WO2021199261A1 - Component module - Google Patents

Component module Download PDF

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Publication number
WO2021199261A1
WO2021199261A1 PCT/JP2020/014782 JP2020014782W WO2021199261A1 WO 2021199261 A1 WO2021199261 A1 WO 2021199261A1 JP 2020014782 W JP2020014782 W JP 2020014782W WO 2021199261 A1 WO2021199261 A1 WO 2021199261A1
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WO
WIPO (PCT)
Prior art keywords
heat transfer
transfer member
metal layer
heat
core material
Prior art date
Application number
PCT/JP2020/014782
Other languages
French (fr)
Japanese (ja)
Inventor
河野満治
夏目真志
Original Assignee
太陽誘電株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 太陽誘電株式会社 filed Critical 太陽誘電株式会社
Priority to PCT/JP2020/014782 priority Critical patent/WO2021199261A1/en
Publication of WO2021199261A1 publication Critical patent/WO2021199261A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/08—Cooling; Ventilating
    • H01F27/22—Cooling by heat conduction through solid or powdered fillings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections

Definitions

  • the present invention relates to a component module, for example, a component module having a coil component and a method for manufacturing the component module.
  • Coil parts are used in power conversion circuits such as DC-DC converters.
  • the coil components are mounted on the board.
  • a transformer is mounted and a heat radiating member is provided on a substrate (for example, Patent Document 1).
  • a heat radiating member connected to a coil component for example, Patent Document 2.
  • the present invention has been made in view of the above problems, and an object of the present invention is to improve the heat dissipation of coil parts.
  • the present invention comprises a substrate, a metal layer provided on the substrate, a winding and a core material covering at least a part of the winding, and a terminal for electrically connecting the winding to the metal layer. It is a component module including a coil component mounted on the substrate and a heat radiating member connected to at least one of the terminal and the metal layer via a path other than the core material.
  • a joint portion bonded to at least one of the terminal and the metal layer, a heat radiating portion joined on a portion of the core material covering the winding, and the joint portion and the heat radiating portion are provided.
  • a heat transfer member having a connecting portion to be connected and having a thermal conductivity higher than that of the core material is provided, and the heat transfer member is joined on the heat radiation portion of the heat transfer member. can do.
  • the heat transfer member may be a metal member.
  • the joint portion of the heat transfer member may be joined to the terminal.
  • a recess may be provided on the surface of the core material, and at least a part of the connection portion and the heat dissipation portion of the heat transfer member may be embedded in the recess.
  • the terminal includes a first terminal and a second terminal connected to both ends of the winding, respectively, and the metal layer is a first metal connected to the first terminal and the second terminal, respectively.
  • the heat transfer member includes a layer and a second metal layer, and the heat transfer member includes a first heat transfer member joined to at least one of the first terminal and the first metal layer, and the second terminal and the second metal layer.
  • the heat transfer member includes at least one of the second heat transfer members, and the heat transfer member is joined on the heat radiation portion of the first heat transfer member and the heat radiation portion of the second heat transfer member. Can be done.
  • At least a part of the connecting portion can be provided on the surface of the core material.
  • connection portion can be configured to extend in the air.
  • the heat transfer member can be configured to be an integral metal plate.
  • the heat transfer member may be a plating layer formed on the surface of the core material.
  • the heat radiating member may be joined on the metal layer and may be joined to a portion of the core material that covers the side of the winding.
  • a switching element that is connected to the coil component via the metal layer and mounted on the substrate can be provided.
  • the heat dissipation of the coil parts can be improved.
  • FIG. 1 (a) to 1 (c) are a top view and a side view of the coil components used in the first embodiment, respectively.
  • 2 (a) and 2 (b) are perspective views of the coil component used in the first embodiment.
  • FIG. 3 is a circuit diagram of a power conversion circuit in which the first embodiment is used.
  • 4 (a) and 4 (b) are plan views of the component module according to the first embodiment.
  • FIG. 5 is a front schematic view of the component module according to the first embodiment.
  • 6 (a) to 6 (c) are a schematic top view, a schematic front view, and a schematic right side view of the vicinity of the coil component in the component module according to the first embodiment, respectively.
  • FIG. 7 is a front schematic view of the component module according to Comparative Example 1.
  • 8 (a) to 8 (c) are a schematic top view, a schematic front view, and a schematic right side view of the vicinity of the coil component in the component module according to the first modification of the first embodiment.
  • 9 (a) to 9 (c) are a schematic top view, a schematic front view, and a schematic right side view of the vicinity of the coil component in the component module according to the second modification of the first embodiment, respectively.
  • 10 (a) to 10 (c) are a schematic top view, a schematic front view, and a schematic right side view of the vicinity of the coil component in the component module according to the third modification of the first embodiment, respectively.
  • 11 (a) to 11 (c) are a schematic top view, a schematic front view, and a schematic right side view of the vicinity of the coil component in the component module according to the modified example 4 of the first embodiment, respectively.
  • 12 (a) to 12 (c) are a schematic top view, a schematic front view, and a schematic right side view of the vicinity of the coil component in the component module according to the modified example 5 of the first embodiment, respectively.
  • 13 (a) to 13 (c) are a schematic top view, a schematic front view, and a schematic right side view of the vicinity of the coil component in the component module according to the modified example 6 of the first embodiment, respectively.
  • FIG. 14 (a) to 14 (f) are schematic front views of the vicinity of the coil component showing the manufacturing method of the component module according to the modified example 7 of the first embodiment.
  • 15 (a) to 15 (e) are schematic front views of the vicinity of the coil component showing the manufacturing method of the component module according to the modified example 8 of the first embodiment.
  • 16 (a) to 16 (d) are schematic front views of the vicinity of the coil component showing the manufacturing method of the component module according to the modification 9 of the first embodiment.
  • FIG. 17 is a plan view of the component module according to the second embodiment.
  • FIG. 18 is a front schematic view of the vicinity of the coil component of the component module according to the second embodiment.
  • 1 (a) to 1 (c) are a top view and a side view of the coil components used in the first embodiment, respectively.
  • 2 (a) and 2 (b) are perspective views of the coil component used in the first embodiment.
  • the plane directions of the substrate on which the coil component 10 is mounted are the X direction and the Y direction.
  • the direction from the front to the back is the Y direction.
  • the direction from the left side surface to the right side surface is the X direction.
  • the coil component 10 mainly includes a winding 12, a core material 14, and a sealing resin 16. Both ends of the winding 12 are connected to terminals 13a and 13b, respectively.
  • the terminals 13a and 13b are led out from the winding 12 in the front direction ( ⁇ Y direction), are bent downward ( ⁇ Z direction) toward the tip, and are further bent in the front direction.
  • the portion bent in the front direction is the joint portion 13c joined to the metal layer on the substrate.
  • the portion that connects the winding 12 and the joint portion 13c is the connection portion 13d.
  • the winding 12 and the terminals 13a and 13b are metal members whose main material is, for example, copper, iron or aluminum.
  • the core material 14 covers at least a part of the winding 12.
  • the core material 14 includes a central portion 14a and an outer portion 14b.
  • the central portion 14a is substantially columnar.
  • the winding 12 is wound around the central portion 14a in the space between the central portion 14a and the outer portion 14b.
  • the outer 14b covers the upper part, the lower part, the right side part and the left side part of the winding 12.
  • the magnetic field lines generated by the winding 12 pass through the central portion 14a and the outer 14b.
  • the core material 14 is a high magnetic permeability magnetic material, and is made of, for example, a material in which iron oxide is the main material, metal compounds such as manganese, magnesium, nickel and zinc are mixed and sintered at a high temperature.
  • the sealing resin 16 seals the winding 12 in the space between the central portion 14a and the outer 14b.
  • the sealing resin 16 is an organic insulator such as an epoxy resin.
  • the sealing resin 16 may be a non-magnetic material or a high magnetic permeability magnetic material.
  • the core material 14 may cover all of the windings 12 except the terminal 13a. The sealing resin 16 may not be provided.
  • FIG. 3 is a circuit diagram of a power conversion circuit in which the first embodiment is used.
  • an input capacitor Cin is connected between the input terminal Tin and the ground terminal Tgnd.
  • An input capacitor Cin is connected between the input terminal Tin and the ground terminal Tgnd, and transistors Tr1 and Tr2 are connected in series in parallel with this capacitor Cin.
  • the source S, gate G and drain D of the transistor Tr1 are connected to the node SW, the drive circuit 31 and the input terminal Tin, respectively, and the source S, the gate G and the drain D of the transistor Tr2 are connected to the ground terminal Tgnd, the drive circuit 31 and the input terminal Tin, respectively. It is connected to the node SW.
  • a coil L is connected between the node SW and the output terminal Tout.
  • An output capacitor Cout is connected between the output terminal Tout and the ground terminal Tgnd.
  • a load Z is connected between the output terminal Tout and the ground terminal Tgnd, and the output capacitor Cout and the load Z are connected in parallel.
  • the drive circuit 31 controls the on and off of the transistors Tr1 and Tr2.
  • a DC input voltage Vin is applied between the input terminal Tin and the ground terminal Tgnd.
  • the drive circuit 31 turns the transistors Tr1 and Tr2 on and off, respectively.
  • a current flows from the input terminal Tin to the output terminal Tout, and an electric charge is accumulated in the output capacitor Cout. Further, magnetic field energy is stored in the coil L.
  • a DC output voltage Vout is output between the output terminal Tout and the ground terminal Tgnd.
  • the drive circuit 31 When the output voltage Vout becomes higher than the target voltage, the drive circuit 31 turns off and on the transistors Tr1 and Tr2, respectively. A commutation current flows through the transistor Tr2 due to the magnetic field energy of the coil L, and the output voltage Vout is maintained. When the output voltage Vout becomes lower than the desired voltage, the drive circuit 31 turns the transistors Tr1 and Tr2 on and off, respectively. As a result, the voltage of the output terminal Tout becomes a substantially constant output voltage Vout.
  • the power conversion circuit in which the component module of the first embodiment is used may be a step-up DC-DC converter, an AC (Alternating Current) -DC converter, or a DC-AC converter in addition to the step-down DC-DC converter.
  • a DC-DC converter is preferable from the viewpoint of using coil components.
  • FIG. 4 (a) and 4 (b) are plan views of the component module according to the first embodiment.
  • FIG. 4A is a plan view in which the heat radiation fins 22 and 38 are not provided
  • FIG. 4B is a plan view in which the heat radiation fins 22 and 38 are provided.
  • a metal layer 42 is provided on the substrate 40.
  • a coil component 10, a semiconductor component 30, and electronic components 30a and 30b connected to the metal layer 42 are mounted on the substrate 40.
  • the coil component 10 is the coil component 10 shown in FIGS. 1A to 2B, and corresponds to the coil L in FIG.
  • the semiconductor component 30 is, for example, a power transistor such as an IGBT (Insulated Gate Bipolar Transistor), a bipolar transistor, or a FET (Field Effect Transistor).
  • a semiconductor material such as Si, GaN or SiC is used for the transistor.
  • the semiconductor component 30 is, for example, a bare chip or a package in which a bare chip is sealed and mounted.
  • the package on which the bare chip is mounted is a package such as WLP (Wafer Level Package) or SIP (Single Inline Package).
  • the semiconductor component 30 is a bare chip of a GaN FET which is a horizontal transistor.
  • the semiconductor component 30 includes the transistors Tr1 and Tr2 of FIG.
  • the electronic component 30a has, for example, an integrated circuit formed on a silicon substrate, and is, for example, a bare chip or a package in which a bare chip is sealed and mounted.
  • the electronic component 30a includes the drive circuit 31 of FIG.
  • the electronic component 30b is a discrete passive component such as a chip capacitor, a chip inductor or a chip resistor.
  • the electronic component 30b includes the input capacitor Cin and the output capacitor Cout of FIG.
  • the metal layer 42 is a terminal Tsw corresponding to an input terminal Tin, an output terminal Tout, a ground terminal Tgnd, and a node SW.
  • An electronic component 30b which is an input capacitor Cin, is connected between the input terminal Tin and the ground terminal Tgnd.
  • a semiconductor component 30 which is a transistor Tr1 is connected between the input terminal Tin and the terminal Tsw.
  • a coil component 10 is connected between the terminal Tsw and the output terminal Tout.
  • An electronic component 30b, which is an output capacitor Cout is connected between the output terminal Tout and the ground terminal Tgnd.
  • the electronic component 30a is connected to the ground terminal Tgnd. Wiring for connecting the electronic component 30a and the gates of the transistors Tr1 and Tr2 in the semiconductor component 30 is provided in the substrate 40.
  • the heat radiation fins 22 are provided on the coil component 10, and the heat radiation fins 38 are provided on the semiconductor component 30.
  • the heat radiation fin 22 has a plurality of fins 22a, and the heat radiation fin 38 has a plurality of fins 38a.
  • FIG. 5 is a front schematic view of the component module according to the first embodiment.
  • FIG. 5 shows the winding 12 in the coil component 10 in a simplified manner.
  • the stretching directions of the fins 22a and 38a of the heat radiation fins 22 and 38 are shown differently from the stretching directions of the fins 22a and 38a of the heat radiation fins 22 and 38 in FIG. 4 (b).
  • each member is hatched so that each member can be easily understood. The same applies to the schematic views of the following component modules and coil components.
  • a metal layer 42 is provided on the substrate 40.
  • the substrate 40 is, for example, a resin substrate such as a glass epoxy substrate or a ceramic substrate.
  • the metal layer 42 uses, for example, copper as a main material.
  • the coil component 10 and the semiconductor component 30 are mounted on the metal layer 42.
  • a heat transfer member 18 is provided on the coil component 10 from the metal layer 42.
  • the heat transfer member 18 includes a joint portion 18c, a connection portion 18d, and a heat dissipation portion 18e.
  • the joint portion 18c is joined on the metal layer 42.
  • the heat radiating portion 18e is provided on the coil component 10.
  • the connecting portion 18d connects the joining portion 18c and the heat radiating portion 18e.
  • the joint portion 13c at the tips of the terminals 13a and 13b and the metal layer 42 are joined by a joining member 44.
  • the terminals 13a and 13b connect the metal layer 42 and the winding 12.
  • the joint portion 18c of the heat transfer member 18 and the metal layer 42 are joined by the joint member 44.
