 13 is formed by filling the via hole with the conductive paste.

  Next, as shown in FIG. 8, the second ceramic green sheet 10a is laminated on the first ceramic green sheet 10a. Then, as shown in FIG. 9, the chip-type electronic component 30 is inserted (arranged) into the through hole 11 provided in the second layer ceramic green sheet 10 a using a mounter or the like. At this time, one external terminal electrode 31 of the chip-type electronic component 30 is electrically connected to the wiring conductor 12 (the wiring conductor 12 formed on the ceramic green sheet 10a of the first layer). Is inserted (arranged) in parallel (longitudinal direction) with the thickness direction (A direction) of the ceramic green sheet 10a.

  Subsequently, by using a method similar to the method shown in FIG. 7, a conductive paste is screen-printed on the second layer of the ceramic green sheet 10a to form the wiring conductor 12 having a predetermined pattern. Thereby, the wiring conductor 12 and the via conductor 13 are formed as shown in FIG. Here, when a relatively large chip-type electronic component 30 is built in, it is necessary to insert the chip-type electronic component 30 across a plurality of ceramic green sheets 10a. The through hole 11 is left as it is until the ceramic green sheets 10a are laminated to a predetermined depth.

  Next, as shown in FIG. 11, the third ceramic green sheet 10a is laminated on the second ceramic green sheet 10a. At this time, the through-hole 11 in which the relatively large chip-type electronic component 30 is disposed is laminated while aligning the ceramic green sheets 10a on the upper layer side so as to be continuous over a plurality of layers. Similarly to the above, the chip-type electronic component 30 is inserted into the through hole 11 using a mounter or the like. FIG. 12 shows a state in which the chip-type electronic component 30 is inserted into the through hole 11 in this way.

  Then, as shown in FIG. 13, the wiring conductor 12 and the via conductor 13 are formed in the third layer ceramic green sheet 10a in the same manner as described above. Thereby, the unfired ceramic laminate 1a is formed.

  Subsequently, as shown in FIG. 14, in order to bring the laminated ceramic green sheets 10a into close contact, an unfired ceramic laminate 1a is placed at a predetermined temperature (for example, about 70 ° C.) and a predetermined temperature by an isostatic press 700. Pressurization is performed with pressure (for example, 10 MPa to 100 MPa). And as shown in FIG. 15, the ceramic laminated body 1a pressurized by the isostatic press 700 is baked for a predetermined time at predetermined temperature (for example, about 850 degreeC).

  Here, when the plurality of ceramic green sheets 10a are laminated and fired, the chip-type electronic component 30 is incorporated therein, so that even when the thickness of the ceramic green sheets 10a is adjusted, the ceramic laminate 1a is strained. May occur. Since the distortion of the ceramic laminate 1a increases as the number of laminated layers increases, the number of laminated ceramic laminates 1a is preferably about 2 to 10 layers. Further, the outermost ceramic green sheet 10a is formed to be slightly thicker, and the wiring conductor 12 of the outermost ceramic green sheet 10a is also formed to be slightly thicker. When strain occurs, it is preferable to remove the strain (to make the surface flat) by polishing the surface of the outermost ceramic green sheet 10a. As a result, it is possible to suppress a decrease in manufacturing yield of the component built-in ceramic substrate 1.

  And as mentioned above, the ceramic green sheet 10a and the wiring conductor 12 (via conductor 13) are simultaneously fired, and the fired ceramic laminate 1a is obtained. Since the firing temperature at this time is fired at a relatively low temperature of 1000 ° C. or less (about 850 ° C.), the characteristics of the chip-type electronic component 30 incorporated in the ceramic laminate 1a change due to heat during firing. Is suppressed. A plurality of ceramic laminates 1a are prepared. In the above description, the number of laminated ceramic green sheets 10a is three. However, the number of laminated ceramic green sheets 10a may be other than three and can be variously changed. Moreover, the pattern of the chip-type electronic component 30 and the wiring conductor 12 can be variously changed according to the purpose.

