JPS5892296A - Thick film integrated circuit device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a thick film integrated circuit device, and in particular, it provides electrostatic shielding between the internal circuits of the device and between the inside and outside of the device, thereby speeding up the manufacturing process. The present invention aims to provide a novel thick film integrated circuit device which is not so large and has a high degree of integration.

A hybrid integrated circuit device is a device in which a wiring film, a passive element structure film, etc. are formed on a ceramic substrate, and a transistor chip, an integrated circuit chip, etc. are bonded to the wiring film and passive element film. Used in electronic equipment, etc.

By the way, when a hybrid integrated circuit device includes a high gain amplifier circuit, a high frequency circuit, etc., it is necessary to provide an electrostatic shield to prevent oscillation. In such cases, conventionally, the hybrid integrated circuit device has been provided within a shield case, or a shield plate has been provided at an appropriate position of the hybrid integrated circuit device.

In addition, aluminum and
Attempts have also been made to fix a metal case made of stainless steel or the like and use this as a shielding ground electrode.

However, these hybrid integrated circuit devices require a relatively heavy and bulky member such as a shield plate for electrostatic shielding2, and furthermore, it takes many man-hours to actually incorporate the hybrid integrated circuit device into electronic equipment. In particular, thick film integrated circuit devices in which a metal casing is fixed to the back surface of a substrate have a problem in that the number of manufacturing steps is relatively large.

The present invention has been developed in view of the above circumstances, and it provides electrostatic shielding between the internal circuits of the device and between the inside and outside of the device, thereby reducing the number of manufacturing steps.
Furthermore, it is an object of the present invention to provide a novel thick film integrated circuit device with a high degree of integration.

The purpose of this is to construct an electronic circuit consisting of a wiring conductor film, a passive element constituent film, and electrical components connected to these films on one main surface of the insulating substrate, and a conductor film for electrostatic shielding on the other main surface. A plurality of concave or through-hole connecting wire connections are formed on the periphery or inside of the plurality of thick film integrated circuit boards formed with a conductor film, and the plurality of thick film integrated circuit boards are The connection line connection parts provided in the above are overlapped so that the positions thereof are aligned with each other, and the mutually aligned connection line connection parts are connected by one conductive connection line soldered to each one. This can be achieved by electrically connecting at least one of the connecting wires to the electrostatic shielding conductive film of each thick film integrated circuit.

Hereinafter, the present invention will be described in detail according to embodiments shown in the accompanying drawings.

1 to 3 show the structure of an embodiment of the present invention. In the figures, 1, 1, . . . are thick film integrated circuit boards, each of which has a disk shape, On one main surface (front surface) of an insulating substrate 2 made of a ceramic substrate or the like, wiring conductor films 3, 3, . Capacitor electrode constituent film 5. A passive element constituent film such as a capacitor dielectric constituent film 6 is formed, and a mesh-shaped electrostatic shielding conductive film 7 is formed on the other main surface (back surface) of the insulating substrate 2.

8.8... are each thick film integrated circuit board 1, 1...
For example, an arc-shaped notch 9°9 is formed on the periphery of the insulating substrates 2, 2, . 9,9...
Conductor films 10, 10, . . . , of the same quality as the conductor films 3, 3, . This can be provided by forming connecting side conductor films 11, 11, . . . .

12, 12... are thick film integrated circuit boards 1, 1 .
Capacitor chips soldered to wiring conductor films 3, 3, . . . 1, 13, 13, . . . are wiring conductor films of thick film integrated circuit board 1.1. 3, 3, each electrode is connected to the wiring conductor film 3, 3 via the connector wire 14, 14...
..., and the chip surface and the wire connection portion are protected with an appropriate insulating material. 1
5 is a transistor, and its lead wires 16, 16...
. . are soldered to the wiring conductor films 3, 3, . . . . Reference numerals 17, 17, . . . are connection lines made of metal, which keep the thick film integrated circuit boards stacked one on top of the other with a certain distance between them. That is, each connecting line connecting portion 8, 8, . . . provided on the periphery of the integrated circuit boards 1, 1, . Lay all the thick film integrated circuit boards 1, 1... on top of each other at a certain distance so as to align with each connection line connecting portion 8, 8... provided on the periphery, and then In the state, multiple pieces aligned with each other (
(same number as the number of thick film integrated circuit boards 1) connection line connection parts 8, 8.
. . . by attaching one connecting wire to the connecting wire 17 and soldering the connecting wire connecting portions 8, 8, . . . to each other as necessary. It is formed by forming an integrated circuit. 18 indicates solder. A part of the plurality of connection lines 17, 17, . . . , which connect the plurality of thick film integrated circuit boards 1, 1, . It is electrically connected to the electrostatic shielding conductor films 7, 7, . . . provided on the back surfaces of . In addition, connecting lines 17, 17...
, . . . are simply thick film integrated circuit boards 1.
1...Thick film integrated circuit board 1 is used as nothing more than a mechanical connection between the two, but some of the other parts are different.
, 1, . . . are also used as wiring to electrically connect circuits.