  • the side surface of the joint portion 13c and the side surface of the joint portion 18c are joined by a joining member 44.
  • the joining member 44 is, for example, a brazing material such as solder or a sintered metal of a conductive paste.
  • An electrode 30c is provided on the lower surface of the semiconductor component 30.
  • the electrode 30c is, for example, a source electrode, a drain electrode and a gate electrode, and for example, copper, gold, aluminum or silver is used as a main material.
  • the metal layer 42 and the electrode 30c are joined by a joining member 46.
  • the joining member 46 is, for example, a brazing material such as solder or a sintered metal of a conductive paste.
  • a heat sink 34 is bonded onto the semiconductor component 30 via a bonding layer 32.
  • the heat radiating plate 34 is, for example, a DBC (Direct Bonded Cupper) or a DBA (Direct Bonded Aluminum), and has a structure in which the insulating layer 34b is sandwiched between the metal layers 34a and 34c.
  • the heat radiating plate 34 may be a metal plate such as a copper plate or an insulating plate such as an aluminum nitride plate or an aluminum oxide plate.
  • the heat radiating fins 38 are joined on the heat radiating plate 34 via the joining layer 36.
  • the bonding layers 20, 32 and 36 are, for example, a brazing material such as solder, a sintered metal of a conductive paste, or a heat transfer grease.
  • 6 (a) to 6 (c) are a schematic top view, a schematic front view, and a schematic right side view of the vicinity of the coil component in the component module according to the first embodiment, respectively.
  • the metal layer 42 is joined to the joint portion 13c at the tip of the terminal 13a and the joint portion 18c of the heat transfer member 18 by the joint member 44.
  • a support member for supporting the coil component 10 on the substrate 40 is provided on the lower surface of the coil component 10, but illustration and description thereof will be omitted.
  • the heat radiating portion 18e is provided on the core material 14 of the coil component 10.
  • the connecting portion 18d is provided along the front side surface of the core material 14.
  • the width of the heat radiating portion 18e in the front and back directions (Y direction) is larger than the width of the connecting portion 18d in the X direction.
  • the heat transfer member 18 is formed of a rigid metal layer such as a lead frame, and the heat radiating portion 18e and the connecting portion 18d of the heat transfer member 18 are joined to the core material 14 by a joining layer. The method of joining the heat transfer member 18 and the core material 14 will be described later.
  • FIG. 7 is a front schematic view of the component module according to Comparative Example 1. As shown in FIG. 7, the heat transfer member 18 and the heat radiation fin 22 are not provided. Other configurations are the same as those in FIG. 5 of the first embodiment, and the description thereof will be omitted.
  • the paths through which the heat generated in the semiconductor component 30 is conducted are the path 56 and the path 58.
  • the path 56 reaches the metal layer 42 from the semiconductor component 30 via the joining member 46.
  • the path 58 reaches the heat radiation fin 38 from the semiconductor component 30 via the joint layer 32, the heat sink 34, and the joint layer 36.
  • the heat dissipation fin 38 has better heat dissipation than the metal layer 42. Therefore, the heat generated in the semiconductor component 30 can be efficiently dissipated.
  • heat is mainly generated in the winding 12.
  • Heat reaches the metal layer 42 from the winding 12 via the terminals 13a and 13b and the joining member 44.
  • the heat dissipation of the metal layer 42 is not high, it is difficult to efficiently dissipate the heat generated in the coil component 10.
  • the thermal conductivity of the core material 14 is several W / m ⁇ K, which is about 1/100 of the thermal conductivity of 400 W / m ⁇ K of copper. Therefore, even if the heat radiating fins are joined to the upper part of the core material 14, efficient heat radiating cannot be performed as in the semiconductor component 30.
  • the temperature of the winding 12 rises, the DC resistance of the winding 12 increases, and the power conversion efficiency of the power conversion circuit decreases.
  • the joint portion 18c of the heat transfer member 18 is joined to at least one of the terminal 13a and the metal layer 42, and the heat radiating portion 18e is joined to the portion of the core material 14 that covers the winding 12.
  • the connecting portion 18d connects the joining portion 18c and the heat radiating portion 18e.
  • the heat transfer member 18 has a thermal conductivity higher than that of the core material 14.
  • the heat radiation fin 22 is connected to at least one of the terminal 13a and the metal layer 42 via a path 52 other than the core material 14.
  • the heat generated in the winding 12 is conducted to the heat radiating fins 22 via the terminals 13a and the heat transfer member 18. Therefore, it is possible to suppress an increase in the temperature of the winding 12, an increase in the DC resistance of the winding 12, and a decrease in the conversion efficiency of the power conversion circuit.
  • the heat transfer member 18 may be an insulating member, but is preferably a metal member as a member having high thermal conductivity.
  • a metal member as a member having high thermal conductivity.
  • aluminum or iron may be used as a main material in addition to copper.
  • the thermal conductivity of the heat transfer member 18 is preferably 10 times or more, preferably 100 times or more, the thermal conductivity of the core material 14.
  • the joint portion 18c of the heat transfer member 18 is joined to the terminal 13a.
  • the heat generated in the winding 12 is conducted from the terminal 13a to the heat transfer member 18. Therefore, the heat dissipation property via the heat transfer member 18 can be further improved.
  • [Modification 1 of Example 1] 8 (a) to 8 (c) are a schematic top view, a schematic front view, and a schematic right side view of the vicinity of the coil component in the component module according to the first modification of the first embodiment.
  • the connecting portion 18d of the heat transfer member 18 is provided along the right side surface of the core material 14.
  • Other configurations are the same as those in FIGS. 6 (a) to 6 (c) of the first embodiment, and the description thereof will be omitted.
  • [Modification 2 of Example 1] 9 (a) to 9 (c) are a schematic top view, a schematic front view, and a schematic right side view of the vicinity of the coil component in the component module according to the second modification of the first embodiment, respectively.
  • the joint portion 18c of the heat transfer member 18 is joined to the upper surface of the joint portion 13c of the terminal 13a via the joint member 45. ing.
  • the material of the joining member 45 is the same as that of the joining member 44.
  • the connecting portion 18d is connected to the heat radiating portion 18e from the upper part of the joint portion 18c without contacting the core material 14.
  • Other configurations are the same as those in FIGS. 6 (a) to 6 (c) of the first embodiment, and the description thereof will be omitted.
  • Example 1 of FIGS. 6 (a) to 6 (c) and 8 (a) to 8 (c) and a modification thereof 1 at least a part of the connecting portion 18d is on the surface of the core material 14. It may be provided and may be provided along the surface of the core material 14. As a result, the connecting portion 18d can be stably fixed.
  • Example 1 of FIGS. 6 (a) to 6 (c) has a shorter connection portion 18d than the modified example 1 of embodiment 1 of FIGS. 8 (a) to 8 (c), so that the thermal resistance can be lowered and heat dissipation can be reduced. Can be improved.
  • At least a part of the connecting portion 18d extends in the air without following the core material 14, and dissipates heat from the joint portion 18c. It may be connected to the part 18e. As a result, the heat of the winding 12 can be transferred to the heat radiating portion 18e without escaping the heat from the connecting portion 18d to the core material 14. Further, since the connection portion 18d can be shortened, the thermal resistance can be lowered and the heat dissipation can be improved.
  • [Modification 3 of Example 1] 10 (a) to 10 (c) are a schematic top view, a schematic front view, and a schematic right side view of the vicinity of the coil component in the component module according to the third modification of the first embodiment, respectively.
  • the heat transfer members 18a and 18b are provided in the modified example 3 of the first embodiment.
  • the joint portion 18c of the heat transfer member 18a is joined to the terminal 13a on the right side (+ X side) and the metal layer 42a on the right side.
  • the joint portion 18c of the heat transfer member 18b is joined to the terminal 13b on the left side ( ⁇ X side) and the metal layer 42b on the left side.
  • the connecting portions 18d of the heat transfer members 18a and 18b are provided along the front side surface of the core material 14.
  • the width of the heat radiating portions 18e of the heat transfer members 18a and 18b in the Y direction is substantially the same as the width of the connecting portions 18d in the X direction.
  • the upper surfaces of the heat radiating portions 18e of the heat transfer members 18a and 18b are respectively joined to the heat radiating fins 22 via the bonding layer 20.
  • Other configurations are the same as those in FIGS. 6 (a) to 6 (c) of the first embodiment, and the description thereof will be omitted.
  • [Modified Example 4 of Example 1] 11 (a) to 11 (c) are a schematic top view, a schematic front view, and a schematic right side view of the vicinity of the coil component in the component module according to the modified example 4 of the first embodiment, respectively.
  • the connecting portion 18d of the heat transfer member 18a is provided along the right side surface of the core material 14, and the heat transfer member is provided.
  • the connecting portion 18d of 18b is provided along the left side surface of the core material 14.
  • [Modification 5 of Example 1] 12 (a) to 12 (c) are a schematic top view, a schematic front view, and a schematic right side view of the vicinity of the coil component in the component module according to the modified example 5 of the first embodiment, respectively.
  • the joint portion 18c of the heat transfer member 18a is joined to the upper surface of the joint portion 13c of the terminal 13a on the right side (+ X side). It is joined via a member 45.
  • the joint portion 18c of the heat transfer member 18b is joined to the upper surface of the joint portion 13c of the terminal 13b on the left side ( ⁇ X side) via the joint member 45.
  • the material of the joining member 45 is the same as that of the joining member 44.
  • the connecting portion 18d is connected to the heat radiating portion 18e from the upper part of the joint portion 18c without contacting the core material 14.
  • Other configurations are the same as those in FIGS. 10 (a) to 10 (c) of the third modification of the first embodiment, and the description thereof will be omitted.
  • Terminals 13a (first terminal) and terminals 13b (second terminal) are connected to both ends of the winding 12, respectively, as in modifications 3 to 5 of the first embodiment of FIGS. 10 (a) to 12 (c).
  • the metal layer 42a (first metal layer) is connected to the terminal 13a
  • the metal layer 42b (second metal layer) is connected to the terminal 13b.
  • the heat transfer member 18a (first heat transfer member) is joined to at least one of the terminal 13a and the metal layer 42a
  • the heat transfer member 18b (second heat transfer member) is joined to at least one of the terminal 13b and the metal layer 42b.
  • the heat radiating fins 22 are joined on the heat radiating portions 18e of the heat transfer members 18a and 18b.
  • the heat transfer members 18a and 18b When the heat transfer members 18a and 18b are made of an insulating material, the heat transfer members 18a and 18b may be in contact with each other. When the heat transfer members 18a and 18b are made of a metal material, the heat transfer members 18a and 18b are electrically separated so as not to electrically short-circuit the terminals 13a and 13b.
  • [Modified Example 6 of Example 1] 13 (a) to 13 (c) are a schematic top view, a schematic front view, and a schematic right side view of the vicinity of the coil component in the component module according to the modified example 6 of the first embodiment, respectively.
  • the recess 15a is provided on the front side surface of the core material 14, and the recess 15b is provided on the upper surface of the core material 14. ing. A part of the connecting portion 18d of the heat transfer member 18 is fitted in the recess 15a, and the heat radiating portion 18e of the heat transfer member 18 is fitted in the recess 15b.
  • Other configurations are the same as those in FIGS. 6 (a) to 6 (c) of the first embodiment, and the description thereof will be omitted.
  • the recesses 15a and 15b are provided on the surface of the core material 14, and the connecting portion 18d and the heat radiating portion 18e of the heat transfer member 18 are provided. At least part of it is embedded in the recesses 15a and 15b.
  • the coil component 10 can be miniaturized, so that the component module can be miniaturized.
  • the heat radiating portion 18e of the heat transfer member 18 is embedded in the recess 15b, and the upper surface of the heat radiating portion 18e and the upper surface of the core material 14 are made substantially flat.
  • the heat radiation fins 22 can be stably fixed on the core material 14.
  • at least a part of the heat transfer member 18 may be embedded in the recess provided on the surface of the core material 14.
  • Modification 7 of Example 1] 14 (a) to 14 (f) are schematic front views of the vicinity of the coil component showing the manufacturing method of the component module according to the modified example 7 of the first embodiment.
  • Modification 7 of the first embodiment is an example in which a rigid metal member such as a lead frame is used as the heat transfer member 18.
  • the coil component 10 is prepared. Of the terminals 13a and 13b of the coil component 10, the joint portion 13c is exposed from the core material 14. The coil component 10 is not provided with a heat transfer member.
  • the adhesive 17 is applied to the region of the surface of the core material 14 of the coil component 10 to which the heat transfer member 18 is joined.
  • the adhesive 17 is a resin adhesive such as an epoxy resin.
  • the adhesive 17 may be another joining member.
  • the heat transfer member 18 is attached to the core material 14.
  • the heat transfer member 18 is a metal plate that has been bent in advance according to the surface shape of the core material 14. The heat treatment cures the adhesive 17 and adheres the heat transfer member 18 to the core material 14.
  • the joint portion 13c of the terminals 13a and 13b and the joint portion 18c of the heat transfer member 18 are arranged on the metal layer 42 via the joint member 44.
  • the joint portions 13c and 18c are joined onto the metal layer 42 via the joining member 44.
  • the joining member 44 is a brazing material or a conductive paste
  • heat treatment is performed at a temperature of 100 ° C. to 300 ° C.
  • the joining member 44 also enters between the joining portions 13c and 18c.
  • the bonding layer 20 is formed on the heat radiating portion 18e of the heat transfer member 18.
  • the bonding layer 20 is, for example, TIM (Thermal Interface Material), for example, a heat transfer grease in which high thermal conductive particles are contained in a silicone resin.
  • the heat radiation fins 22 are bonded onto the bonding layer 20.
  • the component module of the modified example 7 of the first embodiment is manufactured.
  • the component modules of the first embodiment and the modified examples 1 to 6 thereof can also be manufactured by the same method as the modified example 7 of the first embodiment.
  • the heat transfer member 18 is formed by bending an integral metal plate and joined to the core material 14 as shown in FIG. 14 (c). Thereby, the heat transfer member 18 can be easily formed.
  • Modification 8 of Example 1 15 (a) to 15 (e) are schematic front views of the vicinity of the coil component showing the manufacturing method of the component module according to the modified example 8 of the first embodiment.
