JPS6244443U - - Google Patents
Info
- Publication number
- JPS6244443U JPS6244443U JP13653985U JP13653985U JPS6244443U JP S6244443 U JPS6244443 U JP S6244443U JP 13653985 U JP13653985 U JP 13653985U JP 13653985 U JP13653985 U JP 13653985U JP S6244443 U JPS6244443 U JP S6244443U
- Authority
- JP
- Japan
- Prior art keywords
- electromagnetic shielding
- mounting portion
- shielding device
- cover
- socket body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002093 peripheral effect Effects 0.000 claims 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第１図は第１の実施例の分解斜視図、第２図は
第１の実施例の使用状態の正面図、第３図は第２
の実施例の分解斜視図、第４図は第２の実施例の
使用状態の正面図、第５図は第３の実施例の分解
斜視図、第６図は第３の実施例の使用状態の正面
図、第７図は第４の実施例の要部斜視図、第８図
は第５の実施例の要部斜視図である。
３，１３，２３……ＩＣソケツト本体、４，１
４，２４，３４，４４……カバー取付部、５，５
′，１５，１５′，２５，３５，４５……取付部
材、６，１６，２６……電磁シールド用カバー、
７，１７，２７……被取付部、８……ＩＣ。
Figure 1 is an exploded perspective view of the first embodiment, Figure 2 is a front view of the first embodiment in use, and Figure 3 is the second embodiment.
FIG. 4 is a front view of the second embodiment in use, FIG. 5 is an exploded perspective view of the third embodiment, and FIG. 6 is the third embodiment in use. FIG. 7 is a perspective view of the main part of the fourth embodiment, and FIG. 8 is a perspective view of the main part of the fifth embodiment. 3,13,23...IC socket body, 4,1
4, 24, 34, 44...Cover mounting part, 5, 5
', 15, 15', 25, 35, 45... Mounting member, 6, 16, 26... Electromagnetic shielding cover,
7, 17, 27... Attached part, 8... IC.
Claims (1)
部に配置するとともにカバー取付部を有する取付
部材と、この取付部材の前記カバー取付部に被取
付部が取り付けられてＩＣソケツト本体の少なく
とも上方を覆う電磁シールド用カバーとを備えた
ＩＣ用電磁シールド装置。 (2) 前記カバー取付部がピン受け体であり、前
記被取付部がピンである実用新案登録請求の範囲
第(1)項記載のＩＣ用電磁シールド装置。 (3) 前記カバー取付部がスリツトであり、前記
被取付部がＶ形折曲片である実用新案登録請求の
範囲第(1)項記載のＩＣ用電磁シールド装置。 (4) 前記取付部材がＩＣソケツト本体の周縁に
外嵌する枠形である実用新案登録請求の範囲第(1
)項記載のＩＣ用電磁シールド装置。[Claims for Utility Model Registration] (1) A mounting member disposed on at least a part of the peripheral edge of the IC socket body and having a cover mounting portion, and a mounted portion being attached to the cover mounting portion of the mounting member. An electromagnetic shielding device for an IC, comprising an electromagnetic shielding cover that covers at least an upper part of an IC socket body. (2) The electromagnetic shielding device for an IC according to claim 1, wherein the cover mounting portion is a pin receiver, and the mounted portion is a pin. (3) The electromagnetic shielding device for an IC according to claim 1, wherein the cover mounting portion is a slit, and the mounting portion is a V-shaped bent piece. (4) Utility model registration claim No. 1, wherein the mounting member is in the form of a frame that fits around the periphery of the IC socket body.
) The IC electromagnetic shielding device described in item ).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13653985U JPS6244443U (en) | 1985-09-05 | 1985-09-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13653985U JPS6244443U (en) | 1985-09-05 | 1985-09-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6244443U true JPS6244443U (en) | 1987-03-17 |
Family
ID=31039746
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13653985U Pending JPS6244443U (en) | 1985-09-05 | 1985-09-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6244443U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001308573A (en) * | 2000-04-24 | 2001-11-02 | Kitagawa Ind Co Ltd | Covering case of electronic component and covering method thereof |
| JP2005116762A (en) * | 2003-10-07 | 2005-04-28 | Fujitsu Ltd | Method for protecting semiconductor device, cover for semiconductor device, semiconductor device unit, and packaging structure of semiconductor device |
-
1985
- 1985-09-05 JP JP13653985U patent/JPS6244443U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001308573A (en) * | 2000-04-24 | 2001-11-02 | Kitagawa Ind Co Ltd | Covering case of electronic component and covering method thereof |
| JP2005116762A (en) * | 2003-10-07 | 2005-04-28 | Fujitsu Ltd | Method for protecting semiconductor device, cover for semiconductor device, semiconductor device unit, and packaging structure of semiconductor device |
| US8164181B2 (en) | 2003-10-07 | 2012-04-24 | Fujitsu Semiconductor Limited | Semiconductor device packaging structure |
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