JP2012146940A - Electronic component and electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To supply an electronic component in which variation of desired electrical characteristics is suppressed.SOLUTION: Since the electronic component comprises a rectangular parallelepiped laminate 2 of a plurality of insulator layers 5a-5i, an external connection terminal 3 provided on one side surface 2c out of four side surfaces along the lamination direction of the laminate 2, and a circuit pattern 6 provided between the insulator layers 5 and connected electrically with the external connection terminal 3, the circuit pattern 6 and the plurality of lands of a wiring board are not in the positional relationship of facing each other over a wide area. Consequently, occurrence of unnecessary capacity between the circuit pattern 6 and the plurality of lands can be suppressed, and an electronic component 1 capable of obtaining desired electrical characteristics can be provided.

Description

  The present invention relates to an electronic component and an electronic device.

  As a filter for attenuating noise, for example, a laminated body in which a plurality of insulator layers are laminated, a plurality of common terminals provided on four side surfaces along the lamination direction of the laminated body, a plurality of common terminals, And an electronic component including a circuit pattern provided between insulator layers has been proposed (see, for example, Patent Document 1).

  Such a filter component is mounted on one main surface of the wiring board with a main surface perpendicular to the stacking direction of the laminate as a mounting surface. Each common terminal is provided on the mounting surface of the laminate. The mounting surface is opposed to one main surface of the wiring board, and the common terminals and a plurality of lands provided on the one main surface of the wiring board are soldered together. By doing so, the filter component is mounted on the wiring board.

JP 2006-311506 A

  However, in the conventional mounting structure described above, a large capacitance is generated between the circuit pattern in the laminate and the land of the wiring board facing each other over a wide area, and desired electrical characteristics are obtained. May not be obtained.

  The present invention has been devised in view of the above problems, and an object of the present invention is to suppress generation of unnecessary capacitance when an electronic component is mounted on a wiring board. To provide electronic components.

  The electronic component of the present invention includes a rectangular parallelepiped laminate in which a plurality of insulator layers are laminated, an external connection terminal provided on one side surface among four sides along the lamination direction of the laminate, and the external connection A circuit pattern electrically connected to the terminal and provided between the insulator layers.

  The electronic device of the present invention includes the above-described electronic component and a wiring board having a plurality of lands corresponding to the external connection terminals on one main surface, and the electronic component is the external connection on the one side surface. The terminal is mounted on the one main surface of the wiring board in a state of facing the plurality of lands.

  According to the electronic component of the present invention, a rectangular parallelepiped laminate in which a plurality of insulator layers are laminated, an external connection terminal provided on one side surface among four side surfaces along the lamination direction of the laminate, and an external connection Since it has a circuit pattern electrically connected to the terminals and provided between the insulator layers, when the external connection terminals are connected to a plurality of lands on the wiring board, the laminated body provided with the external connection terminals By using one side surface as the mounting surface, the area of the circuit pattern facing the land of the wiring board can be reduced. As a result, generation of unnecessary capacitance between the circuit pattern and the plurality of lands can be suppressed.

It is a perspective view which shows an example of embodiment of the electronic component of this invention. It is a side view which shows an example of embodiment of the electronic device of this invention. It is a disassembled perspective view which shows typically the internal structure of the electronic device shown in FIG. FIG. 4 is an equivalent circuit diagram of the electronic component shown in FIG. 3. It is explanatory drawing of the circuit pattern which is another example of embodiment of the electronic component of this invention. It is a side view which shows the other example of embodiment of the electronic device of this invention. It is a disassembled perspective view which shows the other example of embodiment of the electronic component of this invention. FIG. 8 is an equivalent circuit diagram of the circuit pattern shown in FIG. 7. It is a disassembled perspective view which shows the other example of embodiment of the electronic component of this invention. FIG. 10 is an equivalent circuit diagram of the circuit pattern shown in FIG. 9. It is a disassembled perspective view which shows the other example of embodiment of the electronic component of this invention. FIG. 12 is an equivalent circuit diagram of the circuit pattern shown in FIG. 11. It is a disassembled perspective view which shows an example of embodiment of the conventional electronic component. It is a disassembled perspective view which shows the other example of embodiment of the conventional electronic component. It is a disassembled perspective view which shows the other example of embodiment of the conventional electronic component.

