JP2012199367A - Manufacturing method of wiring board, manufacturing method of electronic component, wiring board, and electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technique capable of making wiring formed on a wiring board much finer.SOLUTION: A manufacturing method of a wiring board includes: a laminate formation step of forming a laminate containing an insulating layer or a conductive layer by laminating a plurality of layers formed by at least either of the insulating layer and the conductive layer; and a cutting step of cutting the laminate formed by the laminate formation step along a surface intersecting with the plurality of layers.

Description

  The present invention relates to a method for manufacturing a wiring board on which an electronic element is mounted, a method for manufacturing an electronic component, a wiring board, and an electronic component.

2. Description of the Related Art Conventionally, miniaturization of wiring formed on a wiring board has been promoted in order to reduce the size, integration, and thickness of electronic devices.
For example, in Patent Document 1, when a wiring pattern is formed on a wiring substrate using an inkjet method, a droplet containing a conductive material is discharged to a porous film member, thereby spreading the discharged droplet. It is described that the wiring is further miniaturized.
Similarly to the ink jet method, a semi-additive method may be used as a technique capable of miniaturizing the wiring. In this case, after forming a metal thin film by sputtering or the like, wiring is performed by plating up copper. A pattern is formed.

JP 2010-34526 A

However, in the method for manufacturing a wiring board using the ink jet method or the semi-additive method, the wiring formed is not sufficiently miniaturized in order to further reduce the size of the electronic device. That is, in these methods, the width of the wiring to be formed is currently achieving 20 μm.
Therefore, in order to further reduce the size of the electronic device, it is desired to make the wiring finer.
An object of the present invention is to provide a technique capable of further miniaturizing a wiring formed on a wiring board.

In order to solve the above problems, a method for manufacturing a wiring board according to an aspect of the present invention includes:
A laminate forming step of forming a laminate including the insulating layer and the conductive layer by laminating a plurality of layers formed by at least one of an insulating layer and a conductive layer, and the laminate formed in the laminate forming step Cutting along a plane intersecting the plurality of layers.
By such a method, a wiring board is obtained by cutting a laminated body including laminated insulating layers and conductive layers along a direction intersecting with a plurality of layers.
Therefore, the target wiring width can be easily realized by the thickness of the insulating layer and the conductive layer.
Therefore, the wiring formed on the wiring board can be further miniaturized.

In addition, a method for manufacturing a wiring board according to another aspect of the present invention includes:
In the stacked body forming step, at least one of the layers is formed by a portion made of the insulating layer and a portion made of the conductive layer.
By such a method, a desired wiring pattern can be easily realized by the shape of the layers constituting the laminate.

In addition, a method for manufacturing a wiring board according to another aspect of the present invention includes:
In the stacked body forming step, the plurality of layers are formed by an inkjet method.
By such a method, the conductive layer and the insulating layer can be formed by switching the nozzles, so that it is easy to form a stacked body.

An electronic component manufacturing method according to an aspect of the present invention includes:
A laminate forming step of forming a laminate including the insulating layer and the conductive layer by laminating a plurality of layers formed by at least one of an insulating layer and a conductive layer, and the laminate formed in the laminate forming step Are cut along a plane intersecting a plurality of the layers, and are constituted by one of the stacked bodies, and a first surface formed by the cutting, and a second surface opposite to the first surface. A wiring board forming step of forming a wiring board having a surface, and a mounting step of mounting an electronic element on at least one of the first surface and the second surface of the wiring substrate. It is characterized by.

By such a method, a wiring board is obtained by cutting a laminated body composed of laminated insulating layers and conductive layers along a direction intersecting a plurality of layers, and by mounting an electronic element on the wiring board, Electronic components are configured.
Therefore, the target wiring width can be easily realized by the thickness of the insulating layer and the conductive layer.
Therefore, the wiring formed on the wiring board can be further miniaturized.

In addition, a method for manufacturing an electronic component according to another aspect of the present invention includes:
In the stacked body forming step, at least one of the layers is formed by a portion made of the insulating layer and a portion made of the conductive layer.
By such a method, a desired wiring pattern can be easily realized by the shape of the layers constituting the laminate.
In addition, a method for manufacturing an electronic component according to another aspect of the present invention includes:
In the stacked body forming step, the plurality of layers are formed by an inkjet method.
By such a method, the conductive layer and the insulating layer can be formed by switching the nozzles, so that it is easy to form a stacked body.