  Subsequently, as shown in FIG. 16, the obtained plurality of ceramic laminates 1a are sequentially laminated. At this time, the lower ceramic laminate 1a and the upper ceramic laminate 1a are electrically connected to each other by solder 21 or the like. Specifically, the wiring conductor 12, the via conductor 13, or the external terminal electrode 31 of the chip type electronic component 30 exposed from the ceramic laminate 1 a is connected to each other with solder 21 or the like so as to obtain a desired circuit.

  Thereafter, as shown in FIG. 17, for example, a sealing resin in which a filler such as silica is mixed with an epoxy resin in a gap portion (boundary portion) between the ceramic laminate 1 a on the lower layer side and the ceramic laminate 1 a on the upper layer side. (Resin material) 22 is enclosed.

  Subsequently, as shown in FIGS. 18 and 19, the fired ceramic laminate 1 a is cut using a dicing saw or the like substantially parallel to the stacking direction (direction A). At this time, the cut surface becomes the main surface 2 of the ceramic substrate 1 with a built-in component. Further, by adjusting the thickness (cut width) at the time of cutting, a part of the wiring conductor 12 and a part of the via conductor 13 are exposed from the main surface 2. At this time, if the formation position of the via hole is shifted to the cut surface side (main surface side), a part of the via conductor 13 can be easily exposed from the main surface 2 by cutting. Further, by forming the wiring conductor 12 to the end face, a part of the wiring conductor 12 is exposed on the side end face (second side end face 4: see FIG. 2) of the component built-in ceramic substrate 1.

  Finally, a wiring layer including the pad electrode 14 is formed on the main surface 2, and terminal electrodes (first terminal electrode 15 and second terminal electrode 16 are formed on the side end surfaces (first side end surface 3 and second side end surface 4). ) Is formed, the component built-in ceramic substrate 1 according to the first embodiment of the present invention shown in FIG. 1 is formed. If necessary, the wiring layer, terminal electrodes, etc. may be plated.

  In the method for manufacturing the component-embedded ceramic substrate 1 according to the first embodiment, as described above, the fired ceramic laminate 1a is cut by a predetermined thickness and substantially parallel to the stacking direction (A direction). The component-embedded ceramic substrate 1 capable of increasing the degree of freedom can be manufactured.

  In the first embodiment, the through hole 11 penetrating in the thickness direction is formed in the ceramic green sheet 10a, and the chip-type electronic component 30 is inserted (arranged) in the through hole 11 in the vertical direction. The chip-type electronic component 30 can be easily built in the ceramic substrate.

(Second Embodiment)
FIG. 20 is a perspective view showing a part-embedded ceramic substrate according to the second embodiment of the present invention with a part thereof omitted. Next, a component built-in ceramic substrate 100 according to a second embodiment of the present invention will be described with reference to FIG.

  In the component-embedded ceramic substrate 100 according to the second embodiment, in the configuration of the first embodiment, the plurality of ceramic members 10 include a first ceramic member 110 having a different dielectric constant and a second ceramic member 120 having a different magnetic permeability. It is out.

  The first ceramic member 110 is formed to have a predetermined dielectric constant different from that of other ceramic members by changing the composition system of the ceramic material (glass ceramic material). The second ceramic member 120 is also formed to have a predetermined magnetic permeability different from that of other ceramic members by changing the composition system of the glass ceramic material (glass ceramic material).

  The first ceramic member 110 and the second ceramic member 120 are arranged at predetermined positions on the component-embedded ceramic substrate 100 according to the purpose. Moreover, the 1st ceramic member 110 and the 2nd ceramic member 120 can be used selecting one or more suitably according to the objective. Further, in the component-embedded ceramic substrate 100 according to the second embodiment, the plurality of ceramic members 10 may be configured to include both the first ceramic member 110 and the second ceramic member 120, or include either one. You may comprise as follows. Although FIG. 20 shows an example in which both the first ceramic member 110 and the second ceramic member 120 are included, it is not intended to be limited to this.