  • Modification 8 of Example 1 is an example in which a plated metal is used as the heat transfer member 18.
  • a resist 60 having an opening 62 is formed on the surface of the coil component 10.
  • the core material 14 is exposed from the opening 62.
  • the opening 62 is provided in a region where the heat transfer member 18 is formed.
  • a heat transfer member 18 is formed in the opening 62 by a plating method.
  • the maximum thickness of the plating layer that can be formed by the plating method is about 100 ⁇ m, and is several tens of ⁇ m.
  • a seed layer may be formed before forming the plating layer, and a plating layer may be formed on the seed layer.
  • the resist 60 is removed.
  • the heat transfer member 18 in contact with the core material 14 is formed.
  • the heat transfer member 18 can also be formed by forming a metal layer on the entire surface of the coil component 10 by a plating method and removing the metal layer in a desired region by an etching method.
  • the thickness of the metal layer is as thin as about 100 ⁇ m or less, if the metal layer is formed on the entire surface of the coil component 10, the metal layer may crack or break. Therefore, as shown in FIG. 15A, it is preferable to form a resist 60 having an opening 62 on the surface of the coil component 10 and to form a metal layer to be a heat transfer member 18 in the opening 62.
  • the joint portion 13c of the terminals 13a and 13b and the joint portion 18c of the heat transfer member 18 are arranged on the metal layer 42 via the joint member 44.
  • the joint portions 13c and 18c are joined onto the metal layer 42 via the joining member 44.
  • the bonding layer 20 is formed on the heat radiating portion 18e of the heat transfer member 18.
  • the heat radiation fins 22 are bonded onto the bonding layer 20.
  • the component module of the modified example 8 of the first embodiment is manufactured.
  • the component modules of the first embodiment and the modified examples 1 to 6 thereof can also be manufactured by the same method as the modified example 8 of the first embodiment.
  • a plating layer is formed on the surface of the core material 14 as the heat transfer member 18. Thereby, the heat transfer member 18 can be easily formed.
  • [Modification 9 of Example 1] 16 (a) to 16 (d) are schematic front views of the vicinity of the coil component showing the component module manufacturing method according to the modification 9 of the first embodiment.
  • a modification 9 of the first embodiment is an example in which the coil component 10 and the heat transfer member 18 are resin-sealed.
  • the sealing resin 24 is an insulating and non-magnetic resin such as an epoxy resin, and the resin may contain an inorganic filler.
  • a transfer molding method, an injection method or a compression method is used for the formation of the sealing resin 24, for example, a transfer molding method, an injection method or a compression method is used.
  • the upper surface of the heat transfer member 18 is exposed by polishing the upper surface of the sealing resin 24. As a result, the upper surface of the sealing resin 24 and the upper surface of the heat transfer member 18 become substantially flat.
  • the sealing resin 24 is provided with an opening 25 that exposes the joint portion 18c.
  • the joint portion 13c of the terminals 13a and 13b and the joint portion 18c of the heat transfer member 18 are arranged on the metal layer 42 via the joint member 44.
  • the joint portions 13c and 18c are joined onto the metal layer 42 via the joining member 44.
  • the joining member 44 is, for example, solder
  • excess solder among the melted solder melts and spreads in the opening 25.
  • the bonding layer 20 is formed on the heat radiating portion 18e of the heat transfer member 18.
  • the heat radiation fins 22 are bonded onto the bonding layer 20. Since the upper surface of the sealing resin 24 and the upper surface of the heat radiating portion 18e are substantially flat, the stability of the heat radiating fins 22 is improved.
  • the component module of the modification 9 of the first embodiment is manufactured.
  • the component modules of the first embodiment and the modified examples 1 to 6 thereof can also be manufactured by the same method as the modified example 8 of the first embodiment.
  • FIG. 17 is a plan view of the component module according to the second embodiment.
  • FIG. 18 is a front schematic view of the vicinity of the coil component of the component module according to the second embodiment.
  • the coil component 10 is not provided with the heat transfer member 18 and the heat radiation fins 22, but the coil components 10 are provided with heat radiation fins 22 on the side ( ⁇ X side).
  • the heat radiating fins 22 are joined to the metal layer 42 via the joining layer 20.
  • the side surface of the heat radiating fin 22 and the side surface of the core material 14 are joined via the joining layer 21.
  • the bonding layers 20 and 21 are, for example, brazing material, sintered metal or heat transfer grease. Other configurations are the same as those in the first embodiment, and the description thereof will be omitted.
  • the heat radiation fins 22 are joined on the metal layer 42 and are joined to the portion of the core material 14 that covers the side of the winding 12. As a result, the heat generated in the winding 12 reaches the heat radiation fins 22 via the terminals 13b, the metal layer 42, and the bonding layer 20 like the path 55.
  • the heat radiation fin 22 is joined to the core material 14, and the distance between the heat radiation fin 22 and the coil component 10 is very small.
  • the metal layer 42 is, for example, copper, and has a higher thermal conductivity than the core material 14. Therefore, the heat of the winding 12 is efficiently released by the path 55.
  • the heat transfer member 18 may be connected to at least one of the terminals 13a and 13b and the metal layer 42 via a path other than the core material 14.
  • the heat generated in the winding 12 is conducted from the terminals 13a and 13b or the metal layer 42 to the heat radiating member via a path other than the core material 14. Therefore, it is possible to suppress heat generation of the coil component 10 and improve the power conversion efficiency.
  • the coil component 10 and the semiconductor component 30 are connected via a metal layer 42. There is.
  • the heat radiation fins 22 to the coil component 10

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

A component module provided with: a substrate 40; a metal layer 42 provided on the substrate; a coil component 10 which comprises a winding 12, a core material 14 covering at least a part of the winding, and terminals 13a, 13b electrically connecting the winding 12 to the metal layer 42, and which is mounted on the substrate 40; and a heat-dissipating member connected to the terminals 13a, 13b and/or the metal layer 42 via a route other than the core material 14.　

Description

部品モジュールParts module
　本発明は、部品モジュールに関し、例えばコイル部品を有する部品モジュールおよびその製造方法に関する。 The present invention relates to a component module, for example, a component module having a coil component and a method for manufacturing the component module.
　ＤＣ－ＤＣコンバータ等の電力変換回路にコイル部品が用いられる。電力変換回路を実装するモジュールでは、基板上にコイル部品が実装される。トランスを実装して基板上に放熱部材を設けることが知られている（例えば特許文献１）。コイル部品に接続する放熱部材を設けることが知られている（例えば特許文献２）。 Coil parts are used in power conversion circuits such as DC-DC converters. In the module that mounts the power conversion circuit, the coil components are mounted on the board. It is known that a transformer is mounted and a heat radiating member is provided on a substrate (for example, Patent Document 1). It is known to provide a heat radiating member connected to a coil component (for example, Patent Document 2).
特開平８－４５７４８号公報Japanese Unexamined Patent Publication No. 8-45748 特開２０１５－２２８５号公報JP 2015-2285
　電力変換回路ではコイル部品の巻き線に大電流が流れるため、コイル部品が発熱する。巻き線の温度が上昇すると、巻き線の直流抵抗が高くなり、電力変換回路の電力変換効率が低下してしまう。コイル部品では、巻き線はコア材に覆われている。コア材の熱伝導率は低いため、コイル部品に放熱部材を接合しても放熱性は高くない。コイル部品を基板に実装したときに放熱性を向上させる手法は知られていない。 In the power conversion circuit, a large current flows through the windings of the coil parts, causing the coil parts to generate heat. When the temperature of the winding rises, the DC resistance of the winding increases, and the power conversion efficiency of the power conversion circuit decreases. In coil parts, the winding is covered with a core material. Since the thermal conductivity of the core material is low, the heat dissipation is not high even if the heat dissipation member is joined to the coil component. There is no known method for improving heat dissipation when coil components are mounted on a substrate.
　本発明は、上記課題に鑑みなされたものであり、コイル部品の放熱性を向上させることを目的とする。 The present invention has been made in view of the above problems, and an object of the present invention is to improve the heat dissipation of coil parts.
　本発明は、基板と、前記基板上に設けられた金属層と、巻き線と前記巻き線の少なくとも一部を覆うコア材と、前記巻き線を前記金属層に電気的に接続する端子と、を備え、前記基板上に実装されたコイル部品と、前記端子および前記金属層の少なくとも一方に前記コア材以外の経路を介し接続された放熱部材と、を備える部品モジュールである。 The present invention comprises a substrate, a metal layer provided on the substrate, a winding and a core material covering at least a part of the winding, and a terminal for electrically connecting the winding to the metal layer. It is a component module including a coil component mounted on the substrate and a heat radiating member connected to at least one of the terminal and the metal layer via a path other than the core material.
　上記構成において、前記端子および前記金属層の少なくとも一方に接合された接合部と、前記コア材のうち前記巻き線上を覆う部分上に接合された放熱部と、前記接合部と前記放熱部とを接続する接続部と、を有し、前記コア材の熱伝導率より高い熱伝導率を有する伝熱部材を備え、前記放熱部材は前記伝熱部材の前記放熱部上に接合されている構成とすることができる。 In the above configuration, a joint portion bonded to at least one of the terminal and the metal layer, a heat radiating portion joined on a portion of the core material covering the winding, and the joint portion and the heat radiating portion are provided. A heat transfer member having a connecting portion to be connected and having a thermal conductivity higher than that of the core material is provided, and the heat transfer member is joined on the heat radiation portion of the heat transfer member. can do.
　上記構成において、前記伝熱部材は金属部材である構成とすることができる。 In the above configuration, the heat transfer member may be a metal member.
　上記構成において、前記伝熱部材の前記接合部は前記端子に接合されている構成とすることができる。 In the above configuration, the joint portion of the heat transfer member may be joined to the terminal.
　上記構成において、前記コア材の表面に凹部が設けられ、前記伝熱部材の前記接続部および前記放熱部の少なくとも一部は前記凹部には埋め込まれている構成とすることができる。 In the above configuration, a recess may be provided on the surface of the core material, and at least a part of the connection portion and the heat dissipation portion of the heat transfer member may be embedded in the recess.
　上記構成において、前記端子は、前記巻き線の両端にそれぞれ接続された第１端子および第２端子を含み、前記金属層は、前記第１端子および前記第２端子にそれぞれ接続された第１金属層および第２金属層を含み、前記伝熱部材は、前記第１端子および前記第１金属層の少なくとも一方と接合された第１伝熱部材と、前記第２端子および前記第２金属層の少なくとも一方と接合された第２伝熱部材と、を含み、前記放熱部材は、前記第１伝熱部材の放熱部および前記第２伝熱部材の放熱部上に接合されている構成とすることができる。 In the above configuration, the terminal includes a first terminal and a second terminal connected to both ends of the winding, respectively, and the metal layer is a first metal connected to the first terminal and the second terminal, respectively. The heat transfer member includes a layer and a second metal layer, and the heat transfer member includes a first heat transfer member joined to at least one of the first terminal and the first metal layer, and the second terminal and the second metal layer. The heat transfer member includes at least one of the second heat transfer members, and the heat transfer member is joined on the heat radiation portion of the first heat transfer member and the heat radiation portion of the second heat transfer member. Can be done.
　上記構成において、前記接続部の少なくとも一部は前記コア材の表面に設けられている構成とすることができる。 In the above configuration, at least a part of the connecting portion can be provided on the surface of the core material.
　上記構成において、前記接続部の少なくとも一部は空気中を延伸する構成とすることができる。 In the above configuration, at least a part of the connection portion can be configured to extend in the air.
　上記構成において、前記伝熱部材は、一体の金属板である構成とすることができる。 In the above configuration, the heat transfer member can be configured to be an integral metal plate.
　上記構成において、前記伝熱部材は、前記コア材表面に形成されためっき層である構成とすることができる。 In the above configuration, the heat transfer member may be a plating layer formed on the surface of the core material.
　上記構成において、前記放熱部材は前記金属層上に接合され、かつ前記コア材のうち前記巻き線の側方を覆う部分に接合されている構成とすることができる。 In the above configuration, the heat radiating member may be joined on the metal layer and may be joined to a portion of the core material that covers the side of the winding.
　上記構成において、前記コイル部品に前記金属層を介し接続され、前記基板上に実装されたスイッチング素子を備える構成とすることができる。 In the above configuration, a switching element that is connected to the coil component via the metal layer and mounted on the substrate can be provided.
　本発明によれば、コイル部品の放熱性を向上させることができる。 According to the present invention, the heat dissipation of the coil parts can be improved.