The wiring board according to one aspect of the present invention is
A laminate in which a plurality of layers formed of at least one of an insulating layer and a conductive layer are stacked has a configuration cut along a plane intersecting with the plurality of layers, and the insulating layer and the conductive layer are cut on the cut surface. It has a wiring pattern formed by layers.
With such a configuration, a wiring board can be obtained by cutting a laminated body including laminated insulating layers and conductive layers along a direction intersecting with a plurality of layers.
Therefore, a wiring substrate having a wiring width corresponding to the thickness of the insulating layer and the conductive layer stacked on the stacked body is obtained.
Therefore, the wiring formed on the wiring board can be further miniaturized.

An electronic component according to an aspect of the present invention is provided.
A plurality of layers formed by at least one of an insulating layer and a conductive layer are stacked, and a wiring board having a wiring pattern constituted by the insulating layer and the conductive layer on an outer surface in a direction intersecting the plurality of layers, And an electronic element mounted on the outer surface of the wiring board and connected to the conductive layer of the wiring pattern.
With such a configuration, it is possible to configure an electronic component in which an electronic element is mounted on the conductive layer of the wiring pattern that appears on the outer surface where the insulating layer and the conductive layer of the wiring board are laminated.
Therefore, it is possible to easily manufacture the electronic component, and it is possible to further miniaturize the wiring formed on the wiring board.

FIG. 3 is a diagram illustrating a state where the plate material 1 is installed on the stage S of the liquid ejection apparatus 100 in the first step. It is a figure which shows the process in which the laminated body B1 is formed in the to-be-discharged surface F of the board | plate material. It is a figure which shows the state which installed the laminated body B1 on the fixed stand R of the cutting device 200. FIG. It is a figure which shows the process of cut | disconnecting laminated body B1. It is a figure which shows the process of giving a soldering resist to the wiring board P1. It is a figure which shows the state by which the electronic elements D1, D2 were mounted in the wiring board P1. It is a figure which shows the example of an electronic device provided with the electronic component C1 manufactured with the manufacturing method of the wiring board which concerns on 1st Embodiment. It is a figure which shows the effect about refinement | miniaturization of the wiring in this invention. It is a figure which shows the effect about the thickness of the wiring in this invention. It is a figure which shows the 2nd-1 process of 2nd Embodiment. It is a figure which shows the 2-2, 2-3 process of 2nd Embodiment. It is a figure which shows the 2-4-2-6 process of 2nd Embodiment. It is a figure which shows 2-7, 2-8 process of 2nd Embodiment. It is a figure which shows 2-9, 2-10 process of 2nd Embodiment. It is a figure which shows the 2-11 and 12-12 process of 2nd Embodiment. It is a figure showing the 2-13 process of a 2nd embodiment. It is a figure which shows the 2-14 process of 2nd Embodiment. It is a figure showing the 2-15 process of a 2nd embodiment. It is a figure which shows the 2-16 and 2-17 process of 2nd Embodiment. It is a figure which shows 2-18, 2-19 process of 2nd Embodiment. It is a figure which shows 2-20 and 2-21 process of 2nd Embodiment. It is a figure which shows 2nd 2-22-2-24 process of 2nd Embodiment. It is a figure which shows the 2-25-25th -26 process of 2nd Embodiment. It is a figure which shows the process of cut | disconnecting laminated body B2. It is a figure which shows the state by which electronic element D1, D2 was mounted in the wiring board P2. It is a figure which shows the other example of the wiring board manufactured using the manufacturing method of the wiring board of 2nd Embodiment. It is a figure which shows the example at the time of changing the width | variety of the part cut out from a laminated body.

Embodiments of a wiring board manufacturing method, an electronic component manufacturing method, a wiring board, and a laminate of wiring structures according to the present invention will be described below with reference to the drawings.
(First embodiment)
First, the manufacturing method of the wiring board according to the first embodiment of the present invention will be described.
In the present embodiment, a case where six parallel wires are formed on a wiring board will be described as an example. Hereinafter, the process up to manufacturing an electronic component (electronic component manufacturing method) using the manufactured wiring board will be described.

(Method for manufacturing a wiring board)
1-6 is a figure which shows the process of the manufacturing method of the wiring board based on this embodiment.
First, the plate 1 serving as a base material is placed on the stage S of the liquid ejection apparatus 100 that can form wiring by the ink jet method (first step).
FIG. 1 is a diagram illustrating a state in which the plate material 1 is installed on the stage S of the liquid ejection apparatus 100 in the first step.
A glass substrate or the like can be used as the plate material 1, and the plate material 1 has a flat surface (hereinafter referred to as “discharged surface F” as appropriate) on which the liquid discharged from the liquid discharge device 100 is stacked. Yes.

