JPS6117323B2 - - Google Patents

Info

Publication number
JPS6117323B2
JPS6117323B2 JP56204682A JP20468281A JPS6117323B2 JP S6117323 B2 JPS6117323 B2 JP S6117323B2 JP 56204682 A JP56204682 A JP 56204682A JP 20468281 A JP20468281 A JP 20468281A JP S6117323 B2 JPS6117323 B2 JP S6117323B2
Authority
JP
Japan
Prior art keywords
signal line
board
circuit
line
bus line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56204682A
Other languages
Japanese (ja)
Other versions
JPS58105320A (en
Inventor
Susumu Yasui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP56204682A priority Critical patent/JPS58105320A/en
Publication of JPS58105320A publication Critical patent/JPS58105320A/en
Publication of JPS6117323B2 publication Critical patent/JPS6117323B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02GINSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G5/00Installations of bus-bars
    • H02G5/005Laminated bus-bars
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/141One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters

Landscapes

  • Insulated Conductors (AREA)

Description

【発明の詳細な説明】 本発明はバスライン装置、たとえば、電子回路
基板上に実装して、基板上の各デイバイスに+,
−の電源を安定して供給する目的で使用される所
謂ミニバスライン装置に関し、特に電気的に遮蔽
(シールド)された信号線を備えて、この信号線
を基板回路の信号線として使用できるようにした
ものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention is implemented on a bus line device, for example, an electronic circuit board, and connects each device on the board with +,
- Regarding the so-called minibus line device used for the purpose of stably supplying power to the device, it is particularly equipped with an electrically shielded signal line so that this signal line can be used as a signal line for the board circuit. This is what I did.

一般に、プリント基板では基板回路で使用され
る信号線も同時にプリント配線されているが、こ
れら基板にプリントされた信号線には何らシール
ド(電気的遮蔽)処理が施されていないのが普通
である。したがつて、この信号線を介して外部ノ
イズが入つたり或いは不要な輻射があつて、基板
回路にノイズが発生し悪影響を及ぼすという大き
な問題がある。このため、従来はこのノイズ対策
に苦慮しているのが現状であり、たとえば、その
対策の1つとして基板本体をシールドボツクスに
収納する方法が採られているが、この方法ではシ
ールドボツクスのために装置が大型化し、さらに
装置の価格も高くなる等の欠点があつた。
Generally, on a printed circuit board, the signal lines used in the circuit board are also printed, but the signal lines printed on these boards are usually not subjected to any shielding (electrical shielding) treatment. . Therefore, there is a serious problem in that external noise or unnecessary radiation enters through this signal line, causing noise to be generated in the board circuit and having an adverse effect. For this reason, it has been difficult to take countermeasures against this noise in the past. For example, one of the countermeasures is to house the board itself in a shield box, but this method However, the disadvantages were that the equipment became larger and the price of the equipment also increased.

さらに、プリント基板にあつては、信号線のプ
リント配線によつて部品の実装密度が著しく低下
するという問題があつた。
Furthermore, in the case of printed circuit boards, there is a problem in that the printed wiring of signal lines significantly reduces the mounting density of components.

本発明はかかる従来の問題点に鑑み、基板上の
デイバイスに+,−の電源を安定して供給する目
的で基板に実装されるバスライン装置に、電気的
に遮蔽された信号線を備えて基板回路の信号線と
して使用することにより、基板回路でのノイズ発
生を防止し同時に基板への部品実装密度を向上さ
せることのできる信号線付バスライン装置の提供
を目的とする。
In view of such conventional problems, the present invention provides a bus line device mounted on a board for the purpose of stably supplying + and - power to devices on the board, including an electrically shielded signal line. It is an object of the present invention to provide a bus line device with a signal line that can prevent noise generation in the board circuit and at the same time improve component mounting density on the board by using it as a signal line of the board circuit.

以下図にもとづいて本発明装置の一実施例を説
明する。
An embodiment of the apparatus of the present invention will be described below based on the drawings.

第1図は本発明に係る信号線付バスライン装置
の外観斜視図、第2図は同装置の分解斜視図を示
す。図において、M1及びM2は導電性の金属板
を示し、図示の如く帯状に形成され且つそれぞれ
下辺部には交互に複数個のピンPが突出形成され
ている。これらのピンPは回路基板の所定の配線
パターンに半田付するためのものである。
FIG. 1 is an external perspective view of a bus line device with signal lines according to the present invention, and FIG. 2 is an exploded perspective view of the device. In the figure, M1 and M2 represent conductive metal plates, each of which is formed into a band shape as shown in the figure, and a plurality of pins P are alternately formed protruding from the lower side of each plate. These pins P are for soldering to a predetermined wiring pattern on the circuit board.

Zは上記導電性金属板M1とM2の間に介在さ
せた絶縁層である。この絶縁層は第2図に示す如
く2つの絶縁板Z1,Z2から成り、且つこれら
は上記した導電性金属板M1,M2と略同形同大
の帯状に形成されている。
Z is an insulating layer interposed between the conductive metal plates M1 and M2. As shown in FIG. 2, this insulating layer consists of two insulating plates Z1 and Z2, and these are formed into strips having approximately the same shape and size as the above-mentioned conductive metal plates M1 and M2.

さらに、これらのうち一方の絶縁板Z2の内側
には複数本の信号線Sが所定の間隔でプリント配
線されていて、各信号線Sの両端はそれぞれ絶縁
板Z2の下辺部から突出形成した導電性ピンSP
に接続されている。
Furthermore, a plurality of signal lines S are printed at predetermined intervals on the inside of one of the insulating plates Z2, and both ends of each signal line S are connected to conductive lines protruding from the lower side of the insulating plate Z2. sex pin SP
It is connected to the.