図１（ａ）から図１（ｃ）は、実施例１に用いられるコイル部品のそれぞれ上面図、および側面図である。1 (a) to 1 (c) are a top view and a side view of the coil components used in the first embodiment, respectively. 図２（ａ）および図２（ｂ）は、実施例１に用いるコイル部品の斜視図である。2 (a) and 2 (b) are perspective views of the coil component used in the first embodiment. 図３は、実施例１が用いられる電力変換回路の回路図である。FIG. 3 is a circuit diagram of a power conversion circuit in which the first embodiment is used. 図４（ａ）および図４（ｂ）は、実施例１に係る部品モジュールの平面図である。4 (a) and 4 (b) are plan views of the component module according to the first embodiment. 図５は、実施例１に係る部品モジュールの正面模式図である。FIG. 5 is a front schematic view of the component module according to the first embodiment. 図６（ａ）から図６（ｃ）は、実施例１に係る部品モジュールにおけるコイル部品付近のそれぞれ上面模式図、正面模式図および右側面模式図である。6 (a) to 6 (c) are a schematic top view, a schematic front view, and a schematic right side view of the vicinity of the coil component in the component module according to the first embodiment, respectively. 図７は、比較例１に係る部品モジュールの正面模式図である。FIG. 7 is a front schematic view of the component module according to Comparative Example 1. 図８（ａ）から図８（ｃ）は、実施例１の変形例１に係る部品モジュールにおけるコイル部品付近のそれぞれ上面模式図、正面模式図および右側面模式図である。8 (a) to 8 (c) are a schematic top view, a schematic front view, and a schematic right side view of the vicinity of the coil component in the component module according to the first modification of the first embodiment. 図９（ａ）から図９（ｃ）は、実施例１の変形例２に係る部品モジュールにおけるコイル部品付近のそれぞれ上面模式図、正面模式図および右側面模式図である。9 (a) to 9 (c) are a schematic top view, a schematic front view, and a schematic right side view of the vicinity of the coil component in the component module according to the second modification of the first embodiment, respectively. 図１０（ａ）から図１０（ｃ）は、実施例１の変形例３に係る部品モジュールにおけるコイル部品付近のそれぞれ上面模式図、正面模式図および右側面模式図である。10 (a) to 10 (c) are a schematic top view, a schematic front view, and a schematic right side view of the vicinity of the coil component in the component module according to the third modification of the first embodiment, respectively. 図１１（ａ）から図１１（ｃ）は、実施例１の変形例４に係る部品モジュールにおけるコイル部品付近のそれぞれ上面模式図、正面模式図および右側面模式図である。11 (a) to 11 (c) are a schematic top view, a schematic front view, and a schematic right side view of the vicinity of the coil component in the component module according to the modified example 4 of the first embodiment, respectively. 図１２（ａ）から図１２（ｃ）は、実施例１の変形例５に係る部品モジュールにおけるコイル部品付近のそれぞれ上面模式図、正面模式図および右側面模式図である。12 (a) to 12 (c) are a schematic top view, a schematic front view, and a schematic right side view of the vicinity of the coil component in the component module according to the modified example 5 of the first embodiment, respectively. 図１３（ａ）から図１３（ｃ）は、実施例１の変形例６に係る部品モジュールにおけるコイル部品付近のそれぞれ上面模式図、正面模式図および右側面模式図である。13 (a) to 13 (c) are a schematic top view, a schematic front view, and a schematic right side view of the vicinity of the coil component in the component module according to the modified example 6 of the first embodiment, respectively. 図１４（ａ）から図１４（ｆ）は、実施例１の変形例７に係る部品モジュールの製造方法を示すコイル部品付近の正面模式図である。14 (a) to 14 (f) are schematic front views of the vicinity of the coil component showing the manufacturing method of the component module according to the modified example 7 of the first embodiment. 図１５（ａ）から図１５（ｅ）は、実施例１の変形例８に係る部品モジュールの製造方法を示すコイル部品付近の正面模式図である。15 (a) to 15 (e) are schematic front views of the vicinity of the coil component showing the manufacturing method of the component module according to the modified example 8 of the first embodiment. 図１６（ａ）から図１６（ｄ）は、実施例１の変形例９に係る部品モジュールの製造方法を示すコイル部品付近の正面模式図である。16 (a) to 16 (d) are schematic front views of the vicinity of the coil component showing the manufacturing method of the component module according to the modification 9 of the first embodiment. 図１７は、実施例２に係る部品モジュールの平面図である。FIG. 17 is a plan view of the component module according to the second embodiment. 図１８は、実施例２に係る部品モジュールのコイル部品付近の正面模式図である。FIG. 18 is a front schematic view of the vicinity of the coil component of the component module according to the second embodiment.
　以下、図面を参照し本発明の実施例について説明する。 Hereinafter, examples of the present invention will be described with reference to the drawings.
　図１（ａ）から図１（ｃ）は、実施例１に用いられるコイル部品のそれぞれ上面図、および側面図である。図２（ａ）および図２（ｂ）は、実施例１に用いるコイル部品の斜視図である。コイル部品１０を実装する基板の平面方向をＸ方向およびＹ方向とする。正面から背面に至る方向がＹ方向である。左側面から右側面に至る方向がＸ方向である。 1 (a) to 1 (c) are a top view and a side view of the coil components used in the first embodiment, respectively. 2 (a) and 2 (b) are perspective views of the coil component used in the first embodiment. The plane directions of the substrate on which the coil component 10 is mounted are the X direction and the Y direction. The direction from the front to the back is the Y direction. The direction from the left side surface to the right side surface is the X direction.
　図１（ａ）から図２（ｂ）に示すように、コイル部品１０は、巻き線１２、コア材１４および封止樹脂１６を主に備えている。巻き線１２の両端部はそれぞれ端子１３ａおよび１３ｂに接続されている。端子１３ａおよび１３ｂは、巻き線１２から正面方向（－Ｙ方向）に導出され、先端に行くに下方向（－Ｚ方向）に屈曲しさらに正面方向に屈曲している。正面方向に屈曲した部分は基板上の金属層に接合される接合部１３ｃである。端子１３ａおよび１３ｂのうち巻き線１２と接合部１３ｃとを接続する部分は接続部１３ｄである。巻き線１２および端子１３ａおよび１３ｂは例えば銅、鉄またはアルミニウムを主材料とする金属部材である。 As shown in FIGS. 1A to 2B, the coil component 10 mainly includes a winding 12, a core material 14, and a sealing resin 16. Both ends of the winding 12 are connected to terminals 13a and 13b, respectively. The terminals 13a and 13b are led out from the winding 12 in the front direction (−Y direction), are bent downward (−Z direction) toward the tip, and are further bent in the front direction. The portion bent in the front direction is the joint portion 13c joined to the metal layer on the substrate. Of the terminals 13a and 13b, the portion that connects the winding 12 and the joint portion 13c is the connection portion 13d. The winding 12 and the terminals 13a and 13b are metal members whose main material is, for example, copper, iron or aluminum.
　コア材１４は巻き線１２の少なくとも一部を覆っている。コア材１４は中心部１４ａと外部１４ｂを備えている。中心部１４ａは略円柱状である。巻き線１２は、中心部１４ａと外部１４ｂとの間の空間において、中心部１４ａに巻かれている。外部１４ｂは、巻き線１２の上部、下部、右側部および左側部を覆っている。巻き線１２により生成された磁力線は中心部１４ａおよび外部１４ｂ内を通過する。コア材１４は、高透磁率磁性材料であり、例えば酸化鉄を主材料とし、マンガン、マグネシウム、ニッケルおよび亜鉛等の金属化合物が混合され、高温にて焼結された材料からなる。 The core material 14 covers at least a part of the winding 12. The core material 14 includes a central portion 14a and an outer portion 14b. The central portion 14a is substantially columnar. The winding 12 is wound around the central portion 14a in the space between the central portion 14a and the outer portion 14b. The outer 14b covers the upper part, the lower part, the right side part and the left side part of the winding 12. The magnetic field lines generated by the winding 12 pass through the central portion 14a and the outer 14b. The core material 14 is a high magnetic permeability magnetic material, and is made of, for example, a material in which iron oxide is the main material, metal compounds such as manganese, magnesium, nickel and zinc are mixed and sintered at a high temperature.
　封止樹脂１６は、中心部１４ａと外部１４ｂとの間の空間において、巻き線１２を封止する。封止樹脂１６は例えばエポキシ樹脂等の有機絶縁体である。封止樹脂１６は、非磁性材料でもよいし、高透磁率磁性材料でもよい。コア材１４は端子１３ａを除く巻き線１２の全てを覆ってもよい。封止樹脂１６は設けられてなくてもよい。 The sealing resin 16 seals the winding 12 in the space between the central portion 14a and the outer 14b. The sealing resin 16 is an organic insulator such as an epoxy resin. The sealing resin 16 may be a non-magnetic material or a high magnetic permeability magnetic material. The core material 14 may cover all of the windings 12 except the terminal 13a. The sealing resin 16 may not be provided.
　実施例１に係る部品モジュールが用いられる電力変換回路として、降圧型ＤＣ（Direct Current）－ＤＣコンバータを説明する。図３は、実施例１が用いられる電力変換回路の回路図である。図３に示すように、入力端子Ｔｉｎとグランド端子Ｔｇｎｄとの間に入力コンデンサＣｉｎが接続されている。入力端子Ｔｉｎとグランド端子Ｔｇｎｄとの間に入力コンデンサＣｉｎが接続され、このコンデンサＣｉｎと並列に、トランジスタＴｒ１およびＴｒ２が直列に接続されている。トランジスタＴｒ１のソースＳ、ゲートＧおよびドレインＤは、それぞれノードＳＷ、駆動回路３１および入力端子Ｔｉｎに接続され、トランジスタＴｒ２のソースＳ、ゲートＧおよびドレインＤは、それぞれグランド端子Ｔｇｎｄ、駆動回路３１およびノードＳＷに接続されている。ノードＳＷと出力端子Ｔｏｕｔの間にコイルＬが接続されている。出力端子Ｔｏｕｔとグランド端子Ｔｇｎｄとの間に出力コンデンサＣｏｕｔが接続されている。出力端子Ｔｏｕｔとグランド端子Ｔｇｎｄとの間には負荷Ｚが接続され、出力コンデンサＣｏｕｔと負荷Ｚは並列に接続されている。 A step-down DC (Direct Current) -DC converter will be described as a power conversion circuit in which the component module according to the first embodiment is used. FIG. 3 is a circuit diagram of a power conversion circuit in which the first embodiment is used. As shown in FIG. 3, an input capacitor Cin is connected between the input terminal Tin and the ground terminal Tgnd. An input capacitor Cin is connected between the input terminal Tin and the ground terminal Tgnd, and transistors Tr1 and Tr2 are connected in series in parallel with this capacitor Cin. The source S, gate G and drain D of the transistor Tr1 are connected to the node SW, the drive circuit 31 and the input terminal Tin, respectively, and the source S, the gate G and the drain D of the transistor Tr2 are connected to the ground terminal Tgnd, the drive circuit 31 and the input terminal Tin, respectively. It is connected to the node SW. A coil L is connected between the node SW and the output terminal Tout. An output capacitor Cout is connected between the output terminal Tout and the ground terminal Tgnd. A load Z is connected between the output terminal Tout and the ground terminal Tgnd, and the output capacitor Cout and the load Z are connected in parallel.
　駆動回路３１はトランジスタＴｒ１およびＴｒ２のオンおよびオフを制御する。入力端子Ｔｉｎとグランド端子Ｔｇｎｄとの間に直流の入力電圧Ｖｉｎが印加される。出力電圧Ｖｏｕｔが所望の電圧より低くなると、駆動回路３１はトランジスタＴｒ１およびＴｒ２をそれぞれオンおよびオフとする。入力端子Ｔｉｎから出力端子Ｔｏｕｔに電流が流れ、出力コンデンサＣｏｕｔに電荷が蓄積される。また、コイルＬに磁界エネルギーが蓄積される。出力端子Ｔｏｕｔとグランド端子Ｔｇｎｄとの間に直流の出力電圧Ｖｏｕｔが出力される。 The drive circuit 31 controls the on and off of the transistors Tr1 and Tr2. A DC input voltage Vin is applied between the input terminal Tin and the ground terminal Tgnd. When the output voltage Vout becomes lower than the desired voltage, the drive circuit 31 turns the transistors Tr1 and Tr2 on and off, respectively. A current flows from the input terminal Tin to the output terminal Tout, and an electric charge is accumulated in the output capacitor Cout. Further, magnetic field energy is stored in the coil L. A DC output voltage Vout is output between the output terminal Tout and the ground terminal Tgnd.
　出力電圧Ｖｏｕｔが目標の電圧より高くなると、駆動回路３１はトランジスタＴｒ１およびＴｒ２をそれぞれオフおよびオンとする。コイルＬの磁界エネルギーによりトランジスタＴｒ２に転流電流が流れ、出力電圧Ｖｏｕｔが維持される。出力電圧Ｖｏｕｔが所望の電圧より低くなると、駆動回路３１はトランジスタＴｒ１およびＴｒ２をそれぞれオンおよびオフとする。これにより、出力端子Ｔｏｕｔの電圧はほぼ一定の出力電圧Ｖｏｕｔとなる。 When the output voltage Vout becomes higher than the target voltage, the drive circuit 31 turns off and on the transistors Tr1 and Tr2, respectively. A commutation current flows through the transistor Tr2 due to the magnetic field energy of the coil L, and the output voltage Vout is maintained. When the output voltage Vout becomes lower than the desired voltage, the drive circuit 31 turns the transistors Tr1 and Tr2 on and off, respectively. As a result, the voltage of the output terminal Tout becomes a substantially constant output voltage Vout.
　実施例１の部品モジュールが用いられる電力変換回路としては、降圧型ＤＣ－ＤＣコンバータ以外にも昇圧型ＤＣ－ＤＣコンバータ、ＡＣ（Alternating Current）－ＤＣコンバータまたはＤＣ－ＡＣコンバータでもよい。コイル部品を用いる観点から、ＤＣ－ＤＣコンバータが好ましい。 The power conversion circuit in which the component module of the first embodiment is used may be a step-up DC-DC converter, an AC (Alternating Current) -DC converter, or a DC-AC converter in addition to the step-down DC-DC converter. A DC-DC converter is preferable from the viewpoint of using coil components.
　図４（ａ）および図４（ｂ）は、実施例１に係る部品モジュールの平面図である。図４（ａ）は、放熱フィン２２および３８を設けていない平面図であり、図４（ｂ）は、放熱フィン２２および３８を設けた平面図である。 4 (a) and 4 (b) are plan views of the component module according to the first embodiment. FIG. 4A is a plan view in which the heat radiation fins 22 and 38 are not provided, and FIG. 4B is a plan view in which the heat radiation fins 22 and 38 are provided.
　図４（ａ）に示すように、基板４０上に金属層４２が設けられている。基板４０上に金属層４２と接続されたコイル部品１０、半導体部品３０、電子部品３０ａおよび３０ｂが実装されている。コイル部品１０は、図１（ａ）から図２（ｂ）に示したコイル部品１０であり、図３のコイルＬに相当する。 As shown in FIG. 4A, a metal layer 42 is provided on the substrate 40. A coil component 10, a semiconductor component 30, and electronic components 30a and 30b connected to the metal layer 42 are mounted on the substrate 40. The coil component 10 is the coil component 10 shown in FIGS. 1A to 2B, and corresponds to the coil L in FIG.