The liquid discharge apparatus 100 includes a nozzle N1 that discharges a conductive material in which conductive fine particles are dispersed in a volatile solvent, and a nozzle N2 that discharges an ultraviolet curable insulating material. And the control part 110 of the liquid discharge apparatus 100 controls discharge of the material in these nozzles N1 and nozzle N2.
As the conductive fine particles in the conductive material, a metal such as copper, gold, silver, or aluminum, or an organic conductive substance such as a carbon nanotube can be used.
Further, as the insulating material, an ultraviolet curable resin or the like can be used. For example, a material used in an ultraviolet curable solder resist may be used. Alternatively, a polyimide resin, an epoxy resin, or the like can be used as the insulating material. As the insulating material, a material having low adhesion to the plate material 1 is selected.

Next, a conductive material and an insulating material are alternately discharged from the nozzle N1 and the nozzle N2 onto the discharge surface F of the plate 1 to form a laminate B1 made of a conductive layer and an insulating layer (second step).
FIG. 2 is a diagram illustrating a process in which the stacked body B1 is formed on the discharge target surface F of the plate 1.
In the second step, first, an insulating material is discharged from the nozzle N2 so as to have a uniform thickness (for example, 2 to 3 μm) over the entire surface to be discharged F of the plate 1 to form a first insulating layer. . Then, the conductive material is discharged from the nozzle N1 so as to overlap the insulating material of the first insulating layer, thereby forming the first conductive layer. Further, an insulating material is discharged from the nozzle N2 so as to overlap the conductive material of the first conductive layer, thereby forming a second insulating layer. Similarly, a second conductive layer to a sixth conductive layer and a third insulating layer to a sixth insulating layer are formed.
As a result, in the second step, the stacked body B1 including the first to sixth insulating layers and the first to sixth conductive layers is formed.

Next, the laminated body B1 is transferred from the stage S of the liquid ejection device 100 to the fixed base R of the cutting device 200 while being integrated with the plate 1 (third step).
FIG. 3 is a diagram illustrating a state in which the stacked body B1 is installed on the fixing base R of the cutting device 200.
Here, as the cutting device 200, a cutting device using a Thomson mold, a cutting device using a mold, a laser cutting device, a water cutter, a dicing saw, or a cutting device using etching can be employed. Hereinafter, description will be made assuming that the cutting device 200 is a laser cutting device.

Next, the layered product B1 is cut by irradiating a laser beam to the position of the dividing line (the one-dot chain line in FIG. 3) preset in the layered product B1 (fourth step).
FIG. 4 is a diagram illustrating a process of cutting the stacked body B1.
In the present embodiment, the laminate B1 is described as being supported by the plate material 1 (see FIG. 4A). However, as shown in FIG. It is also possible to install side walls 1a and 1b that support B1.
Here, the dividing line of the multilayer body B1 is set at a position that is the thickness of the wiring calculated in consideration of wiring resistance, stray capacitance, and the like (that is, the cut-out width in the top view of the multilayer body B1).

In the fourth step, the control unit 210 of the cutting device 200 irradiates the laser beam so that the incident angle is smaller than 90 degrees with respect to the upper surface of the multilayer body B1 in the side view along the dividing line in the top view. To do.
Accordingly, it is possible to prevent the laser light irradiated at the time of cutting from being irradiated to the cut-out portion of the laminated body (hereinafter referred to as “wiring board P1”), thereby affecting the insulation and conductivity.

Moreover, the control part 210 of the cutting device 200 removes the insulating layer and the conductive layer in the laminated body B1 one layer at a time, or each one layer of the insulating layer and the conductive layer as one set. That is, the controller 210 performs laser light irradiation so that the two conductive layers are not removed simultaneously.
Accordingly, it is possible to prevent a situation in which laser light is simultaneously applied to different conductive layers and the wiring board P1 is short-circuited at the time of cutting.
The cut-out wiring board P1 is separated from the plate material 1 by irradiating ultraviolet rays to cure the insulating layer in contact with the plate material 1 and lowering the adhesiveness.

The wiring board P1 cut out in the fourth step has the first surface S1 (cut surface) formed by cutting in the fourth step and the second on the side opposite to the first surface S1 (back side). Surface S2 (see FIG. 6). The first surface S1 and the second surface S2 are outer surfaces in a direction intersecting with the layer of the wiring board P1. In the wiring board P1, the width of the wiring is the thickness of the conductive layer formed in the second step (for example, 2 to 3 μm).
Through such a process, the wiring board P1 is manufactured.
As shown in FIG. 4B, when the side walls 1a and 1b for supporting the laminated body B1 are installed at the positions of two adjacent sides in the top view of the plate material 1, it is more effective in the fourth step. Cutting can be performed easily.
In particular, when a cutting device 200 that cuts by applying stress is employed, if the side walls 1a and 1b are installed, deformation or the like during cutting of the laminate B1 can be suppressed, and a short circuit or the like of the conductive layer can be prevented. It becomes possible.