  Hereinafter, an example of an embodiment of an electronic component of the present invention will be described in detail with reference to the drawings.

  As shown in FIGS. 1 and 3, the electronic component 1 includes a laminated body 2, an external connection terminal 3, and an electronic circuit 4.

The electronic component 1 is a signal line for transmitting a signal to each component such as an LCD, a memory unit, an RF circuit, and a camera unit in a mobile communication device such as a mobile phone or a small personal computer (PC), for example. Etc. Since external noise is likely to be mixed into the signal line, the electronic component 1 is used as a noise filter element that attenuates the noise. The electronic component 1 is also used for a digital device that generally uses a high-frequency signal, such as a car navigation system or a television, in addition to a mobile phone or a small PC.

The laminate 2 is formed by laminating a plurality of insulator layers 5 and has a rectangular parallelepiped shape. This laminated body 2 is a rectangular parallelepiped electric discharger block formed by laminating, for example, 2 to 50 rectangular insulating layers 5 each having a thickness of, for example, 5 μm to 300 μm.

  The dimensions of the laminate 2 are such that the length of the long side of the laminate 2 is, for example, 1 to 3 mm, the length of the short side of the laminate 2 is, for example, 0.5 to 2 mm, and the height of the laminate 2 is For example, 0.3 to 2 mm.

As a material of the insulator layer 5, for example, a dielectric ceramic material is used, and a sintering aid, a low melting point glass material, or the like may be used as necessary. As the dielectric ceramic material, for example, a ceramic material such as TiO ₂ —Nd ₂ O ₃ —BaTiO ₃ system is used. As the sintering aid, for example, BiVO ₄ , CuO, Li ₂ O, B ₂ O _{3 and the} like are used.

  As shown in FIG. 1, the laminate 2 includes a first main surface 2a and a second main surface 2b facing each other, a first side surface 2c and a second side surface 2d facing each other, and a first main surface 2c and a second side surface 2d facing each other. It is formed in a substantially rectangular parallelepiped shape having three side surfaces 2e and a fourth side surface 2f.

  The circuit pattern 6 is electrically connected to the external connection terminal 3 and is provided between the insulator layers 5. The circuit pattern 6 forms an electronic circuit 4 by constituting at least a part of a capacitor and an inductor.

  In the example illustrated in FIG. 3, the insulating layers 5 a to 5 i are stacked to form the stacked body 2. A filter circuit is formed as the electronic circuit 4 by forming a circuit pattern 6 between the insulator layers 5. In the example shown in FIG. 3, in this filter circuit, the circuit patterns 6a to 6f on the insulator layers 5a to 5f are connected to each other by via-hole conductors that penetrate the insulator layers 5a to 5e and have a predetermined number of turns. A coiled inductor element L1 is configured. The circuit patterns 6h and 6i on the insulator layers 5h and 5i constitute a first capacitor element C1. The circuit patterns 6g and 6h on the insulator layers 5g and 5h constitute a second capacitor element C2.

  The circuit patterns 6a and 6i on the insulator layers 5a and 5i are connected to the input terminal 3a. The circuit patterns 6f and 6g on the insulator layers 5f and 5g are connected to the output terminal 3b. The circuit pattern 6h on the insulator layer 5h is connected to the ground terminal 3c.

  FIG. 3 shows an example in which the laminate 2 is formed by using nine insulator layers 5a to 5i. However, one or more insulators are further provided on the insulator layer 5a so as to cover the circuit pattern 6a. Layer 5 may be disposed. Further, one or a plurality of insulator layers 5 may be further arranged on the surface of the insulator layer 5i where the circuit pattern 6i is not formed.

  As shown in FIG. 4, the electronic circuit 4 having the above configuration includes an inductor element L whose both ends are connected to a pair of input / output terminals 3a and 3b, and a first element disposed between the input terminal 3a and the ground terminal 3c. It is represented as an equivalent circuit composed of one capacitor element C1 and a second capacitor element C2 arranged between the input terminal 3b and the ground terminal 3c.