  Other configurations of the second embodiment are the same as those of the first embodiment.

The first ceramic member 110 and the second ceramic member 120 can be formed by changing the composition system of the ceramic green sheet in the manufacturing method of the first embodiment. Specifically, for example, the first ceramic member 110 can be formed by using an Al ₂ O ₃ + CaZrO ₃ system. The second ceramic member 120 can be formed by using an NdTiO ₃ system.

  In the second embodiment, as described above, the plurality of ceramic members 10 are configured to include at least one of the first ceramic member 110 having a different dielectric constant and the second ceramic member 120 having a different magnetic permeability. Thus, when a circuit is configured using the chip-type electronic component 30 and the wiring conductor 12 (wiring portion), it is possible to easily reduce stray capacitance, adjust inductance, and the like. As a result, frequency characteristics and the like can be improved, so that higher functionality can be achieved while increasing the degree of freedom in design.

  Moreover, in 2nd Embodiment, while connecting the ceramic member 10 formed in strip shape, it comprises in plate shape, and by making a part of ceramic member 10 into the 1st ceramic member 110 from which dielectric constant differs. For example, a circuit can be configured using only the chip-type electronic component 30 incorporated (arranged) in the first ceramic member 110. In other words, the circuit can be configured without any part other than the first ceramic member 110. For example, in the case of a ceramic multilayer substrate having a laminated structure, even if a layer having a different dielectric constant is provided in some layers, in order to electrically connect to a surface mount component mounted on the main surface, It must be electrically connected via a layer (upper layer) other than a layer having a different dielectric constant by a via conductor or the like. For this reason, it is very difficult to configure a circuit using only layers having different dielectric constants. On the other hand, in the configuration of the second embodiment described above, the chip-type electronic component 30 disposed on the first ceramic member 110 and the display mounting component can be electrically connected without interposing other ceramic members. it can. Note that the second ceramic member 120 can also be configured as a circuit without any portion other than the second ceramic member 120, similarly to the first ceramic member 110. Therefore, it is possible to increase the degree of freedom in design and to easily enhance the functionality of the component-embedded ceramic substrate 100.

  Moreover, in 2nd Embodiment, while connecting the ceramic member 10 formed in strip shape, it comprises in plate shape, and by making a part of ceramic member 10 into the 1st ceramic member 110 from which dielectric constant differs. The surface-mounted component can be easily electrically connected to the desired chip-type electronic component 30 across the ceramic members having different magnetic permeability and dielectric constant.

  Other effects of the second embodiment are the same as those of the first embodiment.

(Third embodiment)
FIG. 21 is a perspective view showing a part-embedded ceramic substrate according to a third embodiment of the present invention with a part thereof omitted. FIG. 22 is a plan sectional view of a component-embedded ceramic substrate according to the third embodiment of the present invention. FIG. 23 is a cross-sectional view for explaining an inductor element of a component built-in ceramic substrate according to a third embodiment of the present invention. Next, the structure of the component-embedded ceramic substrate 200 according to the third embodiment of the present invention will be described with reference to FIGS.

  In the component-embedded ceramic substrate 200 according to the third embodiment, an electronic component 230 formed by simultaneous firing with the ceramic member 10 is incorporated instead of the chip-type electronic component of the first and second embodiments. Specifically, as shown in FIGS. 21 and 22, a component material (component material) 240 constituting the electronic component 230 is filled in the through hole 11 provided in the ceramic member 10, and the component material 240 is fired. As a result, the electronic component 230 is formed in the ceramic member 10. The electronic component 230 is an example of the “passive component” in the present invention.

  Moreover, the wiring conductor 12 is formed in the connection part (interface part) of the ceramic member 10 like the said 1st and 2nd embodiment. The wiring conductor 12 is formed so that a part thereof covers the opening end of the through hole 11, and is thereby electrically connected to the component material 240 in the through hole 11. Note that the portion covering the open end of the wiring conductor 12 also functions as an external terminal electrode of the electronic component 230.