Next, a solder resist is applied to the wiring board P1 cut out from the multilayer body B1 (fifth step).
FIG. 5 is a diagram illustrating a process of applying a solder resist to the wiring board P1.
In the fifth step, a solder resist solution is applied to a portion (shaded area in FIG. 5) other than the area where the electronic element is mounted. At this time, since the conductive layer is exposed on both sides and side surfaces of the wiring board P1, a solder resist is applied to each surface where the conductive layer of the wiring board P1 is exposed.

Next, an electronic element is mounted on the wiring board P1 to which the solder resist is applied (sixth step).
The electrodes of the electronic elements and the wiring of the wiring board P1 are electrically connected by, for example, solder balls.
FIG. 6 is a diagram illustrating a state where the electronic elements D1 and D2 are mounted on the wiring board P1.
As shown in FIG. 6, the electronic element D1 and the electronic element D2 are electrically connected by the wiring (conductive layer) of the wiring board P1, and these wirings correspond to the thickness of the conductive layer in the second step. The wiring interval corresponds to the width of the wiring and the thickness of the insulating layer. In FIG. 6, the electronic element D1 is mounted on the first surface S1, and the electronic element D2 is mounted on the second surface S2 opposite to the first surface S1. One electronic element may be mounted on either the first surface S1 (cut surface) or the second surface S2 of the wiring board P1.

As a result, the electronic elements D1 and D2 are mounted, and an electronic component C1 (electronic component) having a wiring width and a wiring interval determined when the stacked body B1 is formed and a wiring thickness determined when the wiring board P1 is cut out is manufactured. .
This electronic component C1 is assembled with other electronic components to constitute an electronic device as a complete body.

(Function)
Next, the operation will be described.
In the manufacturing method of the wiring board according to the present embodiment, in the second step, a plurality of conductive layers and insulating layers having a predetermined thickness are formed on the discharge target surface F of the plate member 1 to obtain a laminate B1.
Since the thickness of the conductive layer formed at this time corresponds to the width of the wiring of the wiring board P1, in the second step, it corresponds to the width of the wiring in order to realize the target wiring width. The thickness of the conductive layer may be used. Similarly, since the thickness of the insulating layer in the second step corresponds to the wiring interval of the wiring board P1, in order to realize the target wiring interval in the second step, the wiring interval The thickness of the insulating layer corresponding to
The laminate B1 is a laminate in which the wiring structure of the wiring board P1 is laminated.

Then, in the fourth step, the stacked body B1 is cut in a direction in which the conductive layer and the insulating layer overlap (a direction not parallel to the layer) so that the cut-out portion has a predetermined width, and the parallel conductive layers form wiring. A wiring board P1 is obtained.
Since the width provided at the cut-out portion at this time becomes the thickness (height) of the wiring of the wiring board P1, in order to realize the target wiring thickness in the fourth step, the thickness of the wiring is set. The wiring board P1 may be cut out from the multilayer body B1 with a corresponding width.
The wiring board P1 thus formed is subjected to a solder resist in the fifth step, and an electronic element is mounted in the sixth step, so that an electronic device having a target wiring width and wiring interval and wiring thickness is obtained. It becomes a part C1.

FIG. 7 is a diagram illustrating an example of an electronic device including the electronic component C1 manufactured by the wiring board manufacturing method according to the present embodiment.
FIG. 7 shows an example in which an electronic component C1 is assembled as an electronic component in a foldable mobile phone as an electronic device.
In the electronic apparatus shown in FIG. 7, the electronic component C1 can be used as a flexible substrate on which a driver IC for a liquid crystal display is mounted, for example.

As described above, in the method for manufacturing a wiring board according to the present embodiment, the wiring board is obtained by cutting the laminated body including the laminated insulating layer and conductive layer in the direction in which the layers overlap.
Therefore, including the case where it is extremely thin (for example, 2 to 3 μm), the width of the target wiring can be easily realized by the thickness of the insulating layer and the conductive layer.
Therefore, the wiring formed on the wiring board can be further miniaturized.