　半導体部品３０は、例えばＩＧＢＴ（Insulated Gate Bipolar Transistor）、バイポーラトランジスタまたはＦＥＴ（Field Effect Transistor）等のパワートランジスタである。トランジスタには、Ｓｉ、ＧａＮまたはＳｉＣ等の半導体材料が用いられる。半導体部品３０は、例えばベアチップまたはベアチップが封止実装されたパッケージである。ベアチップが実装されたパッケージは、ＷＬＰ（Wafer Level Package）またはＳＩＰ（Single Inline Package）等のパッケージである。実施例１では、半導体部品３０は横型トランジスタであるＧａＮＦＥＴのベアチップである。半導体部品３０は図３のトランジスタＴｒ１およびＴｒ２を含む。 The semiconductor component 30 is, for example, a power transistor such as an IGBT (Insulated Gate Bipolar Transistor), a bipolar transistor, or a FET (Field Effect Transistor). A semiconductor material such as Si, GaN or SiC is used for the transistor. The semiconductor component 30 is, for example, a bare chip or a package in which a bare chip is sealed and mounted. The package on which the bare chip is mounted is a package such as WLP (Wafer Level Package) or SIP (Single Inline Package). In the first embodiment, the semiconductor component 30 is a bare chip of a GaN FET which is a horizontal transistor. The semiconductor component 30 includes the transistors Tr1 and Tr2 of FIG.
　電子部品３０ａは、例えばシリコン基板に形成された集積回路を有し、例えばベアチップまたはベアチップが封止実装されたパッケージである。電子部品３０ａは図３の駆動回路３１を含む。電子部品３０ｂは、例えばチップコンデンサ、チップインダクタまたはチップ抵抗等のディスクリート受動部品である。電子部品３０ｂは図３の入力コンデンサＣｉｎおよび出力コンデンサＣｏｕｔを含む。 The electronic component 30a has, for example, an integrated circuit formed on a silicon substrate, and is, for example, a bare chip or a package in which a bare chip is sealed and mounted. The electronic component 30a includes the drive circuit 31 of FIG. The electronic component 30b is a discrete passive component such as a chip capacitor, a chip inductor or a chip resistor. The electronic component 30b includes the input capacitor Cin and the output capacitor Cout of FIG.
　金属層４２は入力端子Ｔｉｎ、出力端子Ｔｏｕｔ、グランド端子ＴｇｎｄおよびノードＳＷに対応する端子Ｔｓｗである。入力端子Ｔｉｎとグランド端子Ｔｇｎｄとの間に入力コンデンサＣｉｎである電子部品３０ｂが接続されている。入力端子Ｔｉｎと端子Ｔｓｗとの間にトランジスタＴｒ１である半導体部品３０が接続されている。端子Ｔｓｗと出力端子Ｔｏｕｔとの間にコイル部品１０が接続されている。出力端子Ｔｏｕｔとグランド端子Ｔｇｎｄとの間に出力コンデンサＣｏｕｔである電子部品３０ｂが接続されている。グランド端子Ｔｇｎｄに電子部品３０ａが接続されている。電子部品３０ａと半導体部品３０内のトランジスタＴｒ１およびＴｒ２のゲートとを接続する配線は基板４０内に設けられている。 The metal layer 42 is a terminal Tsw corresponding to an input terminal Tin, an output terminal Tout, a ground terminal Tgnd, and a node SW. An electronic component 30b, which is an input capacitor Cin, is connected between the input terminal Tin and the ground terminal Tgnd. A semiconductor component 30 which is a transistor Tr1 is connected between the input terminal Tin and the terminal Tsw. A coil component 10 is connected between the terminal Tsw and the output terminal Tout. An electronic component 30b, which is an output capacitor Cout, is connected between the output terminal Tout and the ground terminal Tgnd. The electronic component 30a is connected to the ground terminal Tgnd. Wiring for connecting the electronic component 30a and the gates of the transistors Tr1 and Tr2 in the semiconductor component 30 is provided in the substrate 40.
　図４（ｂ）に示すように、コイル部品１０上に放熱フィン２２が設けられ、半導体部品３０の上に放熱フィン３８が設けられている。放熱フィン２２は複数のフィン２２ａを有し、放熱フィン３８は複数のフィン３８ａを有する。 As shown in FIG. 4B, the heat radiation fins 22 are provided on the coil component 10, and the heat radiation fins 38 are provided on the semiconductor component 30. The heat radiation fin 22 has a plurality of fins 22a, and the heat radiation fin 38 has a plurality of fins 38a.
　図５は、実施例１に係る部品モジュールの正面模式図である。図５は、コイル部品１０内の巻き線１２を簡略化して図示している。放熱フィン２２および３８のフィン２２ａおよび３８ａの延伸方向を図４（ｂ）における放熱フィン２２および３８のフィン２２ａおよび３８ａの延伸方向と異なって図示している。断面図ではないが各部材を理解しやすいように各部材にハッチングを付している。以下の部品モジュールおよびコイル部品の模式図も同様である。 FIG. 5 is a front schematic view of the component module according to the first embodiment. FIG. 5 shows the winding 12 in the coil component 10 in a simplified manner. The stretching directions of the fins 22a and 38a of the heat radiation fins 22 and 38 are shown differently from the stretching directions of the fins 22a and 38a of the heat radiation fins 22 and 38 in FIG. 4 (b). Although it is not a cross-sectional view, each member is hatched so that each member can be easily understood. The same applies to the schematic views of the following component modules and coil components.
　図５に示すように、基板４０上に金属層４２が設けられている。基板４０は、例えばガラスエポキシ基板等の樹脂基板、またはセラミックス基板である。金属層４２は例えば銅を主材料とする。金属層４２上にコイル部品１０および半導体部品３０が実装されている。金属層４２からコイル部品１０上に伝熱部材１８が設けられている。伝熱部材１８は、接合部１８ｃ、接続部１８ｄおよび放熱部１８ｅを備えている。接合部１８ｃは金属層４２上に接合されている。放熱部１８ｅはコイル部品１０上に設けられている。接続部１８ｄは、接合部１８ｃと放熱部１８ｅとを接続する。 As shown in FIG. 5, a metal layer 42 is provided on the substrate 40. The substrate 40 is, for example, a resin substrate such as a glass epoxy substrate or a ceramic substrate. The metal layer 42 uses, for example, copper as a main material. The coil component 10 and the semiconductor component 30 are mounted on the metal layer 42. A heat transfer member 18 is provided on the coil component 10 from the metal layer 42. The heat transfer member 18 includes a joint portion 18c, a connection portion 18d, and a heat dissipation portion 18e. The joint portion 18c is joined on the metal layer 42. The heat radiating portion 18e is provided on the coil component 10. The connecting portion 18d connects the joining portion 18c and the heat radiating portion 18e.
　端子１３ａおよび１３ｂの先端の接合部１３ｃと金属層４２とは接合部材４４により接合されている。これにより、端子１３ａおよび１３ｂは金属層４２と巻き線１２とを接続する。伝熱部材１８の接合部１８ｃと金属層４２が接合部材４４により接合されている。接合部１３ｃの側面と接合部１８ｃの側面は接合部材４４により接合されている。接合部材４４は例えば半田等のロウ材または導電性ペーストの焼結金属である。 The joint portion 13c at the tips of the terminals 13a and 13b and the metal layer 42 are joined by a joining member 44. As a result, the terminals 13a and 13b connect the metal layer 42 and the winding 12. The joint portion 18c of the heat transfer member 18 and the metal layer 42 are joined by the joint member 44. The side surface of the joint portion 13c and the side surface of the joint portion 18c are joined by a joining member 44. The joining member 44 is, for example, a brazing material such as solder or a sintered metal of a conductive paste.
　半導体部品３０の下面に電極３０ｃが設けられている。電極３０ｃは例えばソース電極、ドレイン電極およびゲート電極であり、例えば銅、金、アルミニウムまたは銀を主材料とする。金属層４２と電極３０ｃとは接合部材４６により接合されている。接合部材４６は例えば半田等のロウ材または導電性ペーストの焼結金属である。半導体部品３０上に放熱板３４が接合層３２を介し接合されている。放熱板３４は、例えばＤＢＣ（Direct Bonded Cupper）またはＤＢＡ（Direct Bonded Aluminum）であり、絶縁層３４ｂを金属層３４ａおよび３４ｃで挟んだ構造である。放熱板３４は、銅板等の金属板または窒化アルミニウム板もしくは酸化アルミニウム板等の絶縁板でもよい。放熱板３４上に放熱フィン３８が接合層３６を介し接合されている。接合層２０、３２および３６は、例えば半田等のロウ材、導電性ペーストの焼結金属または伝熱グリースである。 An electrode 30c is provided on the lower surface of the semiconductor component 30. The electrode 30c is, for example, a source electrode, a drain electrode and a gate electrode, and for example, copper, gold, aluminum or silver is used as a main material. The metal layer 42 and the electrode 30c are joined by a joining member 46. The joining member 46 is, for example, a brazing material such as solder or a sintered metal of a conductive paste. A heat sink 34 is bonded onto the semiconductor component 30 via a bonding layer 32. The heat radiating plate 34 is, for example, a DBC (Direct Bonded Cupper) or a DBA (Direct Bonded Aluminum), and has a structure in which the insulating layer 34b is sandwiched between the metal layers 34a and 34c. The heat radiating plate 34 may be a metal plate such as a copper plate or an insulating plate such as an aluminum nitride plate or an aluminum oxide plate. The heat radiating fins 38 are joined on the heat radiating plate 34 via the joining layer 36. The bonding layers 20, 32 and 36 are, for example, a brazing material such as solder, a sintered metal of a conductive paste, or a heat transfer grease.
　図６（ａ）から図６（ｃ）は、実施例１に係る部品モジュールにおけるコイル部品付近のそれぞれ上面模式図、正面模式図および右側面模式図である。 6 (a) to 6 (c) are a schematic top view, a schematic front view, and a schematic right side view of the vicinity of the coil component in the component module according to the first embodiment, respectively.
　図６（ａ）から図６（ｃ）に示すように、金属層４２は端子１３ａの先端の接合部１３ｃおよび伝熱部材１８の接合部１８ｃに接合部材４４により接合されている。コイル部品１０の下面にはコイル部品１０を基板４０に支持する支持部材が設けられているが図示および説明を省略する。 As shown in FIGS. 6 (a) to 6 (c), the metal layer 42 is joined to the joint portion 13c at the tip of the terminal 13a and the joint portion 18c of the heat transfer member 18 by the joint member 44. A support member for supporting the coil component 10 on the substrate 40 is provided on the lower surface of the coil component 10, but illustration and description thereof will be omitted.
　放熱部１８ｅはコイル部品１０のコア材１４上に設けられている。接続部１８ｄはコア材１４の正面の側面に沿って設けられている。放熱部１８ｅの正面と背面方向（Ｙ方向）の幅は接続部１８ｄのＸ方向の幅より大きい。伝熱部材１８は例えばリードフレームのような剛体の金属層により形成され、伝熱部材１８の放熱部１８ｅおよび接続部１８ｄは接合層によりコア材１４に接合されている。伝熱部材１８とコア材１４との接合方法については後述する。 The heat radiating portion 18e is provided on the core material 14 of the coil component 10. The connecting portion 18d is provided along the front side surface of the core material 14. The width of the heat radiating portion 18e in the front and back directions (Y direction) is larger than the width of the connecting portion 18d in the X direction. The heat transfer member 18 is formed of a rigid metal layer such as a lead frame, and the heat radiating portion 18e and the connecting portion 18d of the heat transfer member 18 are joined to the core material 14 by a joining layer. The method of joining the heat transfer member 18 and the core material 14 will be described later.
［比較例１］
　図７は、比較例１に係る部品モジュールの正面模式図である。図７に示すように、伝熱部材１８および放熱フィン２２が設けられていない。その他の構成は実施例１の図５と同じであり説明を省略する。 [Comparative Example 1]
FIG. 7 is a front schematic view of the component module according to Comparative Example 1. As shown in FIG. 7, the heat transfer member 18 and the heat radiation fin 22 are not provided. Other configurations are the same as those in FIG. 5 of the first embodiment, and the description thereof will be omitted.
　図７に示すように、半導体部品３０において発生した熱が伝導する経路は、経路５６および経路５８である。経路５６は半導体部品３０から接合部材４６を介し金属層４２に至る。経路５８は半導体部品３０から接合層３２、放熱板３４、接合層３６を介し放熱フィン３８に至る。金属層４２より放熱フィン３８の方が放熱性がよい。このため、半導体部品３０において発生した熱を効率よく放熱できる。 As shown in FIG. 7, the paths through which the heat generated in the semiconductor component 30 is conducted are the path 56 and the path 58. The path 56 reaches the metal layer 42 from the semiconductor component 30 via the joining member 46. The path 58 reaches the heat radiation fin 38 from the semiconductor component 30 via the joint layer 32, the heat sink 34, and the joint layer 36. The heat dissipation fin 38 has better heat dissipation than the metal layer 42. Therefore, the heat generated in the semiconductor component 30 can be efficiently dissipated.
　コイル部品１０では主に巻き線１２において熱が発生する。熱は巻き線１２から端子１３ａ、１３ｂおよび接合部材４４を介し金属層４２に至る。しかし、金属層４２の放熱性は高くないため、コイル部品１０において発生した熱を効率よく放熱することが難しい。半導体部品３０と同様に、コア材１４上に放熱フィンを接合することが考えられる。しかし、コア材１４の熱伝導率は数Ｗ／ｍ・Ｋであり、銅の熱伝導率である４００Ｗ／ｍ・Ｋの１／１００程度である。このため、コア材１４の上部に放熱フィンを接合しても半導体部品３０のように効率的な放熱はできない。巻き線１２の温度が上昇すると、巻き線１２の直流抵抗が高くなり、電力変換回路の電力変換効率が低下してしまう。 In the coil component 10, heat is mainly generated in the winding 12. Heat reaches the metal layer 42 from the winding 12 via the terminals 13a and 13b and the joining member 44. However, since the heat dissipation of the metal layer 42 is not high, it is difficult to efficiently dissipate the heat generated in the coil component 10. Similar to the semiconductor component 30, it is conceivable to join the heat radiation fins on the core material 14. However, the thermal conductivity of the core material 14 is several W / m · K, which is about 1/100 of the thermal conductivity of 400 W / m · K of copper. Therefore, even if the heat radiating fins are joined to the upper part of the core material 14, efficient heat radiating cannot be performed as in the semiconductor component 30. When the temperature of the winding 12 rises, the DC resistance of the winding 12 increases, and the power conversion efficiency of the power conversion circuit decreases.
