JPS6127372U - circuit board - Google Patents
circuit boardInfo
- Publication number
- JPS6127372U JPS6127372U JP11309884U JP11309884U JPS6127372U JP S6127372 U JPS6127372 U JP S6127372U JP 11309884 U JP11309884 U JP 11309884U JP 11309884 U JP11309884 U JP 11309884U JP S6127372 U JPS6127372 U JP S6127372U
- Authority
- JP
- Japan
- Prior art keywords
- board
- circuit board
- wiring pattern
- fastener
- abstract
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は本考案の1実施例になる回路基板を適用した回
路基板装置の正面図、第2図は本考案の1実施例になる
回路基板の下面のレジストパターン及び配線パターン図
、第3図は第2図の変形例を示す図、第4図は従来の回
路基板を適用した回路基板装置の正面図、第5図は従来
の回路基板の、下面の配線パターン及びレジストパター
ン図を夫々示す。
1・・・基板、2・・・放熱板、3・・・トランジスタ
、6,7・・・貫通孔、9・・・ネジ、12.15・・
・レジストの印刷されていない部分、13・・・半田付
着部、1・4・・・菊ワツシャ。FIG. 1 is a front view of a circuit board device to which a circuit board according to an embodiment of the present invention is applied, FIG. 2 is a resist pattern and wiring pattern diagram of the lower surface of a circuit board according to an embodiment of the present invention, and FIG. The figure shows a modification of FIG. 2, FIG. 4 is a front view of a circuit board device using a conventional circuit board, and FIG. 5 is a diagram of the wiring pattern and resist pattern on the lower surface of the conventional circuit board. show. DESCRIPTION OF SYMBOLS 1... Board, 2... Heat sink, 3... Transistor, 6, 7... Through hole, 9... Screw, 12.15...
・Unprinted part of resist, 13...Solder attachment part, 1.4...Chrysanthemum washers.
Claims (1)
貫通された締付具により電気的導通を計.る様にした回
路基板装置において、該締付具が貫通される基板の貫通
孔の回りの該配線パターン上に細線状の半田付着部を形
成した事を特徴とする回路基板。Electrical continuity was established between the components on the top of the board and the wiring pattern on the bottom of the board using a fastener that penetrated the board. 1. A circuit board device characterized in that a thin line-shaped solder attachment portion is formed on the wiring pattern around a through hole of the board through which the fastener passes.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11309884U JPS6127372U (en) | 1984-07-25 | 1984-07-25 | circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11309884U JPS6127372U (en) | 1984-07-25 | 1984-07-25 | circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6127372U true JPS6127372U (en) | 1986-02-18 |
Family
ID=30672130
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11309884U Pending JPS6127372U (en) | 1984-07-25 | 1984-07-25 | circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6127372U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62203398A (en) * | 1986-03-04 | 1987-09-08 | 松下電器産業株式会社 | Shielding of printed board |
-
1984
- 1984-07-25 JP JP11309884U patent/JPS6127372U/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62203398A (en) * | 1986-03-04 | 1987-09-08 | 松下電器産業株式会社 | Shielding of printed board |
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