FIG. 8 is a diagram showing the effect of wiring miniaturization in the present invention.
8A shows a case where the conductive material and the insulating material are discharged at a low viscosity, and FIG. 8B shows a case where the conductive material and the insulating material are discharged from the case of FIG. 8A. The case of discharging at a high viscosity, which is a high viscosity, is shown.
As shown in FIG. 8, in the second step, it is possible to form wiring boards having various wiring widths and intervals by adjusting the viscosity of the liquid discharged as the insulating material and the conductive material. .

Moreover, in the manufacturing method of the wiring board according to the present embodiment, the thickness of the wiring can be easily adjusted by selecting the width when cutting the laminate.
Therefore, the wiring can be easily made thicker than conventional wiring forming techniques such as the ink jet method or the semi-additive method.
FIG. 9 is a diagram showing an effect of the wiring thickness in the present invention.
If the wiring board is required to be thin at a low voltage, as shown in FIG. 9A, the width of the portion cut out from the laminate B1 in the fourth step is narrowed, and the wiring resistance is reduced at a high voltage. If it is a wiring board, as shown in FIG.9 (b), what is necessary is just to widen the width | variety of the part cut out from laminated body B1 in a 4th process.

  Further, in the method for manufacturing a wiring board according to the present embodiment, the wiring board can be obtained in a state where an insulating layer is disposed between the wirings formed by the conductive layer. Insulation between the wirings can be performed more reliably. In addition, since the wiring can be supported by the insulating layer when the electronic element is mounted on the wiring, it is possible to prevent the wiring from being crushed when the electronic element is mounted on the wiring having a certain thickness. .

Further, in the method for manufacturing a wiring board according to the present embodiment, a wiring board with wirings exposed on both sides can be obtained, so that the wiring board can be easily mounted on both sides of the electronic element.
Furthermore, in the method for manufacturing a wiring board according to the present embodiment, since the wiring is formed by cutting the laminated body in the direction in which the layers overlap, the wiring is formed on a plane by discharging droplets onto the substrate. Compared to, there is less unevenness in the shape of the wiring.
Therefore, when the wiring board is bent, the stress is difficult to concentrate, and the generation of cracks can be prevented. In addition, when a high frequency signal is input, the shape of the wiring can be prevented from affecting signal transmission.

In the first embodiment, the case where the insulating layer and the conductive layer are formed by the ink jet method in the second step has been described as an example. However, if the insulating layer and the conductive layer can be stacked, the semi-additive method or the like can be used. Techniques other than the inkjet method can be used.
Here, in the first embodiment, the first to fourth steps mainly correspond to the method for manufacturing a wiring board in the present invention, and the first to sixth steps mainly correspond to the method for manufacturing an electronic component in the present invention. Correspond. Further, the second process corresponds to the stacked body forming process, the fourth process corresponds to the wiring board forming process, and the sixth process corresponds to the mounting process. Further, the wiring board P1 corresponds to the wiring board in the present invention, and the laminated body B1 corresponds to the laminated body of the wiring structure.

(Second Embodiment)
Next, a method for manufacturing a wiring board according to the second embodiment of the present invention will be described.
In the present embodiment, a case where a wiring board having a more complicated wiring pattern than that in the first embodiment is formed will be described as an example.
Here, in the manufacturing method of the wiring board in the present embodiment, the second step is different from the first embodiment.
Therefore, the second step, which is a different part, will be mainly described below.

(Method for manufacturing a wiring board)
In the present embodiment, as in the first embodiment, a plate material is installed on the stage S of the liquid ejection apparatus 100 (first step).
Next, the conductive material and the insulating material are discharged from the nozzle N1 and the nozzle N2 onto the discharge target surface F of the plate member 1 to form a stacked body B2 including the conductive layer and the insulating layer (second step).
At this time, in the present embodiment, as the conductive layer and the insulating layer, a stacked body B2 including not only a uniform planar layer but also a layer in which the conductive layer and the insulating layer are mixed in the same layer is formed. Note that in the case of the liquid ejection device 100 using the inkjet method, the conductive layer and the insulating layer can be formed by switching the nozzles, and thus the stacked body B2 is formed by mixing the conductive layer and the insulating layer in the same layer. Easy to do.

10-23 is a figure which shows the process in which laminated body B2 is formed in the to-be-discharged surface F of the board | plate material 1, (a) of each figure is a top view, (b) is a front view. 10 to 20, for convenience of explanation, the x-axis is set in the width direction of the laminated body B2, the y-axis is set in the depth direction, and the z-axis is set in the direction (vertical direction) perpendicular to the x-axis and y-axis. To do.
In the second step, first, as shown in FIG. 10, the insulating material is discharged from the nozzle N2 so as to have a uniform thickness (for example, 2 to 3 μm) over the entire surface to be discharged F of the plate member 1, A first wiring layer is formed (step 2-1). In the present embodiment, since the first wiring layer is a layer in contact with the plate member 1, the entire surface is an insulating layer without forming a conductive layer.