そして、これらの導電性金属板M1,M2及び
絶縁板Z1,Z2は、先ず信号線Sのプリント配
線面を内側にして接着剤等により上記絶縁板Z1
とZ2を重ね合わせて固着し、さらに、その上か
ら図示の如く導電性金属板M1とM2を重ね合わ
せて一体的に固着形成されている。
Then, these conductive metal plates M1, M2 and insulating plates Z1, Z2 are first attached to the insulating plate Z1 with an adhesive or the like with the printed wiring surface of the signal line S inside.
and Z2 are superimposed and fixed together, and then conductive metal plates M1 and M2 are superimposed on top of them as shown in the figure and are integrally fixed.

かかる構成によれば、ピンPを各配線パターン
に半田付することにより、従来通り導電性金属板
M1及びM2を介して基板上のデイバイスに+,
−の電源を安定して供給することができ、さら
に、ピンSPを適宜基板上の配線パターンに接続
することにより2枚の絶縁板Z1,Z2間に配設
された信号線Sを基板回路の信号線として使用す
ることが出来る。したがつて、基板から信号線の
プリント配線パターンを削除でき、その上信号線
としてバスライン装置の絶縁板Z1,Z2により
完全にシールドされた信号線Sを使用することが
できる。
According to this configuration, by soldering the pin P to each wiring pattern, +,
In addition, by connecting the pin SP to the wiring pattern on the board as appropriate, the signal line S placed between the two insulating plates Z1 and Z2 can be connected to the board circuit. Can be used as a signal line. Therefore, the printed wiring pattern of the signal line can be eliminated from the board, and furthermore, the signal line S completely shielded by the insulating plates Z1 and Z2 of the bus line device can be used as the signal line.

以上、詳細に説明したように本発明に係る信号
線付バスライン装置は、電気的に遮蔽された信号
線を設けて基板回路の信号線として使用できるよ
うにしたから、基板上のプリント配線による信号
線を削除することができる。したがつて、基板の
スペースが拡大され、部品の実装密度を上げるこ
とができる。
As explained above in detail, the bus line device with signal line according to the present invention is provided with an electrically shielded signal line and can be used as a signal line of the board circuit. Signal lines can be deleted. Therefore, the space on the board is expanded, and the mounting density of components can be increased.

更に、信号線としてバスライン装置の完全にシ
ールドされた信号線を使用することができるの
で、外部ノイズ及び不要な輻射を完全に防止する
ことができ、しかも従来の如きシールドボツクス
も不要となる等、従来のプリント配線基板の有す
る問題点を解消することができる。更に又、通常
回路基板にて行われるジヤンパ線の替わりに使用
することもできる。
Furthermore, since the completely shielded signal line of the bus line device can be used as the signal line, external noise and unnecessary radiation can be completely prevented, and there is no need for a conventional shield box. , it is possible to solve the problems of conventional printed wiring boards. Furthermore, it can also be used in place of the jumper wires normally used on circuit boards.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明に係る信号線付バスライン装置
の外観斜視図、第2図は同装置の分解斜視図であ
る。 M1,M2は導電性金属板、Z1,Z2は絶縁
板、Sは信号線、P,SPはピン。
FIG. 1 is an external perspective view of a bus line device with signal lines according to the present invention, and FIG. 2 is an exploded perspective view of the device. M1 and M2 are conductive metal plates, Z1 and Z2 are insulating plates, S is a signal line, and P and SP are pins.

Claims (1)

【特許請求の範囲】 1 2枚の導電性板材の間に絶縁層を介在させて
なるバスライン装置に於て、上記装置に電気的に
遮蔽された信号線を設け、基板に実装の際、該信
号線を基板回路の信号線として使用できるように
構成して成ることを特徴とする信号線付バスライ
ン装置。 2 上記信号線を上記装置の絶縁層内に配設して
成ることを特徴とする特許請求の範囲第1項に記
載の信号線付バスライン装置。
[Claims] 1. In a bus line device formed by interposing an insulating layer between two conductive plates, the device is provided with an electrically shielded signal line, and when mounted on a board, A bus line device with a signal line, characterized in that the signal line is configured so that the signal line can be used as a signal line of a board circuit. 2. The bus line device with a signal line according to claim 1, wherein the signal line is disposed within an insulating layer of the device.
JP56204682A 1981-12-17 1981-12-17 Bus line device provided with signal line Granted JPS58105320A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56204682A JPS58105320A (en) 1981-12-17 1981-12-17 Bus line device provided with signal line

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56204682A JPS58105320A (en) 1981-12-17 1981-12-17 Bus line device provided with signal line

Publications (2)

Publication Number Publication Date
JPS58105320A JPS58105320A (en) 1983-06-23
JPS6117323B2 true JPS6117323B2 (en) 1986-05-07

Family

ID=16494553

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56204682A Granted JPS58105320A (en) 1981-12-17 1981-12-17 Bus line device provided with signal line

Country Status (1)

Country Link
JP (1) JPS58105320A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62255219A (en) * 1986-04-30 1987-11-07 Toyoda Gosei Co Ltd Weather strip for sashless door

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6097513A (en) * 1983-10-31 1985-05-31 日本メクトロン株式会社 Laminated bus having signal transmission line
US5166867A (en) * 1985-12-31 1992-11-24 Fujitsu Limited Bus bar for a circuit board
WO2010125426A1 (en) * 2009-04-30 2010-11-04 Idealec Bus bar arrangement
DE102013016073B4 (en) 2013-09-27 2024-03-14 Lisa Dräxlmaier GmbH Device for signal transmission in a vehicle

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62255219A (en) * 1986-04-30 1987-11-07 Toyoda Gosei Co Ltd Weather strip for sashless door

Also Published As

Publication number Publication date
JPS58105320A (en) 1983-06-23

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