  As the material of the circuit patterns 6a to 6i formed on the insulator layers 5a to 5i, a conductive material made of Ag or an alloy mainly composed of Ag such as an Ag—Pd alloy or an Ag—Pt alloy, or Cu or Cu. -A conductive material made of an alloy containing Cu as a main component, such as a Zn alloy, a Cu-Sn alloy, a Cu-Ag alloy, or a Cu-Ni alloy, can be used, and the thickness of each electrode is appropriately set to, for example, 5 m to 25 m. Is set.

  In the example illustrated in FIG. 1, the external connection terminal 3 is provided on one side surface 2 c (first side surface 2 c) among the four side surfaces along the stacking direction of the stacked body 2. In the example shown in FIG. 1, the external connection terminals 3 provided on the first side surface 2c of the multilayer body 2 function as an input terminal 3a, an output terminal 3b, and a ground terminal 3c, respectively.

In the example shown in FIG. 1, the external connection terminals 3 are provided in a strip shape along the stacking direction of the stacked body 2. The external connection terminal 3 has, for example, a length of 0.3 to 2 mm and a width of 0.2 mm to 0.3 mm.
It is. The thickness of the external connection terminal 3 is, for example, 10 μm to 25 μm.

  Further, the shape of these external connection terminals 3 may be a strip or an ellipse that is oblique to the stacking direction of the stacked body 2 on the first side surface 2c. The external connection terminal 3 is formed by a method such as screen printing or transfer of a metal foil.

  As shown in FIGS. 2 and 3, the electronic component 1 having the above configuration is mounted on a wiring substrate 8 having a plurality of lands 7 a to 7 c corresponding to the external connection terminals 3 on one main surface. The electronic component 1 is mounted on one main surface of the wiring board 8 in a state where the plurality of external connection terminals 3 on one side surface (first side surface 2c) are opposed to the plurality of lands 7a to 7c.

  As shown in FIG. 2, the mounting surface of the electronic component 1 is a first side surface 2c. Thus, since the external connection terminal 3 is provided in the 1st side surface 2c, the electronic component 1 can use this side surface 2c as a mounting surface.

  With such a configuration, the area of the circuit pattern 6 facing the land 7 of the wiring board 8 can be reduced. As a result, generation of unnecessary capacitance between the circuit pattern 6 and the plurality of lands 7 can be suppressed.

  As the material of the wiring substrate 8, for example, ceramic materials such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, a silicon carbide sintered body, and a glass ceramic sintered body are used. Moreover, you may use organic resin materials, such as a polyimide resin and an epoxy resin. Alternatively, a composite material obtained by mixing an inorganic material such as ceramics or glass with an organic resin material such as an epoxy resin may be used.

  The land 7 is provided on one main surface of the wiring board 8 so as to correspond to the external connection terminal 3. The land 7 is formed of a metal material such as W, Cu, Ag, Au, Pd, Ta, or Mn. As a means for forming the land 7, a means for attaching the external connection terminal 3 to the laminate 2 as a metal thin film layer by metallization layer, plating layer, vapor deposition or the like can be used. For example, a method is used in which a paste made of W and Ag is printed as a metallized layer on a green sheet serving as one main surface of the wiring substrate 8 and then fired together with the green sheet. Alternatively, the land 7 may be formed by transferring a metal foil.

  The land 7 and the connection terminal 3 are electrically connected via a bonding material (not shown). This bonding material can be Sn-Ag or Sn-Ag-Cu solder, Au-Sn low melting point brazing material, Ag-Ge high melting point brazing material, conductive organic resin, or seam welding / It is formed of a metal material or the like that enables joining by a welding method such as electron beam welding.

  Further, according to the electronic component 1 of the present example, the circuit pattern 6 having a large area that constitutes the capacitor is positioned between the land 7 of the wiring board 8 and the circuit pattern 6 no matter where the circuit pattern 6 is positioned in the stacking direction. The generation of unnecessary capacity can be suppressed. Therefore, when designing the circuit in the electronic component 1, the degree of freedom of arrangement of the circuit pattern 6 can be improved, which is preferable.