Then, as shown in FIG. 11, the insulating material is discharged from the nozzle N2 in a range of x = 0 (one end of the laminated body B2) to x = x1 so as to overlap the first wiring layer (second step 2-2). , X = x1 to x = X (the other end of the stacked body B2), the conductive material is discharged from the nozzle N1 (step 2-3), and the second wiring layer is formed.
Next, as shown in FIG. 12, an insulating material is ejected from the nozzle N2 in a range of x = 0 to x = x2 so as to overlap the second wiring layer (step 2-4), and x = x2 to x = Conductive material is discharged from the nozzle N1 in the range of x3 (step 2-5), and insulating material is discharged from the nozzle N2 in the range of x = x3 to x = X (step 2-6). Three wiring layers are formed.

Next, as shown in FIG. 13, the conductive material is discharged from the nozzle N1 in the range of x = 0 to x = x4 so as to overlap the third wiring layer (step 2-7), and x = x4 to x = Insulating material is discharged from the nozzle N2 in the range of X (step 2-8), and the fourth wiring layer is formed.
Next, as shown in FIG. 14, an insulating material is discharged from the nozzle N2 in a range of x = 0 to x = x1 over the fourth wiring layer (step 2-9), and from x = x1 A conductive material is discharged from the nozzle N1 in the range of x = X (step 2-10) to form a fifth wiring layer.

Next, as shown in FIG. 15, the conductive material is discharged from the nozzle N1 in the range of x = 0 to x = x3 so as to overlap the fifth wiring layer (step 2-11), and x = x3 to x = Insulating material is discharged from the nozzle N2 in the range of X (step 2-12) to form the sixth wiring layer.
Next, as shown in FIG. 16, the insulating material is discharged from the nozzle N2 in a range of x = 0 to x = X, overlapping the sixth wiring layer (step 2-13), and the seventh wiring layer is formed. Form. That is, the entire surface of the seventh wiring layer becomes an insulating layer.

Next, as shown in FIG. 17, a conductive material is ejected from the nozzle N1 in a range of x = 0 to x = X so as to overlap the seventh wiring layer (step 2-14), and the eighth wiring layer is formed. Form. That is, the entire surface of the eighth wiring layer becomes a conductive layer.
Next, as shown in FIG. 18, an insulating material is ejected from the nozzle N2 in a range of x = 0 to x = X so as to overlap the eighth wiring layer (step 2-15), and the ninth wiring layer is formed. Form. That is, the entire surface of the ninth wiring layer becomes an insulating layer.

Next, as shown in FIG. 19, the conductive material is discharged from the nozzle N1 in the range of x = 0 to x = x3 so as to overlap the ninth wiring layer (step 2-16), and x = x3 to x = Insulating material is discharged from the nozzle N2 in the range of X (step 2-17), and the tenth wiring layer is formed.
Next, as shown in FIG. 20, the insulating material is ejected from the nozzle N2 in a range of x = 0 to x = x1 over the tenth wiring layer (step 2-18), and from x = x1 A conductive material is discharged from the nozzle N1 in a range of x = X (step 2-19) to form an eleventh wiring layer.

Next, as shown in FIG. 21, the conductive material is ejected from the nozzle N1 in the range of x = 0 to x = x4 over the eleventh wiring layer (step 2-20), and x = x4 to x = Insulating material is discharged from the nozzle N2 in the range of X (step 2-21) to form the twelfth wiring layer.
Next, as shown in FIG. 22, the insulating material is discharged from the nozzle N2 in a range of x = 0 to x = x2 over the twelfth wiring layer (step 2-22), and x = x2 to x = Conductive material is discharged from the nozzle N1 in the range of x3 (step 2-23), and insulating material is discharged from the nozzle N2 in the range of x = x3 to x = X (step 2-24). 13 wiring layers are formed.

Next, as shown in FIG. 23, an insulating material is discharged from the nozzle N2 in the range of x = 0 to x = x1 over the 13th wiring layer (step 2-25), and x = x1 to x = The conductive material is discharged from the nozzle N1 in the range of X (step 2-26), and the fourteenth wiring layer is formed.
As a result, in the second step, the stacked body B2 including the first to fourteenth wiring layers is formed.
Next, the layered product B2 is transferred from the stage S of the liquid ejection device 100 to the fixed base R of the cutting device 200 while being integrated with the plate 1 (third step).