  The electronic component 230 includes a resistance element (R), an inductor element (L), and a capacitor element (C), and these electronic components 230 are electrically connected to the wiring conductor 12. A circuit is formed. Specifically, the electronic component 230 and the wiring conductor 12 form a filter circuit (for example, an RC filter, an LC filter, or an LR filter) such as a low-pass filter (LPF) or a high-pass filter (HPF).

The electronic component 230 having a function as a resistance element is formed by filling the through-hole 11 with the resistor paste 241 and then firing it. That is, the resistor paste 241 is used as the component material 240. As the resistor paste 241, what is generally used for a resistance element can be used. For example, a resistance paste material in which a metal oxide such as ruthelium oxide (RuO ₂ ) and glass are mixed can be used. The resistor paste 241 is an example of the “resistance material” in the present invention.

  As shown in FIG. 23, in the electronic component 230 having a function as an inductor element, the through-hole 11 is half-filled with a ferrite paste 242 containing ferrite powder, and further filled with an Ag paste 243, and then fired. It is formed by being. That is, as the component material 240, ferrite paste 242 and Ag paste 243 are used. The ferrite paste 242 and the Ag paste 243 are examples of the “inductor material” in the present invention.

  The electronic component 230 having a function as a capacitor element is formed by filling the through-hole 11 with the dielectric paste 244 and then firing it. As the dielectric paste 244, any one generally used for capacitor elements can be used as long as it is a dielectric paste that can be fired simultaneously with the LTCC material. The dielectric paste 244 is an example of the “capacitor material” in the present invention.

  Other configurations of the third embodiment are the same as those of the first embodiment.

  In the third embodiment, as described above, after filling the through hole 11 with the component material 240, the electronic component 230 is formed by simultaneous firing with the ceramic member 10, so that the electronic component can be easily formed in the ceramic substrate. 230 can be incorporated.

  Other effects of the third embodiment are the same as those of the first embodiment.

  24 to 33 are cross-sectional views for explaining a method of manufacturing a component-embedded ceramic substrate according to the third embodiment of the present invention. Next, with reference to FIG. 18, FIG. 19, FIG. 21 and FIGS. 24 to 33, a method of manufacturing the component-embedded ceramic substrate 200 according to the third embodiment of the present invention will be described.

  First, as in the first embodiment, a predetermined number of ceramic green sheets are produced using a slurry containing an LTCC material.

  Next, as in the first embodiment, a via hole for forming the via conductor 13 and a through hole 11 for forming the electronic component 230 are formed in a predetermined region of the produced ceramic green sheet 10a as necessary. To do. Then, as shown in FIG. 24, a conductive paste mainly composed of Ag powder or Cu powder is screen-printed on the first ceramic green sheet 10a to form the wiring conductor 12 having a predetermined pattern. At this time, the via conductor 13 is formed by filling the via hole with the conductive paste.

  Next, as shown in FIG. 25, the second ceramic green sheet 10a is laminated on the first ceramic green sheet 10a. In addition, the component material 240 is filled in the through hole 11 of the ceramic green sheet 10a of the second layer in advance. At this time, the through hole 11 of the second ceramic green sheet 10a is disposed on the wiring conductor 12 of the first ceramic green sheet 10a, and by laminating the ceramic green sheets 10a, The component material 240 in the through hole 11 and the wiring conductor 12 are in contact with each other. FIG. 25 shows an example in which the dielectric paste 244 and the resistor paste 241 are filled in the through hole 11 of the second ceramic green sheet 10a.