As detailed above, the thick film integrated circuit device according to the present invention has an electronic circuit comprising a wiring conductor film, a passive element constituent film, and electrical components connected to these films on one main surface of an insulating substrate. A plurality of concave or through hole-shaped connection line connection portions made of a conductive film are formed on the periphery or inside of a plurality of thick film integrated circuit boards each having a conductive film for electrostatic rolling formed on the other main surface. , a plurality of circuit boards are stacked so that the positions of the connecting line connecting parts provided on each circuit board are aligned with each other, and the aligned connecting line connecting parts are soldered to each other. At least one of the I-description connections is electrically connected to the electrostatic shielding conductor film of each thick film integrated circuit, so The electrostatic shielding conductor film provided on the (main surface) can electrostatically shield the electronic circuits on each circuit board from the electronic circuits on other circuit boards and the electronic circuits outside the thick film integrated circuit device. . Therefore, it is possible to prevent oscillation, radio interference, etc. from occurring.

Further, according to the thick film integrated circuit device of the present invention, instead of providing electrostatic shielding by attaching a separate electrostatic shielding member to the thick film integrated circuit board as in the past, the thick film integrated circuit During the process of forming the circuit board, electrostatic shielding is performed using a conductor film for electrostatic rolling that is integrally formed on the back surface, so the number of man-hours required to manufacture the thick film integrated circuit device itself increases unnecessarily to provide electrostatic shielding. It is possible to avoid an increase in the number of man-hours required for incorporating the thick film integrated circuit device into electronic equipment.

Furthermore, according to the present invention, a plurality of thick film integrated circuit boards, which inherently have high circuit integration density, are further stacked on top of each other, so that the degree of circuit integration of the thick film integrated circuit device can be significantly improved. Can be done.

Note that the present invention is not limited to the embodiments described above, and can be modified in various ways.

For example, in the embodiment described above, each connecting line connection portion 8.
8... is a thick film integrated circuit board 1.1...
A through hole is formed inside the thick film integrated circuit board 1, 1, and a conductive film is formed on the inner surface of the through hole and on both upper and lower peripheral edges. It may be provided by forming a.

Further, in the above embodiment, the electrostatic shielding conductor film 7
Although the pattern is in the form of a mesh, it may be formed so as to cover most of the back surfaces of the thick film integrated circuit boards 1, 1, . . . . However, the mesh shape is more preferable because it requires less material for the conductor film, is more economical, and does not reduce the electrostatic shielding effect.

Furthermore, in the above-described embodiment, each thick film integrated circuit board 1, 1, . . . is circular, but it does not necessarily have to be so. Of course.

[Brief explanation of drawings]

The drawings all show the configuration of an embodiment of a thick film integrated circuit device, with FIG. 1 being a vertical sectional view, FIG. 2 being a bottom view, and FIG.
The figure is a perspective view. l... Thick film integrated circuit board, 2... Insulating substrate, 3... Wiring conductor film, j, 5, 6
... Passive element constituent film, 7 ... Conductor film for electrostatic shielding, 8 ... Connection line connection part, 9 ...
...Notch, 10, 11... Conductor film, 12
, 13 , 15...Electronic parts, 17...
Connecting line, Qin l Figure 3

Claims (2)

[Claims] (1) An electronic circuit consisting of a wiring conductor film, a passive element constituent film, and electrical components connected to these films is formed on one main surface of an insulating substrate, and a conductor film for electrostatic shielding is formed on the other main surface. A plurality of concave or through-hole connecting wire connection portions made of a conductive film are formed on the periphery or inside of the plurality of thick film integrated circuit boards formed, and a plurality of thick film integrated circuit boards are provided on each circuit board. The above-mentioned connecting wire connecting portions are overlapped so that the positions of the connecting wire connecting portions are aligned with each other, and the mutually aligned connecting wire connecting portions are connected by one conductive connecting wire soldered to each one, and the above-mentioned A thick film integrated circuit device characterized in that at least one of the connecting wires is electrically connected to a conductor film for electrostatic shielding of each thick film integrated circuit. (2) The thick film integrated circuit device according to claim 1, wherein the electrostatic shielding conductive film has a mesh-like pattern.