  Moreover, it is preferable that the one side surface provided with the external connection terminal 3 is a side surface 2e (2f) having a short side among the four side surfaces 2c to 2f. With this configuration, the side surface 2e (2f) having the short side can be used as a mounting surface for the wiring board. Therefore, the short direction of the circuit pattern 6 can be set to the wiring board 8 side. Therefore, as shown in FIG. 5, the opposing area between the thickness width of the circuit pattern 6 and the land 7 of the wiring board 8 can be further reduced. As a result, generation of unnecessary capacitance between the land 7 and the circuit pattern 6 can be further suppressed.

  Moreover, it is preferable that the length of the circuit pattern 6 in the example shown in FIG. 3 in the arrangement direction of the external connection terminals 3 is equal to or less than the width of one external connection terminal. Thereby, the thickness width of the circuit pattern 6 and the area of the area facing the land 7 can be further reduced. Therefore, generation of unnecessary capacitance between the land 7 and the circuit pattern 6 can be further suppressed.

For example, it is preferable that the width of the external connection terminal 3 is substantially the same as the width of the portion of the circuit pattern 6 drawn to the outer surface of the laminate 2. Substantially the same means that the difference between the width of the external connection terminal 3 and the width of the lead portion of the circuit pattern 6 is within 5% of the width of the external connection terminal 3. By controlling the width of the external connection terminal 3 so as not to be too large compared to the width of the circuit pattern 6, it is possible to suppress an increase in the area of the opposing region between the thickness of the external connection terminal 3 and the circuit pattern 6. it can. Therefore, unnecessary capacitance generation between the external connection terminal 3 and the circuit pattern can be suppressed.

  In the example shown in FIG. 3, the external connection terminals 3 are provided so as to extend along the stacking direction. With such a configuration, the external connection terminal 3 can have a large area in the stacking direction. Therefore, it is possible to prevent an electrical connection failure due to misalignment when connecting to the land 7.

  For example, it is preferable to form the external connection terminals 3 partially in the stacking direction. With such a configuration, generation of unnecessary capacitance can be suppressed between the thickness width of other circuit patterns.

  At this time, the plurality of lands 7 of the wiring board 8 preferably extend along the stacking direction of the stacked body 2. According to this configuration, the contact area between the external connection terminal 3 and the land 7 extending in the stacking direction can be increased as described above. Therefore, the electrical resistance between them can be reduced.

  The electronic component 1 is produced by a ceramic green sheet laminating method as described below.

Specifically, first, an appropriate organic solvent or the like is added to and mixed with a dielectric ceramic material powder made of, for example, TiO ₂ —Nd ₂ O ₃ —BaTiO ₃ to form a slurry, and a doctor blade method or the like is used. To form a ceramic green sheet.

  Next, various circuit patterns 6 a to 6 i are formed on the obtained ceramic green sheet by a screen printing method or the like, and these are laminated and pressure-bonded to form a formed body of the laminated body 2.

Next, the laminated body 2 is obtained by dividing the formed body of the laminated body 2 into a predetermined size and firing at 800 to 1050 ° C.

  Next, chamfering by barrel polishing or the like is performed on the corners of the obtained laminate 2 for the purpose of removing microcracks and preventing generation of chips.

  Next, the ground terminal 3c and the input / output terminals 3a and 3b made of a conductive material made of Ag, Ag—Pd alloy, Ag—Pt alloy, or the like are formed on the surface of the laminated body 2 that has been chamfered. At this time, a conductive paste to be the ground terminal 3c and the input / output terminals 3a and 3b is applied to the surface of the multilayer body 2 in a predetermined pattern by screen printing or the like. Next, the laminate 2 coated with the conductive paste is baked to form the ground terminal 3c and the input / output terminals 3a and 3b. Then, a plating layer such as a Ni plating layer, an Au plating layer, a Sn plating layer, or a solder plating layer is formed on the surfaces of the ground terminal 3c and the input / output terminals 3a and 3b as necessary, and the electronic component 1 is obtained.

  The present invention is not limited to the embodiments described above, and various changes and improvements can be made without departing from the scope of the present invention.