  Subsequently, using a method similar to the method shown in FIG. 24, the conductive paste is screen-printed on the second ceramic green sheet 10a to form the wiring conductor 12 having a predetermined pattern. Thereby, as shown in FIG. 26, the wiring conductor 12 and the via conductor 13 are formed. Here, when forming a relatively large electronic component 230, it is necessary to form the electronic component 230 across the plurality of ceramic green sheets 10 a, and thus the through hole 11 for forming such an electronic component 230. The ceramic green sheets 10a are left as they are (the parts material 240 is not filled) until the ceramic green sheets 10a are laminated to a predetermined depth.

  Next, as shown in FIG. 27, the third ceramic green sheet 10a is laminated on the second ceramic green sheet 10a. At this time, the through-hole 11 for forming the relatively large electronic component 230 is laminated while aligning the ceramic green sheets 10a on the upper layer side so as to be continuous over a plurality of layers. Then, the component material 240 is filled into the through hole 11 formed by stacking. FIG. 27 shows an example in which the component material 240 for forming the inductor element is filled in the through hole 11 of the ceramic green sheets 10a of the second layer and the third layer.

  Here, in order to form the electronic component 230 functioning as an inductor element, first, as shown in FIG. 28, the through-hole 11 is filled with a ferrite paste 242 containing ferrite powder. Next, the filled ferrite paste 242 is contracted by drying the filled ferrite paste 242. As a result, as shown in FIG. 29, a through hole 242a is formed at the center of the ferrite paste 242. Thereafter, the Ag paste 243 is filled into the through holes 242 a formed in the ferrite paste 242. The Ag paste 243 is preferably an Ag paste containing flaky Ag powder in order to suppress shrinkage due to drying.

  Subsequently, as shown in FIG. 31, the wiring conductor 12 and the via conductor 13 are formed in the third layer ceramic green sheet 10a in the same manner as described above. Thereby, the unfired ceramic laminate 200a is formed.

  Then, after pressing the laminated ceramic green sheets 10a, they are fired at a predetermined temperature (for example, about 850 ° C.) for a predetermined time. Note that the pressing may be performed by either a hydrostatic press or a hydraulic press. As a result, the ceramic green sheet 10a and the wiring conductor 12 (via conductor 13) are simultaneously fired to obtain a fired ceramic laminate 200a. A plurality of the ceramic laminates 200a are prepared. In the above description, the number of laminated ceramic green sheets 10a is three. However, the number of laminated ceramic green sheets 10a may be other than three and can be variously changed. Moreover, the pattern of the electronic component 230 and the wiring conductor 12 can be variously changed according to the purpose.

  Thereafter, as shown in FIG. 33, the obtained plurality of ceramic laminates 200a are sequentially laminated. At this time, similarly to the first embodiment, the lower ceramic laminate 200a and the upper ceramic laminate 200a are electrically connected to each other by the solder 21 or the like. In addition, a sealing resin (resin material) 22 in which a filler such as silica is mixed with an epoxy resin is enclosed in a gap (boundary portion) between the lower ceramic laminate 200a and the upper ceramic laminate 200a. To do.

  Subsequently, the fired ceramic laminate 200a is cut substantially parallel to the stacking direction (direction A) by using a method similar to the method according to the first embodiment shown in FIGS. At this time, the ceramic laminate 200a may be cut so that the electronic component 230 (component material 240) is divided by adjusting the thickness (cut width) at the time of cutting. Thereby, the performance (resistance value etc.) of the built-in electronic component 230 can be adjusted.

  Finally, as in the first embodiment, a wiring layer including a pad electrode is formed on the main surface 2 and a terminal electrode is formed on the side end surface. Thus, the component built-in ceramic substrate 200 according to the third embodiment of the present invention shown in FIG. 21 is formed. If necessary, the wiring layer, terminal electrodes, etc. may be plated.

  Other effects of the manufacturing method of the third embodiment are the same as those of the first embodiment.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiments but by the scope of claims for patent, and further includes all modifications within the meaning and scope equivalent to the scope of claims for patent.