Next, the layered product B2 is cut by irradiating a laser beam to the position of the dividing line (the one-dot chain line in FIG. 24) preset in the layered product B2 (fourth step).
FIG. 24 is a diagram illustrating a process of cutting the stacked body B2.
In this embodiment, each wiring layer is formed so that the wiring board P2 when the stacked body B2 is cut has a more complicated pattern than the parallel wiring in the first embodiment.
Specifically, as shown in FIG. 24, the wiring board P2 cut out in the fourth step has a pattern in which wirings are formed at equal intervals at one end and the wiring intervals are widened at the other end. Yes.
Through such a process, the wiring board P2 is manufactured.

Next, a solder resist is applied to the wiring board P2 cut out from the laminate B2 (fifth process), and an electronic element is mounted on the wiring board P2 to which the solder resist is applied (sixth process).
FIG. 25 is a diagram illustrating a state where the electronic elements D1 and D2 are mounted on the wiring board P2.
Since the wiring board P2 in the second embodiment has a shape in which the wiring interval is wider than the other end, for example, an integrated circuit such as an LCD controller is mounted as the electronic element D1 in a region where the wiring interval is narrow. In addition, a signal processing circuit for a specified interface or the like can be mounted as the electronic element D2 in a region where the wiring interval is wide.
As a result, the electronic component C2 having the wiring board P2 corresponding to the shape of each wiring layer of the multilayer body B2 and the wiring thickness determined when the wiring board P2 is cut out is manufactured.
This electronic component C2 is assembled with other electronic components to constitute an electronic device as a complete body.

(Function)
Next, the operation will be described.
In the manufacturing method of the wiring board according to the present embodiment, in the second step, a plurality of wiring layers having a predetermined shape are formed on the discharge target surface F of the plate 1 to obtain a laminate B2.
Since the thickness of the conductive layer formed at this time corresponds to the width of the wiring of the wiring board P2, in the second step, it corresponds to the width of the wiring in order to realize the target wiring width. A wiring layer structure having a conductive layer having a thickness may be used. Similarly, since the thickness of the insulating layer in the second step corresponds to the wiring interval of the wiring board P2, in order to realize the target wiring interval in the second step, the wiring interval is set. A wiring layer structure having an insulating layer with a thickness corresponding to the above may be used. Furthermore, in the second step, in order to realize the wiring of the target pattern, a plurality of wiring layers having the cross section of the pattern may be sequentially formed. Even if the target wiring pattern is complicated, each direction can be more easily determined by determining the direction of stacking so that the direction along which more wirings follow and the discharge surface F of the plate 1 are parallel to each other. A wiring layer can be formed.
The laminate B2 is a laminate in which the wiring structure of the wiring board P2 is laminated.

Then, in the fourth step, the stacked body B2 is cut in the direction in which the conductive layer and the insulating layer overlap (the direction not parallel to the layer) so that the portion to be cut out has a predetermined width, and a wiring having a target pattern is formed. A wiring board P2 is obtained.
Since the width provided at the cut-out portion at this time is the thickness (height) of the wiring of the wiring board P2, in order to realize the desired wiring thickness in the fourth step, the thickness of the wiring is set. The wiring board P2 may be cut out from the stacked body B2 with a corresponding width.
The wiring board P2 thus formed is subjected to a solder resist in the fifth step, and the electronic elements are mounted in the sixth step, so that the intended wiring width and wiring interval, wiring thickness, wiring wiring, An electronic component C2 having a pattern is obtained.

As described above, in the method for manufacturing the wiring board according to the present embodiment, the wiring board is obtained by cutting the laminated body including the wiring layer in which the insulating layer and the conductive layer are mixed in the overlapping direction.
Therefore, including the case where it is extremely thin (for example, 2 to 3 μm), the width of the target wiring can be easily realized by the thickness of the insulating layer and the conductive layer.
Therefore, the wiring formed on the wiring board can be further miniaturized.
Furthermore, in the method for manufacturing a wiring board according to the present embodiment, a desired wiring pattern can be easily realized by the shape of the wiring layer.

FIG. 26 is a diagram illustrating another example of the wiring board manufactured by using the wiring board manufacturing method according to the second embodiment.
As shown in FIG. 26, by forming the conductive layers so as to overlap each other in adjacent wiring layers, a wiring board P2 having a wider wiring width can be formed when the stacked body B2 is divided.
Similarly, by forming the insulating layers on the adjacent wiring layers so as to overlap each other, it is possible to form the wiring board P2 having a wider wiring interval when the stacked body B2 is divided.