　実施例１によれば、伝熱部材１８の接合部１８ｃは端子１３ａおよび金属層４２の少なくとも一方に接合され、放熱部１８ｅはコア材１４のうち巻き線１２上を覆う部分上に接合され、接続部１８ｄは接合部１８ｃと放熱部１８ｅとを接続する。伝熱部材１８は、コア材１４の熱伝導率より高い熱伝導率を有する。このように、放熱フィン２２は、端子１３ａおよび金属層４２の少なくとも一方にコア材１４以外の経路５２を介し接続されている。これにより、図５の経路５２のように、巻き線１２において発生した熱は端子１３ａおよび伝熱部材１８を介し放熱フィン２２に伝導する。よって、巻き線１２の温度上昇を抑制でき、巻き線１２の直流抵抗の上昇を抑制でき、電力変換回路の変換効率の低下を抑制できる。 According to the first embodiment, the joint portion 18c of the heat transfer member 18 is joined to at least one of the terminal 13a and the metal layer 42, and the heat radiating portion 18e is joined to the portion of the core material 14 that covers the winding 12. The connecting portion 18d connects the joining portion 18c and the heat radiating portion 18e. The heat transfer member 18 has a thermal conductivity higher than that of the core material 14. As described above, the heat radiation fin 22 is connected to at least one of the terminal 13a and the metal layer 42 via a path 52 other than the core material 14. As a result, as shown in the path 52 of FIG. 5, the heat generated in the winding 12 is conducted to the heat radiating fins 22 via the terminals 13a and the heat transfer member 18. Therefore, it is possible to suppress an increase in the temperature of the winding 12, an increase in the DC resistance of the winding 12, and a decrease in the conversion efficiency of the power conversion circuit.
　伝熱部材１８は、絶縁部材でもよいが、高熱伝導率を有する部材として金属部材であることが好ましい。金属部材の材料としては銅以外にも例えばアルミニウムまたは鉄を主材料としてもよい。伝熱部材１８の熱伝導率はコア材１４の熱伝導率の１０倍以上が好ましく、１００倍以上が好ましい。 The heat transfer member 18 may be an insulating member, but is preferably a metal member as a member having high thermal conductivity. As the material of the metal member, for example, aluminum or iron may be used as a main material in addition to copper. The thermal conductivity of the heat transfer member 18 is preferably 10 times or more, preferably 100 times or more, the thermal conductivity of the core material 14.
　伝熱部材１８の接合部１８ｃは端子１３ａに接合されていることが好ましい。端子１３ａに伝熱部材１８を接合させることにより、巻き線１２において発生した熱は端子１３ａから伝熱部材１８に伝導する。よって、伝熱部材１８を介した放熱性をより高めることができる。 It is preferable that the joint portion 18c of the heat transfer member 18 is joined to the terminal 13a. By joining the heat transfer member 18 to the terminal 13a, the heat generated in the winding 12 is conducted from the terminal 13a to the heat transfer member 18. Therefore, the heat dissipation property via the heat transfer member 18 can be further improved.
［実施例１の変形例１］
　図８（ａ）から図８（ｃ）は、実施例１の変形例１に係る部品モジュールにおけるコイル部品付近のそれぞれ上面模式図、正面模式図および右側面模式図である。 [Modification 1 of Example 1]
8 (a) to 8 (c) are a schematic top view, a schematic front view, and a schematic right side view of the vicinity of the coil component in the component module according to the first modification of the first embodiment.
　図８（ａ）から図８（ｃ）に示すように、実施例１の変形例１では、伝熱部材１８の接続部１８ｄは、コア材１４の右側面に沿って設けられている。その他の構成は、実施例１の図６（ａ）から図６（ｃ）と同じであり説明を省略する。 As shown in FIGS. 8 (a) to 8 (c), in the first modification of the first embodiment, the connecting portion 18d of the heat transfer member 18 is provided along the right side surface of the core material 14. Other configurations are the same as those in FIGS. 6 (a) to 6 (c) of the first embodiment, and the description thereof will be omitted.
［実施例１の変形例２］
　図９（ａ）から図９（ｃ）は、実施例１の変形例２に係る部品モジュールにおけるコイル部品付近のそれぞれ上面模式図、正面模式図および右側面模式図である。 [Modification 2 of Example 1]
9 (a) to 9 (c) are a schematic top view, a schematic front view, and a schematic right side view of the vicinity of the coil component in the component module according to the second modification of the first embodiment, respectively.
　図９（ａ）から図９（ｃ）に示すように、実施例１の変形例２では、伝熱部材１８の接合部１８ｃは端子１３ａの接合部１３ｃの上面に接合部材４５を介し接合されている。接合部材４５の材料は接合部材４４と同じである。接続部１８ｄは、接合部１８ｃの上部からコア材１４に接触せずに放熱部１８ｅに接続する。その他の構成は、実施例１の図６（ａ）から図６（ｃ）と同じであり説明を省略する。 As shown in FIGS. 9 (a) to 9 (c), in the second modification of the first embodiment, the joint portion 18c of the heat transfer member 18 is joined to the upper surface of the joint portion 13c of the terminal 13a via the joint member 45. ing. The material of the joining member 45 is the same as that of the joining member 44. The connecting portion 18d is connected to the heat radiating portion 18e from the upper part of the joint portion 18c without contacting the core material 14. Other configurations are the same as those in FIGS. 6 (a) to 6 (c) of the first embodiment, and the description thereof will be omitted.
　図６（ａ）から図６（ｃ）および図８（ａ）から図８（ｃ）の実施例１およびその変形例１のように、接続部１８ｄの少なくとも一部はコア材１４の表面に設けられ、コア材１４の表面に沿って設けられていてもよい。これにより、接続部１８ｄを安定に固定することができる。図６（ａ）から図６（ｃ）の実施例１は図８（ａ）から図８（ｃ）の実施例１の変形例１より、接続部１８ｄが短いため熱抵抗を低くでき放熱性を向上できる。 As shown in Example 1 of FIGS. 6 (a) to 6 (c) and 8 (a) to 8 (c) and a modification thereof 1, at least a part of the connecting portion 18d is on the surface of the core material 14. It may be provided and may be provided along the surface of the core material 14. As a result, the connecting portion 18d can be stably fixed. Example 1 of FIGS. 6 (a) to 6 (c) has a shorter connection portion 18d than the modified example 1 of embodiment 1 of FIGS. 8 (a) to 8 (c), so that the thermal resistance can be lowered and heat dissipation can be reduced. Can be improved.
　図９（ａ）から図９（ｃ）の実施例１の変形例２のように、接続部１８ｄの少なくとも一部は、コア材１４に沿わずに空気中を延伸し、接合部１８ｃと放熱部１８ｅとを接続してもよい。これにより、接続部１８ｄからコア材１４に熱が逃げることなく、巻き線１２の熱を放熱部１８ｅに伝えることができる。また、接続部１８ｄを短くできるため熱抵抗を低くでき、放熱性を向上できる。 As in the second modification of the first embodiment of FIGS. 9 (a) to 9 (c), at least a part of the connecting portion 18d extends in the air without following the core material 14, and dissipates heat from the joint portion 18c. It may be connected to the part 18e. As a result, the heat of the winding 12 can be transferred to the heat radiating portion 18e without escaping the heat from the connecting portion 18d to the core material 14. Further, since the connection portion 18d can be shortened, the thermal resistance can be lowered and the heat dissipation can be improved.
［実施例１の変形例３］
　図１０（ａ）から図１０（ｃ）は、実施例１の変形例３に係る部品モジュールにおけるコイル部品付近のそれぞれ上面模式図、正面模式図および右側面模式図である。 [Modification 3 of Example 1]
10 (a) to 10 (c) are a schematic top view, a schematic front view, and a schematic right side view of the vicinity of the coil component in the component module according to the third modification of the first embodiment, respectively.
　図１０（ａ）から図１０（ｃ）に示すように、実施例１の変形例３では、伝熱部材１８ａおよび１８ｂが設けられている。伝熱部材１８ａの接合部１８ｃは右側（＋Ｘ側）の端子１３ａおよび右側の金属層４２ａに接合されている。伝熱部材１８ｂの接合部１８ｃは左側（－Ｘ側）の端子１３ｂおよび左側の金属層４２ｂに接合されている。伝熱部材１８ａおよび１８ｂの接続部１８ｄはコア材１４の正面の側面に沿って設けられている。伝熱部材１８ａおよび１８ｂの放熱部１８ｅのＹ方向の幅は接続部１８ｄのＸ方向の幅とほぼ同じである。図１０（ｃ）の破線のように、伝熱部材１８ａおよび１８ｂの放熱部１８ｅの上面は各々接合層２０を介し放熱フィン２２に接合される。その他の構成は実施例１の図６（ａ）から図６（ｃ）と同じであり説明を省略する。 As shown in FIGS. 10 (a) to 10 (c), the heat transfer members 18a and 18b are provided in the modified example 3 of the first embodiment. The joint portion 18c of the heat transfer member 18a is joined to the terminal 13a on the right side (+ X side) and the metal layer 42a on the right side. The joint portion 18c of the heat transfer member 18b is joined to the terminal 13b on the left side (−X side) and the metal layer 42b on the left side. The connecting portions 18d of the heat transfer members 18a and 18b are provided along the front side surface of the core material 14. The width of the heat radiating portions 18e of the heat transfer members 18a and 18b in the Y direction is substantially the same as the width of the connecting portions 18d in the X direction. As shown by the broken line in FIG. 10C, the upper surfaces of the heat radiating portions 18e of the heat transfer members 18a and 18b are respectively joined to the heat radiating fins 22 via the bonding layer 20. Other configurations are the same as those in FIGS. 6 (a) to 6 (c) of the first embodiment, and the description thereof will be omitted.
［実施例１の変形例４］
　図１１（ａ）から図１１（ｃ）は、実施例１の変形例４に係る部品モジュールにおけるコイル部品付近のそれぞれ上面模式図、正面模式図および右側面模式図である。 [Modified Example 4 of Example 1]
11 (a) to 11 (c) are a schematic top view, a schematic front view, and a schematic right side view of the vicinity of the coil component in the component module according to the modified example 4 of the first embodiment, respectively.
　図１１（ａ）から図１１（ｃ）に示すように、実施例１の変形例４では、伝熱部材１８ａの接続部１８ｄは、コア材１４の右側面に沿って設けられ、伝熱部材１８ｂの接続部１８ｄは、コア材１４の左側面に沿って設けられている。その他の構成は、実施例１の変形例３の図１０（ａ）から図１０（ｃ）と同じであり説明を省略する。 As shown in FIGS. 11 (a) to 11 (c), in the modified example 4 of the first embodiment, the connecting portion 18d of the heat transfer member 18a is provided along the right side surface of the core material 14, and the heat transfer member is provided. The connecting portion 18d of 18b is provided along the left side surface of the core material 14. Other configurations are the same as those in FIGS. 10 (a) to 10 (c) of the third modification of the first embodiment, and the description thereof will be omitted.
［実施例１の変形例５］
　図１２（ａ）から図１２（ｃ）は、実施例１の変形例５に係る部品モジュールにおけるコイル部品付近のそれぞれ上面模式図、正面模式図および右側面模式図である。 [Modification 5 of Example 1]
12 (a) to 12 (c) are a schematic top view, a schematic front view, and a schematic right side view of the vicinity of the coil component in the component module according to the modified example 5 of the first embodiment, respectively.
　図１２（ａ）から図１２（ｃ）に示すように、実施例１の変形例５では、伝熱部材１８ａの接合部１８ｃは右側（＋Ｘ側）の端子１３ａの接合部１３ｃの上面に接合部材４５を介し接合されている。伝熱部材１８ｂの接合部１８ｃは左側（－Ｘ側）の端子１３ｂの接合部１３ｃの上面に接合部材４５を介し接合されている。接合部材４５の材料は接合部材４４と同じである。接続部１８ｄは、接合部１８ｃの上部からコア材１４に接触せずに放熱部１８ｅに接続する。その他の構成は、実施例１の変形例３の図１０（ａ）から図１０（ｃ）と同じであり説明を省略する。 As shown in FIGS. 12 (a) to 12 (c), in the modified example 5 of the first embodiment, the joint portion 18c of the heat transfer member 18a is joined to the upper surface of the joint portion 13c of the terminal 13a on the right side (+ X side). It is joined via a member 45. The joint portion 18c of the heat transfer member 18b is joined to the upper surface of the joint portion 13c of the terminal 13b on the left side (−X side) via the joint member 45. The material of the joining member 45 is the same as that of the joining member 44. The connecting portion 18d is connected to the heat radiating portion 18e from the upper part of the joint portion 18c without contacting the core material 14. Other configurations are the same as those in FIGS. 10 (a) to 10 (c) of the third modification of the first embodiment, and the description thereof will be omitted.
　図１０（ａ）から図１２（ｃ）の実施例１の変形例３から５のように、端子１３ａ（第１端子）および端子１３ｂ（第２端子）は、巻き線１２の両端にそれぞれ接続されている。金属層４２ａ（第１金属層）は、端子１３ａに接続され、金属層４２ｂ（第２金属層）は、端子１３ｂに接続されている。伝熱部材１８ａ（第１伝熱部材）は、端子１３ａおよび金属層４２ａの少なくとも一方と接合され、伝熱部材１８ｂ（第２伝熱部材）は、端子１３ｂおよび金属層４２ｂの少なくとも一方と接合されている。放熱フィン２２は、伝熱部材１８ａおよび１８ｂの放熱部１８ｅ上に接合されている。これにより、複数の端子１３ａおよび１３ｂから複数の伝熱部材１８ａおよび１８ｂを介し放熱フィン２２に放熱できる。よって、放熱性を向上できる。 Terminals 13a (first terminal) and terminals 13b (second terminal) are connected to both ends of the winding 12, respectively, as in modifications 3 to 5 of the first embodiment of FIGS. 10 (a) to 12 (c). Has been done. The metal layer 42a (first metal layer) is connected to the terminal 13a, and the metal layer 42b (second metal layer) is connected to the terminal 13b. The heat transfer member 18a (first heat transfer member) is joined to at least one of the terminal 13a and the metal layer 42a, and the heat transfer member 18b (second heat transfer member) is joined to at least one of the terminal 13b and the metal layer 42b. Has been done. The heat radiating fins 22 are joined on the heat radiating portions 18e of the heat transfer members 18a and 18b. As a result, heat can be dissipated from the plurality of terminals 13a and 13b to the heat radiation fins 22 via the plurality of heat transfer members 18a and 18b. Therefore, heat dissipation can be improved.