  For example, in the first to third embodiments, the example in which the resistor element, the capacitor element, and the inductor element are incorporated has been described. However, the present invention is not limited to this, and the resistor element, the capacitor element, and the inductor element are used depending on the purpose. Only one of these elements may be incorporated. Further, depending on the purpose, a resistor element, a capacitor element, and an inductor element may be appropriately selected and used. At this time, each of the resistance element, the capacitor element, and the inductor element can be appropriately selected from one or more.

  Moreover, although the example which comprised the filter circuit by the electronic component (passive component) was shown in the said 1st-3rd embodiment, this invention is not limited to this, You may comprise circuits other than a filter circuit. Further, the circuit may be configured by connecting a surface-mounted component mounted on the main surface and a built-in electronic component. Note that the built-in position of the electronic component, the pattern of the wiring conductor, and the like can be changed as appropriate in order to obtain the intended function and performance.

  Moreover, although the example which provided the via conductor in the component built-in ceramic substrate was shown in the said 1st-3rd embodiment, this invention is not restricted to this, It is set as the structure which does not provide a via conductor according to the objective. Also good.

  Moreover, in the said 1st-3rd embodiment, the example which formed the terminal electrode (a 1st terminal electrode and a 2nd terminal electrode) in each of the 1st side end surface of a component built-in ceramic substrate and the 2nd side end surface was shown. However, the present invention is not limited to this, and the terminal electrode may be formed only on one of the first side end face and the second side end face.

  Moreover, although the example which formed the terminal electrode (1st terminal electrode) in both of a pair of 1st side end surface was shown in the said 1st-3rd embodiment, this invention is not limited to this, A pair of 1st You may make it form a terminal electrode only in either one of 1 side end surfaces. Moreover, although the example which formed the terminal electrode (2nd terminal electrode) in both of a pair of 2nd side end surfaces was shown, this invention is not restricted to this, Only in any one of a pair of 2nd side end surfaces, A terminal electrode may be formed.

  In the first to third embodiments, the number of connected ceramic members, the dimensions of the ceramic members, and the like can be appropriately changed according to the purpose. Also, the pattern of the wiring layer formed on the main surface can be changed as appropriate according to the purpose.

  In the first to third embodiments, an example in which three ceramic member groups are connected has been described. However, the present invention is not limited to this, and the number of connected ceramic member groups may be appropriately changed according to the purpose. Can do. In addition to connecting a plurality of ceramic member groups to form one component built-in ceramic substrate, the component built-in ceramic substrate may be formed by one (single) ceramic member group.

  Moreover, although the example which cut | disconnected the ceramic laminated body using the dicing saw was shown in the said 1st-3rd embodiment, this invention is not limited to this, The cutting | disconnection of a ceramic laminated body is a laser other than a dicing saw. You may carry out using a processing method.

  In the first to third embodiments, a semiconductor integrated circuit element such as a flip chip IC or a bare chip IC and a passive element such as a resistance element, an inductor element, and a capacitor element are mounted on the main surface as electronic components. However, the present invention is not limited to this, and an active element such as a transistor may be mounted on the main surface.

  In the first to third embodiments, the wiring conductor and the via conductor are made of Ag or Cu. However, the present invention is not limited to this. For example, Au or AgPd other than Ag or Cu is used. You may comprise a wiring conductor and a via conductor.

  In the first and second embodiments, the example using the chip-type electronic component including the resistance element, the capacitor element, and the conductor element is shown. However, the present invention is not limited to this, and the filter, the balun, the coupler, and the like A chip-type electronic component may be used.

  In the second embodiment, in the configuration of the component-embedded ceramic substrate of the first embodiment, the plurality of ceramic members include at least one of a first ceramic member having a different dielectric constant and a second ceramic member having a different magnetic permeability. Although the present invention is not limited to this, the present invention is not limited to this, and in the configuration of the component-embedded ceramic substrate of the third embodiment, the plurality of ceramic members are different in the first ceramic member having a different dielectric constant and the permeability. You may comprise so that at least one of the 2nd ceramic member may be included.