  Here, in the second embodiment, the first to fourth steps mainly correspond to the method for manufacturing a wiring board in the present invention, and the first to sixth steps mainly correspond to the method for manufacturing an electronic component in the present invention. Correspond. Further, the second process corresponds to the stacked body forming process, the fourth process corresponds to the cutting process, and the sixth process corresponds to the mounting process. Further, the wiring board P2 corresponds to the wiring board in the present invention, and the laminated body B2 corresponds to the laminated body of the wiring structure.

(Application examples)
In the first and second embodiments, when the stacked bodies B1 and B2 are cut in the fourth step, a dividing line composed of one straight line is set, and wiring is performed from the stacked bodies B1 and B2 by a plane along the dividing line. The substrates P1 and P2 were cut out.
On the other hand, in this application example, the shape of the wiring boards P1 and P2 to be cut out is made more complicated by making the dividing lines of the stacked bodies B1 and B2 not be one straight line but a bent line or the like. . That is, the stacked bodies B1 and B2 are cut so that the width of the cut-out portion (the wiring thickness of the wiring boards P1 and P2) varies depending on the position.
For example, as the dividing line, a narrow part and a wide part for cutting out the wiring boards P1 and P2 are set, or a part where the cutting width gradually changes is set.

FIG. 27 is a diagram illustrating an example in which the width of a portion cut out from the stacked body is changed.
In addition, in FIG. 27, the case where the laminated body B1 is cut | disconnected is shown as an example.
In the example shown in FIG. 27, in the range close to the origin of the x-axis, the wiring board is cut out with a constant narrow width, and then the wiring board is cut out by increasing the width as the x-axis increases. The wiring board is cut out with a certain wide width to the end.
Thereby, the cut-out wiring board P1 has a complicated shape with different thicknesses depending on the portion.
Therefore, by increasing the thickness of the wiring board, the strength of the wiring board can be increased, and handling when mounting the electronic element is facilitated.
Moreover, since a highly flexible portion and a highly rigid portion can be mixed in one wiring board, the strength characteristics required for the wiring board can be easily realized.

DESCRIPTION OF SYMBOLS 1 Board | plate material, B1, B2 laminated body, C1, C2 electronic component, D1, D2 electronic element, F discharge surface, N1, N2 nozzle, P1, P2 wiring board, R fixed base, S stage, 1a, 1b side wall, 100 Liquid ejection device, 110, 210 control unit, 200 cutting device.

Claims (8)

A laminate forming step of forming a laminate including the insulating layer and the conductive layer by laminating a plurality of layers formed by at least one of an insulating layer and a conductive layer;
A cutting step of cutting the laminate formed in the laminate formation step along a plane intersecting a plurality of the layers;
A method for manufacturing a wiring board, comprising:   2. The method of manufacturing a wiring board according to claim 1, wherein, in the laminated body forming step, at least one of the layers is formed by a portion made of the insulating layer and a portion made of the conductive layer.   3. The method for manufacturing a wiring board according to claim 1, wherein in the laminate forming step, the plurality of layers are formed by an ink jet method. A laminate forming step of forming a laminate including the insulating layer and the conductive layer by laminating a plurality of layers formed by at least one of an insulating layer and a conductive layer;
The laminated body formed in the laminated body forming step is cut along a plane intersecting a plurality of the layers, configured by one of the laminated bodies, and a first surface formed by the cutting, and the first A wiring board forming step of forming a wiring board having a second surface opposite to the first surface;
A mounting step of mounting an electronic element on at least one of the first surface and the second surface of the wiring board;
The manufacturing method of the electronic component characterized by including.   5. The method of manufacturing an electronic component according to claim 4, wherein, in the laminate forming step, at least one of the layers is formed by a portion made of the insulating layer and a portion made of the conductive layer.   6. The method of manufacturing an electronic component according to claim 4, wherein, in the laminate forming step, the plurality of layers are formed by an inkjet method.   A laminate in which a plurality of layers formed of at least one of an insulating layer and a conductive layer are stacked has a configuration cut along a plane intersecting with the plurality of layers, and the insulating layer and the conductive layer are cut on the cut surface. A wiring board having a wiring pattern formed by layers. A plurality of layers formed by at least one of an insulating layer and a conductive layer are stacked, and a wiring board having a wiring pattern constituted by the insulating layer and the conductive layer on an outer surface in a direction intersecting the plurality of layers,
An electronic element mounted on the outer surface of the wiring board and connected to the conductive layer of the wiring pattern;
An electronic component comprising:

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