　伝熱部材１８ａおよび１８ｂが絶縁体材料の場合、伝熱部材１８ａおよび１８ｂは接触していてもよい。伝熱部材１８ａおよび１８ｂが金属材料の場合、端子１３ａと１３ｂとを電気的に短絡させないように、伝熱部材１８ａおよび１８ｂは電気的に分離されている。 When the heat transfer members 18a and 18b are made of an insulating material, the heat transfer members 18a and 18b may be in contact with each other. When the heat transfer members 18a and 18b are made of a metal material, the heat transfer members 18a and 18b are electrically separated so as not to electrically short-circuit the terminals 13a and 13b.
［実施例１の変形例６］
　図１３（ａ）から図１３（ｃ）は、実施例１の変形例６に係る部品モジュールにおけるコイル部品付近のそれぞれ上面模式図、正面模式図および右側面模式図である。 [Modified Example 6 of Example 1]
13 (a) to 13 (c) are a schematic top view, a schematic front view, and a schematic right side view of the vicinity of the coil component in the component module according to the modified example 6 of the first embodiment, respectively.
　図１３（ａ）から図１３（ｃ）に示すように、実施例１の変形例６では、コア材１４の正面の側面に凹部１５ａが設けられ、コア材１４の上面に凹部１５ｂが設けられている。伝熱部材１８の接続部１８ｄの一部は凹部１５ａにはめ込まれ、伝熱部材１８の放熱部１８ｅは凹部１５ｂにはめ込まれている。その他の構成は、実施例１の図６（ａ）から図６（ｃ）と同じであり説明を省略する。 As shown in FIGS. 13 (a) to 13 (c), in the modified example 6 of the first embodiment, the recess 15a is provided on the front side surface of the core material 14, and the recess 15b is provided on the upper surface of the core material 14. ing. A part of the connecting portion 18d of the heat transfer member 18 is fitted in the recess 15a, and the heat radiating portion 18e of the heat transfer member 18 is fitted in the recess 15b. Other configurations are the same as those in FIGS. 6 (a) to 6 (c) of the first embodiment, and the description thereof will be omitted.
　図１３（ａ）から図１３（ｃ）の実施例１の変形例６のように、コア材１４の表面に凹部１５ａおよび１５ｂが設けられ、伝熱部材１８の接続部１８ｄおよび放熱部１８ｅの少なくとも一部は凹部１５ａおよび１５ｂに埋め込まれている。これにより、コイル部品１０を小型化できるため、部品モジュールを小型化できる。伝熱部材１８の放熱部１８ｅを凹部１５ｂに埋め込み、放熱部１８ｅの上面とコア材１４の上面とを略平坦とする。これにより、コア材１４上に放熱フィン２２を安定に固定できる。実施例１の変形例１から５においても伝熱部材１８の少なくとも一部をコア材１４の表面に設けられた凹部に埋め込んでもよい。 As in the modified example 6 of the first embodiment of FIGS. 13 (a) to 13 (c), the recesses 15a and 15b are provided on the surface of the core material 14, and the connecting portion 18d and the heat radiating portion 18e of the heat transfer member 18 are provided. At least part of it is embedded in the recesses 15a and 15b. As a result, the coil component 10 can be miniaturized, so that the component module can be miniaturized. The heat radiating portion 18e of the heat transfer member 18 is embedded in the recess 15b, and the upper surface of the heat radiating portion 18e and the upper surface of the core material 14 are made substantially flat. As a result, the heat radiation fins 22 can be stably fixed on the core material 14. Also in the modified examples 1 to 5 of the first embodiment, at least a part of the heat transfer member 18 may be embedded in the recess provided on the surface of the core material 14.
［実施例１の変形例７］
　図１４（ａ）から図１４（ｆ）は、実施例１の変形例７に係る部品モジュールの製造方法を示すコイル部品付近の正面模式図である。実施例１の変形例７は、伝熱部材１８としてリードフレームのような剛体金属部材を用いる例である。 [Modification 7 of Example 1]
14 (a) to 14 (f) are schematic front views of the vicinity of the coil component showing the manufacturing method of the component module according to the modified example 7 of the first embodiment. Modification 7 of the first embodiment is an example in which a rigid metal member such as a lead frame is used as the heat transfer member 18.
　図１４（ａ）に示すように、コイル部品１０を準備する。コイル部品１０の端子１３ａおよび１３ｂのうち接合部１３ｃはコア材１４から露出している。コイル部品１０には伝熱部材は設けられていない。 As shown in FIG. 14A, the coil component 10 is prepared. Of the terminals 13a and 13b of the coil component 10, the joint portion 13c is exposed from the core material 14. The coil component 10 is not provided with a heat transfer member.
　図１４（ｂ）に示すように、コイル部品１０のコア材１４の表面のうち伝熱部材１８を接合する領域に接着剤１７を塗布する。接着剤１７は例えばエポキシ樹脂等の樹脂接着剤である。接着剤１７は他の接合部材でもよい。 As shown in FIG. 14B, the adhesive 17 is applied to the region of the surface of the core material 14 of the coil component 10 to which the heat transfer member 18 is joined. The adhesive 17 is a resin adhesive such as an epoxy resin. The adhesive 17 may be another joining member.
　図１４（ｃ）に示すように、コア材１４に伝熱部材１８を貼り付ける。伝熱部材１８は予めコア材１４の表面形状に合わせ折り曲げられた金属板である。熱処理することで、接着剤１７を硬化させ、伝熱部材１８をコア材１４に接着させる。 As shown in FIG. 14C, the heat transfer member 18 is attached to the core material 14. The heat transfer member 18 is a metal plate that has been bent in advance according to the surface shape of the core material 14. The heat treatment cures the adhesive 17 and adheres the heat transfer member 18 to the core material 14.
　図１４（ｄ）に示すように、端子１３ａおよび１３ｂの接合部１３ｃおよび伝熱部材１８の接合部１８ｃを接合部材４４を介し金属層４２上に配置する。熱処理することにより、接合部１３ｃおよび１８ｃは接合部材４４を介し金属層４２上に接合される。接合部材４４がロウ材または導電性ペーストの場合、１００℃から３００℃の温度にて熱処理する。接合部材４４は接合部１３ｃと１８ｃとの間にも入り込む。 As shown in FIG. 14D, the joint portion 13c of the terminals 13a and 13b and the joint portion 18c of the heat transfer member 18 are arranged on the metal layer 42 via the joint member 44. By heat treatment, the joint portions 13c and 18c are joined onto the metal layer 42 via the joining member 44. When the joining member 44 is a brazing material or a conductive paste, heat treatment is performed at a temperature of 100 ° C. to 300 ° C. The joining member 44 also enters between the joining portions 13c and 18c.
　図１４（ｅ）に示すように、伝熱部材１８の放熱部１８ｅ上に接合層２０を形成する。接合層２０は例えばＴＩＭ（Thermal Interface Material）であり、例えばシリコーン樹脂に高熱伝導粒子を含ませた伝熱グリースである。 As shown in FIG. 14 (e), the bonding layer 20 is formed on the heat radiating portion 18e of the heat transfer member 18. The bonding layer 20 is, for example, TIM (Thermal Interface Material), for example, a heat transfer grease in which high thermal conductive particles are contained in a silicone resin.
　図１４（ｆ）に示すように、接合層２０上に放熱フィン２２を接合させる。以上により、実施例１の変形例７の部品モジュールが製造される。実施例１およびその変形例１から６の部品モジュールについても実施例１の変形例７と同様の方法を用い製造できる。 As shown in FIG. 14 (f), the heat radiation fins 22 are bonded onto the bonding layer 20. As described above, the component module of the modified example 7 of the first embodiment is manufactured. The component modules of the first embodiment and the modified examples 1 to 6 thereof can also be manufactured by the same method as the modified example 7 of the first embodiment.
　伝熱部材１８を一体の金属板を折り曲げて形成し、図１４（ｃ）のように、コア材１４に接合する。これにより、伝熱部材１８を容易に形成することができる。 The heat transfer member 18 is formed by bending an integral metal plate and joined to the core material 14 as shown in FIG. 14 (c). Thereby, the heat transfer member 18 can be easily formed.
［実施例１の変形例８］
　図１５（ａ）から図１５（ｅ）は、実施例１の変形例８に係る部品モジュールの製造方法を示すコイル部品付近の正面模式図である。実施例１の変形例８は、伝熱部材１８としてめっき金属を用いる例である。 [Modification 8 of Example 1]
15 (a) to 15 (e) are schematic front views of the vicinity of the coil component showing the manufacturing method of the component module according to the modified example 8 of the first embodiment. Modification 8 of Example 1 is an example in which a plated metal is used as the heat transfer member 18.
　図１５（ａ）に示すように、コイル部品１０の表面に開口６２を有するレジスト６０を形成する。開口６２からコア材１４が露出する。開口６２は、伝熱部材１８が形成される領域に設けられている。 As shown in FIG. 15A, a resist 60 having an opening 62 is formed on the surface of the coil component 10. The core material 14 is exposed from the opening 62. The opening 62 is provided in a region where the heat transfer member 18 is formed.
　図１５（ｂ）に示すように、開口６２内にめっき法を用い伝熱部材１８を形成する。めっき法により形成できるめっき層の厚さは、最大で１００μｍ程度であり、数１０μｍである。めっき層を構成する前にシード層を形成し、シード層上にめっき層を形成してもよい。 As shown in FIG. 15B, a heat transfer member 18 is formed in the opening 62 by a plating method. The maximum thickness of the plating layer that can be formed by the plating method is about 100 μm, and is several tens of μm. A seed layer may be formed before forming the plating layer, and a plating layer may be formed on the seed layer.
　図１５（ｃ）に示すように、レジスト６０を除去する。これにより、コア材１４に接する伝熱部材１８が形成される。伝熱部材１８は、めっき法により金属層をコイル部品１０の全面に形成し、エッチング法を用い所望領域の金属層を除去することにより形成することもできる。しかしながら、金属層の厚さは１００μｍ程度以下と薄いため、金属層をコイル部品１０の全面に形成すると、金属層が割れたりかけたりする可能性がある。そこで、図１５（ａ）のように、コイル部品１０の表面に開口６２を有するレジスト６０を形成し、開口６２内に伝熱部材１８となる金属層を形成することが好ましい。 As shown in FIG. 15 (c), the resist 60 is removed. As a result, the heat transfer member 18 in contact with the core material 14 is formed. The heat transfer member 18 can also be formed by forming a metal layer on the entire surface of the coil component 10 by a plating method and removing the metal layer in a desired region by an etching method. However, since the thickness of the metal layer is as thin as about 100 μm or less, if the metal layer is formed on the entire surface of the coil component 10, the metal layer may crack or break. Therefore, as shown in FIG. 15A, it is preferable to form a resist 60 having an opening 62 on the surface of the coil component 10 and to form a metal layer to be a heat transfer member 18 in the opening 62.
　図１５（ｄ）に示すように、端子１３ａおよび１３ｂの接合部１３ｃおよび伝熱部材１８の接合部１８ｃを接合部材４４を介し金属層４２上に配置する。熱処理することにより、接合部１３ｃおよび１８ｃは接合部材４４を介し金属層４２上に接合される。 As shown in FIG. 15D, the joint portion 13c of the terminals 13a and 13b and the joint portion 18c of the heat transfer member 18 are arranged on the metal layer 42 via the joint member 44. By heat treatment, the joint portions 13c and 18c are joined onto the metal layer 42 via the joining member 44.
　図１５（ｅ）に示すように、伝熱部材１８の放熱部１８ｅ上に接合層２０を形成する。接合層２０上に放熱フィン２２を接合させる。以上により、実施例１の変形例８の部品モジュールが製造される。実施例１およびその変形例１から６の部品モジュールについても実施例１の変形例８と同様の方法を用い製造できる。 As shown in FIG. 15 (e), the bonding layer 20 is formed on the heat radiating portion 18e of the heat transfer member 18. The heat radiation fins 22 are bonded onto the bonding layer 20. As described above, the component module of the modified example 8 of the first embodiment is manufactured. The component modules of the first embodiment and the modified examples 1 to 6 thereof can also be manufactured by the same method as the modified example 8 of the first embodiment.
　図１５（ｂ）に示すように、伝熱部材１８として、コア材１４表面にめっき層を形成する。これにより、容易に伝熱部材１８を形成できる。 As shown in FIG. 15B, a plating layer is formed on the surface of the core material 14 as the heat transfer member 18. Thereby, the heat transfer member 18 can be easily formed.
［実施例１の変形例９］
　図１６（ａ）から図１６（ｄ）は、実施例１の変形例９に係る部品モジュール製造方法を示すコイル部品付近の正面模式図である。実施例１の変形例９は、コイル部品１０および伝熱部材１８を樹脂封止する例である。 [Modification 9 of Example 1]
16 (a) to 16 (d) are schematic front views of the vicinity of the coil component showing the component module manufacturing method according to the modification 9 of the first embodiment. A modification 9 of the first embodiment is an example in which the coil component 10 and the heat transfer member 18 are resin-sealed.
　図１６（ａ）に示すように、図１５（ｃ）の後に、コイル部品１０および伝熱部材１８を封止樹脂２４により封止する。封止樹脂２４は例えばエポキシ樹脂等の絶縁性かつ非磁性樹脂であり、樹脂内に無機フィラーが含まれていてもよい。封止樹脂２４の形成には、例えばトランスファモールド法、インジェクション法またはコンプレッション法を用いる。 As shown in FIG. 16A, after FIG. 15C, the coil component 10 and the heat transfer member 18 are sealed with the sealing resin 24. The sealing resin 24 is an insulating and non-magnetic resin such as an epoxy resin, and the resin may contain an inorganic filler. For the formation of the sealing resin 24, for example, a transfer molding method, an injection method or a compression method is used.