1 is an overall perspective view of a component-embedded ceramic substrate according to a first embodiment of the present invention. It is the perspective view which abbreviate | omitted and showed one part built-in ceramic substrate by 1st Embodiment of this invention. 1 is a cross-sectional plan view of a component-embedded ceramic substrate according to a first embodiment of the present invention. 1 is a cross-sectional view of a component built-in ceramic substrate according to a first embodiment of the present invention. It is the top view which showed the state which mounted the components built-in ceramic substrate by 1st Embodiment of this invention on the mounting board | substrate. It is the top view which showed the state which mounted the components built-in ceramic substrate by 1st Embodiment of this invention on the mounting board | substrate. It is sectional drawing for demonstrating the manufacturing method of the component built-in ceramic substrate by 1st Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the component built-in ceramic substrate by 1st Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the component built-in ceramic substrate by 1st Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the component built-in ceramic substrate by 1st Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the component built-in ceramic substrate by 1st Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the component built-in ceramic substrate by 1st Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the component built-in ceramic substrate by 1st Embodiment of this invention. It is the schematic for demonstrating the manufacturing method of the component built-in ceramic substrate by 1st Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the component built-in ceramic substrate by 1st Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the component built-in ceramic substrate by 1st Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the component built-in ceramic substrate by 1st Embodiment of this invention. It is a perspective view for demonstrating the manufacturing method of the component built-in ceramic substrate by 1st Embodiment of this invention. It is a perspective view for demonstrating the manufacturing method of the component built-in ceramic substrate by 1st Embodiment of this invention. It is the perspective view which abbreviate | omitted and showed one part built-in ceramic substrate by 2nd Embodiment of this invention. It is the perspective view which abbreviate | omitted and showed one part built-in ceramic substrate by 3rd Embodiment of this invention. It is a plane sectional view of a component built-in ceramic substrate according to a third embodiment of the present invention. It is sectional drawing for demonstrating the inductor element of the component built-in ceramic substrate by 3rd Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the component built-in ceramic substrate by 3rd Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the component built-in ceramic substrate by 3rd Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the component built-in ceramic substrate by 3rd Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the component built-in ceramic substrate by 3rd Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the component built-in ceramic substrate by 3rd Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the component built-in ceramic substrate by 3rd Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the component built-in ceramic substrate by 3rd Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the component built-in ceramic substrate by 3rd Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the component built-in ceramic substrate by 3rd Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the component built-in ceramic substrate by 3rd Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,100,200 Component built-in ceramic substrate 1a, 200a Ceramic laminated body 2 Main surface 3 First side end surface 4 Second side end surface 10 Ceramic member 10a Ceramic green sheet 11 Through hole (hole)
12 wiring conductor 13 via conductor 14 pad electrode 15 first terminal electrode 16 second terminal electrode 20 ceramic member group 21 solder 22 sealing resin (resin material)
30 Chip-type electronic components (electronic components, passive components)
230 Electronic components (passive components)
110 First ceramic member 120 Second ceramic member 240 Component material (constituent material)
241 Resistor paste (resistive material)
242 Ferrite paste (inductor material)
243 Ag paste (inductor material)
244 Dielectric paste (capacitor material)

Claims (20)