  For example, as shown in FIG. 6, the external connection terminal 3 is provided on one side surface (2c) of the laminate 2, and the other external connection terminal 3 is provided on the side surface (2f, 2e) adjacent to the one side surface (2c). At the same time, the lands 7 that are electrically connected to the other external connection terminals 3 are preferably arranged so as not to overlap the stacked body 2 in plan view.

  With such a configuration, the land 7 connected to the other external connection terminal 3 does not oppose the thickness width of the circuit pattern 6 in the multilayer body 2, so that generation of unnecessary capacitance can be further suppressed.

  In the example shown in FIG. 6, the other external connection terminals 3 and the lands 7 are connected via the bonding material 9 made of the same material as described above.

  7 and 13 together constitute the equivalent circuit shown in FIG. 9 and 14 together constitute the equivalent circuit shown in FIG. 11 and 15 together constitute the equivalent circuit shown in FIG.

  As described above, the electronic components in the examples shown in FIGS. 7, 9, and 11 and the conventional electronic components in the examples shown in FIGS. 13 to 15 have the same equivalent circuit, but the external connection terminals 3 are laminated. The difference is that it is provided on one side surface 2 c of the body 2. As a result, as described above, the area where the circuit pattern 6 faces the land 7 of the wiring board 8 can be reduced. As a result, generation of unnecessary capacitance between the circuit pattern 6 and the plurality of lands 7 can be suppressed. Furthermore, in the examples shown in FIGS. 7, 9, and 11, the external connection terminals 3 and the circuit pattern 6 are electrically connected without via via-hole conductors. Therefore, the via-hole conductor existing in the multilayer body 2 is limited to the one that connects the circuit patterns 6 between different insulator layers 5. On the other hand, in the example shown in FIGS. 13 to 15, since the external connection terminal 3 is provided on the main surface of the multilayer body 2, the external connection terminal 3 and the circuit pattern 6 are connected via via-hole conductors. ing. As a result, according to the configuration of the example shown in FIGS. 7, 9, and 11, compared to FIGS. 13 to 15, the distribution of via-hole conductors that connect the external connection terminals 3 and the circuit pattern 6 in the multilayer body 2. Only the total number of via-hole conductors can be reduced.

For example, in FIGS. 13 to 15, via hole conductors penetrating the insulating layers 5 a to 5 i are provided to connect the circuit pattern 6 a and the external connection terminal 3 a, but FIGS.
According to the configuration of the example shown in FIG. 11, the circuit pattern 6a is directly connected to the external connection terminal 3a, so that the via-hole conductor is omitted accordingly. Therefore, the number of via-hole conductors in the multilayer body 2 can be reduced as compared with FIGS.

  Thus, if the number of via-hole conductors in the multilayer body 2 can be reduced, the area on which the circuit pattern 6 can be formed can be increased, and the degree of freedom in designing the circuit pattern 6 is improved. Moreover, even if the circuit pattern 6 having the same size is formed, the formation area of the circuit pattern 6 can be reduced, so that the stacked body 2 can be reduced in size.

1: Electronic component 2: Laminated body 3 (3a-3c): External connection terminal 4: Electronic circuit 5 (5a-5i): Insulator layer 6 (6a-6i): Circuit pattern 7 (7a-7c): Land 8 : Wiring board L (L1, L2): Inductor element C (C1, C2): Capacitor element

Claims (5)

A rectangular parallelepiped laminate in which a plurality of insulator layers are laminated;
External connection terminals provided on one side surface among the four side surfaces along the stacking direction of the laminate,
An electronic component comprising a circuit pattern electrically connected to the external connection terminal and provided between the insulator layers. An electronic component according to claim 1,
It has a wiring board having a plurality of lands corresponding to the external connection terminals on one main surface,
The electronic device is mounted on the one main surface of the wiring board with the external connection terminal on the one side faced to the plurality of lands.   The electronic device according to claim 2, wherein the external connection terminal extends along a stacking direction of the stacked body.   The electronic device according to claim 3, wherein the plurality of lands of the wiring substrate extend along a stacking direction of the stacked body.   The electronic component according to claim 1, wherein the circuit pattern constitutes at least a part of a capacitor and an inductor.

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