　図１６（ｂ）に示すように、封止樹脂２４の上面を研磨することにより、伝熱部材１８の上面を露出させる。これにより、封止樹脂２４の上面と伝熱部材１８の上面は略平坦となる。封止樹脂２４には接合部１８ｃを露出する開口２５を設ける。 As shown in FIG. 16B, the upper surface of the heat transfer member 18 is exposed by polishing the upper surface of the sealing resin 24. As a result, the upper surface of the sealing resin 24 and the upper surface of the heat transfer member 18 become substantially flat. The sealing resin 24 is provided with an opening 25 that exposes the joint portion 18c.
　図１６（ｄ）に示すように、端子１３ａおよび１３ｂの接合部１３ｃおよび伝熱部材１８の接合部１８ｃを接合部材４４を介し金属層４２上に配置する。熱処理することにより、接合部１３ｃおよび１８ｃは接合部材４４を介し金属層４２上に接合される。接合部材４４が例えば半田のとき、溶融した半田のうち余分な半田は開口２５に溶け広がる。 As shown in FIG. 16D, the joint portion 13c of the terminals 13a and 13b and the joint portion 18c of the heat transfer member 18 are arranged on the metal layer 42 via the joint member 44. By heat treatment, the joint portions 13c and 18c are joined onto the metal layer 42 via the joining member 44. When the joining member 44 is, for example, solder, excess solder among the melted solder melts and spreads in the opening 25.
　図１６（ｄ）に示すように、伝熱部材１８の放熱部１８ｅ上に接合層２０を形成する。接合層２０上に放熱フィン２２を接合させる。封止樹脂２４の上面と放熱部１８ｅの上面は略平坦なため、放熱フィン２２の安定性が向上する。以上により、実施例１の変形例９の部品モジュールが製造される。実施例１およびその変形例１から６の部品モジュールについても実施例１の変形例８と同様の方法を用い製造できる。 As shown in FIG. 16D, the bonding layer 20 is formed on the heat radiating portion 18e of the heat transfer member 18. The heat radiation fins 22 are bonded onto the bonding layer 20. Since the upper surface of the sealing resin 24 and the upper surface of the heat radiating portion 18e are substantially flat, the stability of the heat radiating fins 22 is improved. As described above, the component module of the modification 9 of the first embodiment is manufactured. The component modules of the first embodiment and the modified examples 1 to 6 thereof can also be manufactured by the same method as the modified example 8 of the first embodiment.
　図１７は、実施例２に係る部品モジュールの平面図である。図１８は、実施例２に係る部品モジュールのコイル部品付近の正面模式図である。 FIG. 17 is a plan view of the component module according to the second embodiment. FIG. 18 is a front schematic view of the vicinity of the coil component of the component module according to the second embodiment.
　図１７および図１８に示すように、コイル部品１０に伝熱部材１８および放熱フィン２２は設けられておらず、コイル部品１０の側方（－Ｘ側）に放熱フィン２２が設けられている。放熱フィン２２は金属層４２上に接合層２０を介し接合されている。放熱フィン２２の側面およびコア材１４の側面は接合層２１を介し接合されている。接合層２０および２１は、例えばロウ材、焼結金属または伝熱グリースである。その他の構成は実施例１と同じであり説明を省略する。 As shown in FIGS. 17 and 18, the coil component 10 is not provided with the heat transfer member 18 and the heat radiation fins 22, but the coil components 10 are provided with heat radiation fins 22 on the side (−X side). The heat radiating fins 22 are joined to the metal layer 42 via the joining layer 20. The side surface of the heat radiating fin 22 and the side surface of the core material 14 are joined via the joining layer 21. The bonding layers 20 and 21 are, for example, brazing material, sintered metal or heat transfer grease. Other configurations are the same as those in the first embodiment, and the description thereof will be omitted.
　実施例２によれば、放熱フィン２２は金属層４２上に接合され、かつコア材１４のうち巻き線１２の側方を覆う部分に接合されている。これにより、巻き線１２において発生した、経路５５のように熱は端子１３ｂ、金属層４２および接合層２０を介し放熱フィン２２に至る。ここで、放熱フィン２２はコア材１４に接合されており、放熱フィン２２とコイル部品１０との距離は非常に小さい。また、金属層４２は、例えば銅であり、コア材１４より熱伝導率が大きい。よって、経路５５により巻き線１２の熱が効率よく放出される。 According to the second embodiment, the heat radiation fins 22 are joined on the metal layer 42 and are joined to the portion of the core material 14 that covers the side of the winding 12. As a result, the heat generated in the winding 12 reaches the heat radiation fins 22 via the terminals 13b, the metal layer 42, and the bonding layer 20 like the path 55. Here, the heat radiation fin 22 is joined to the core material 14, and the distance between the heat radiation fin 22 and the coil component 10 is very small. Further, the metal layer 42 is, for example, copper, and has a higher thermal conductivity than the core material 14. Therefore, the heat of the winding 12 is efficiently released by the path 55.
　実施例１およびその変形例並びに実施例２のように、伝熱部材１８は端子１３ａおよび１３ｂおよび金属層４２の少なくとも一方にコア材１４以外の経路を介し接続されていればよい。これにより、巻き線１２において発生した熱は端子１３ａ、１３ｂまたは金属層４２からコア材１４以外の経路を介し放熱部材まで伝導する。よって、コイル部品１０の発熱を抑制し、電力変換効率を向上できる。 As in the first embodiment, its modifications, and the second embodiment, the heat transfer member 18 may be connected to at least one of the terminals 13a and 13b and the metal layer 42 via a path other than the core material 14. As a result, the heat generated in the winding 12 is conducted from the terminals 13a and 13b or the metal layer 42 to the heat radiating member via a path other than the core material 14. Therefore, it is possible to suppress heat generation of the coil component 10 and improve the power conversion efficiency.
　図４（ａ）、図４（ｂ）および図１７の実施例１および２のように、コイル部品１０と半導体部品３０（例えば電力変換回路のスイッチング素子）とは金属層４２を介し接続されている。この様な構成において、コイル部品１０に放熱フィン２２を接続することで、巻き線１２の熱が半導体部品３０に至ることを抑制できる。よって、半導体部品３０とコイル部品１０との距離を小さくできるため、部品モジュールを小型化できる。 As shown in Examples 1 and 2 of FIGS. 4 (a), 4 (b) and 17, the coil component 10 and the semiconductor component 30 (for example, a switching element of a power conversion circuit) are connected via a metal layer 42. There is. In such a configuration, by connecting the heat radiation fins 22 to the coil component 10, it is possible to suppress the heat of the winding 12 from reaching the semiconductor component 30. Therefore, since the distance between the semiconductor component 30 and the coil component 10 can be reduced, the component module can be miniaturized.
　以上、本発明の実施例について詳述したが、本発明はかかる特定の実施例に限定されるものではなく、特許請求の範囲に記載された本発明の要旨の範囲内において、種々の変形・変更が可能である。 Although the examples of the present invention have been described in detail above, the present invention is not limited to such specific examples, and various modifications and modifications are made within the scope of the gist of the present invention described in the claims. It can be changed.
　１０　コイル部品
　１２　巻き線
　１３ａ、１３ｂ　端子
　１３ｃ、１８ｃ　接合部
　１３ｄ、１８ｄ　接続部
　１４　コア材
　１４ａ　中心部
　１４ｂ　外部
　１６、２４　封止樹脂
　１８、１８ａ、１８ｂ　伝熱部材
　１８ｅ　放熱部
　２０、２１、３２、３６　接合層
　２２、３８　放熱フィン
　３０　半導体部品
　３０ａ、３０ｂ　電子部品
　３４　放熱板
　４０　基板
　４２、４２ａ、４２ｂ　金属層
　４４、４５、４６　接合部材
　 10 Coil parts 12 Winding 13a, 13b Terminals 13c, 18c Joints 13d, 18d Connections 14 Core material 14a Central 14b External 16, 24 Sealing resin 18, 18a, 18b Heat transfer member 18e Heat sink 20, 21, 32 , 36 Heat sink 22, 38 Heat transfer fin 30 Semiconductor parts 30a, 30b Electronic parts 34 Heat sink 40 Substrate 42, 42a, 42b Metal layer 44, 45, 46 Joint member

Claims (12)

  1. 　基板と、
    　前記基板上に設けられた金属層と、
    　巻き線と前記巻き線の少なくとも一部を覆うコア材と、前記巻き線を前記金属層に電気的に接続する端子と、を備え、前記基板上に実装されたコイル部品と、
    　前記端子および前記金属層の少なくとも一方に前記コア材以外の経路を介し接続された放熱部材と、
    を備える部品モジュール。     With the board
    With the metal layer provided on the substrate,
    A coil component mounted on the substrate, comprising a winding, a core material covering at least a part of the winding, and a terminal for electrically connecting the winding to the metal layer.
    A heat radiating member connected to at least one of the terminal and the metal layer via a path other than the core material.
    Parts module with.
  2. 　前記端子および前記金属層の少なくとも一方に接合された接合部と、前記コア材のうち前記巻き線上を覆う部分上に接合された放熱部と、前記接合部と前記放熱部とを接続する接続部と、を有し、前記コア材の熱伝導率より高い熱伝導率を有する伝熱部材を備え、
    　前記放熱部材は前記伝熱部材の前記放熱部上に接合されている請求項１に記載の部品モジュール。     A joint portion joined to at least one of the terminal and the metal layer, a heat radiating portion joined on a portion of the core material covering the winding, and a connecting portion connecting the joint portion and the heat radiating portion. A heat transfer member having a thermal conductivity higher than that of the core material is provided.
    The component module according to claim 1, wherein the heat radiating member is joined on the heat radiating portion of the heat transfer member.
  3. 　前記伝熱部材は金属部材である請求項２に記載の部品モジュール。 The component module according to claim 2, wherein the heat transfer member is a metal member.
  4. 　前記伝熱部材の前記接合部は前記端子に接合されている請求項２または３に記載の部品モジュール。 The component module according to claim 2 or 3, wherein the joint portion of the heat transfer member is joined to the terminal.
  5. 　前記コア材の表面に凹部が設けられ、前記伝熱部材の前記接続部および前記放熱部の少なくとも一部は前記凹部には埋め込まれている請求項２から４のいずれか一項に記載の部品モジュール。 The component according to any one of claims 2 to 4, wherein a recess is provided on the surface of the core material, and at least a part of the connection portion and the heat radiation portion of the heat transfer member is embedded in the recess. module.
  6. 　前記端子は、前記巻き線の両端にそれぞれ接続された第１端子および第２端子を含み、
    　前記金属層は、前記第１端子および前記第２端子にそれぞれ接続された第１金属層および第２金属層を含み、
    　前記伝熱部材は、前記第１端子および前記第１金属層の少なくとも一方と接合された第１伝熱部材と、前記第２端子および前記第２金属層の少なくとも一方と接合された第２伝熱部材と、を含み、
    　前記放熱部材は、前記第１伝熱部材の放熱部および前記第２伝熱部材の放熱部上に接合されている請求項２から５のいずれか一項に記載の部品モジュール。     The terminal includes a first terminal and a second terminal connected to both ends of the winding, respectively.
    The metal layer includes a first metal layer and a second metal layer connected to the first terminal and the second terminal, respectively.
    The heat transfer member includes a first heat transfer member bonded to at least one of the first terminal and the first metal layer, and a second heat transfer member bonded to at least one of the second terminal and the second metal layer. Including thermal components,
    The component module according to any one of claims 2 to 5, wherein the heat radiating member is joined to the heat radiating portion of the first heat transfer member and the heat radiating portion of the second heat transfer member.
  7. 　前記接続部の少なくとも一部は前記コア材の表面に設けられている請求項１から６のいずれか一項に記載の部品モジュール。 The component module according to any one of claims 1 to 6, wherein at least a part of the connection portion is provided on the surface of the core material.
  8. 　前記接続部の少なくとも一部は空気中を延伸する請求項１から６のいずれか一項に記載の部品モジュール。 The component module according to any one of claims 1 to 6, wherein at least a part of the connection portion extends in the air.
  9. 　前記伝熱部材は、一体の金属板である請求項２から８のいずれか一項に記載の部品モジュール。 The component module according to any one of claims 2 to 8, wherein the heat transfer member is an integral metal plate.
  10. 　前記伝熱部材は、前記コア材表面に形成されためっき層である請求項２から８のいずれか一項に記載の部品モジュール。 The component module according to any one of claims 2 to 8, wherein the heat transfer member is a plating layer formed on the surface of the core material.
  11. 　前記放熱部材は前記金属層上に接合され、かつ前記コア材のうち前記巻き線の側方を覆う部分に接合されている請求項１に記載の部品モジュール。 The component module according to claim 1, wherein the heat radiating member is joined on the metal layer and is joined to a portion of the core material that covers the side of the winding.
  12. 　前記コイル部品に前記金属層を介し接続され、前記基板上に実装されたスイッチング素子を備える請求項１から１１のいずれか一項に記載の部品モジュール。
    　     The component module according to any one of claims 1 to 11, further comprising a switching element connected to the coil component via the metal layer and mounted on the substrate.
PCT/JP2020/014782 2020-03-31 2020-03-31 Component module WO2021199261A1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04134815U (en) * 1991-06-04 1992-12-15 富士通株式会社 Transformer mounting structure
JPH10106847A (en) * 1996-09-12 1998-04-24 Siemens Matsushita Components Gmbh & Co Kg Device for thermal radiation from ferromagnetic core of induction device
WO2017038369A1 (en) * 2015-09-01 2017-03-09 三菱電機株式会社 Power conversion device
WO2017126315A1 (en) * 2016-01-21 2017-07-27 三菱電機株式会社 Circuit device and power conversion device
WO2017208745A1 (en) * 2016-05-30 2017-12-07 三菱電機株式会社 Circuit device and power conversion device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04134815U (en) * 1991-06-04 1992-12-15 富士通株式会社 Transformer mounting structure
JPH10106847A (en) * 1996-09-12 1998-04-24 Siemens Matsushita Components Gmbh & Co Kg Device for thermal radiation from ferromagnetic core of induction device
WO2017038369A1 (en) * 2015-09-01 2017-03-09 三菱電機株式会社 Power conversion device
WO2017126315A1 (en) * 2016-01-21 2017-07-27 三菱電機株式会社 Circuit device and power conversion device
WO2017208745A1 (en) * 2016-05-30 2017-12-07 三菱電機株式会社 Circuit device and power conversion device

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