A plurality of ceramic members formed in a strip shape extending in the first direction;
A hole formed in at least a part of the plurality of ceramic members;
An electronic component built in the ceramic member by being disposed in the hole of the ceramic member;
A wiring portion provided on the ceramic member and including a wiring conductor electrically connected to the electronic component;
The plurality of ceramic members are configured in a plate shape by being connected in a second direction intersecting the first direction, and the plurality of ceramic members configured in the plate shape are configured in the first direction. And having a main surface along the second direction,
The hole is provided in a predetermined portion of the ceramic member so as to extend along the second direction, whereby the electronic component is disposed substantially parallel to the main surface inside the ceramic member. Has been
A part of the wiring conductor is exposed from the main surface. A ceramic substrate with a built-in component.   The component built-in ceramic substrate according to claim 1, wherein a pad electrode electrically connected to a portion exposed from the main surface of the wiring conductor is formed on the main surface.   The component built-in ceramic substrate according to claim 1, wherein the ceramic member is made of a glass ceramic material. The ceramic member contains a plurality of the electronic components,
Each of the plurality of electronic components is composed of passive components,
4. The component-embedded ceramic substrate according to claim 1, wherein each of the plurality of passive components includes any one of a resistance element, an inductor element, and a capacitor element. .   5. The component-embedded ceramic substrate according to claim 1, wherein the electronic component includes a chip-type electronic component.   The electronic component is formed by filling at least one of a resistance material, a capacitor material, and an inductor material in the hole portion and then simultaneously firing the ceramic member. 5. The component-embedded ceramic substrate according to any one of 1 to 4.   7. The component built-in according to claim 1, wherein the electronic component is provided in one ceramic member or across a plurality of adjacent ceramic members. Ceramic substrate. Including a plurality of ceramic member groups having a plurality of ceramic members connected to each other by firing;
The component built-in ceramic substrate according to claim 1, wherein the plurality of ceramic members are configured in a plate shape by connecting the plurality of ceramic member groups to each other. .   9. The component built-in ceramic substrate according to claim 8, wherein at least some of the plurality of ceramic member groups are electrically connected to each other.   10. The component-embedded ceramic substrate according to claim 8, wherein a resin material is sealed between one ceramic member group and the other adjacent ceramic member group. 11.   The plurality of ceramic members include at least one of a first ceramic member having a different dielectric constant and a second ceramic member having a different magnetic permeability. Ceramic substrate with built-in parts. The plate-shaped ceramic member has a first side end surface along the first direction and a second side end surface along the second direction,
A first terminal electrode and a second terminal electrode are provided on the first side end face and the second side end face, respectively.
In the case of using the first terminal electrode and the case of using the second terminal electrode, the electronic component and the wiring portion are connected so as to exhibit different functions or different performances, The component-embedded ceramic substrate according to any one of claims 1 to 11.   The component built-in ceramic substrate according to any one of claims 1 to 12, wherein a filter circuit is configured by the electronic component and the wiring portion.   The component built-in ceramic substrate according to claim 13, wherein the filter circuit includes at least one of a low-pass filter and a high-pass filter. Forming a hole penetrating in the thickness direction in at least a part of the plurality of ceramic green sheets;
Disposing an electronic component in the hole; and
Forming a wiring portion including a wiring conductor having a predetermined pattern on at least a part of the plurality of ceramic green sheets;
Forming a green ceramic laminate by laminating the plurality of ceramic green sheets;
Firing the unfired ceramic laminate at a predetermined temperature;
And a step of cutting the fired ceramic laminate with a predetermined thickness substantially parallel to the lamination direction. Further comprising a step of forming a via hole in at least a part of the plurality of ceramic green sheets,
16. The method for manufacturing a component-embedded ceramic substrate according to claim 15, wherein the step of forming the wiring portion includes a step of forming a via conductor by filling the via hole with a conductive paste. The electronic component is a chip-type electronic component,
The method for producing a component-embedded ceramic substrate according to claim 15 or 16, further comprising a step of pressing the unfired ceramic laminate with an isostatic press prior to the step of firing the ceramic laminate. The step of disposing the electronic component in the hole includes filling the hole with a constituent material constituting the electronic component,
17. The component built-in ceramic substrate according to claim 15, wherein the electronic component is formed by simultaneously firing the constituent material filled in the hole portion with the ceramic laminate. Production method.   19. The component-embedded ceramic substrate according to claim 18, wherein the constituent material includes a resistor material constituting a resistor element, a capacitor material constituting a capacitor element, and an inductor material constituting an inductor element. Method.   20. The method for manufacturing a component-embedded ceramic substrate according to claim 18 or 19, wherein the ceramic laminate is cut at a predetermined thickness for dividing the constituent material filled in the hole.

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