JPS60121675U - printed wiring board - Google Patents

printed wiring board

Info

Publication number
JPS60121675U
JPS60121675U JP983084U JP983084U JPS60121675U JP S60121675 U JPS60121675 U JP S60121675U JP 983084 U JP983084 U JP 983084U JP 983084 U JP983084 U JP 983084U JP S60121675 U JPS60121675 U JP S60121675U
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
conductor pattern
soldering
heat conduction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP983084U
Other languages
Japanese (ja)
Inventor
洋一 川井
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to JP983084U priority Critical patent/JPS60121675U/en
Publication of JPS60121675U publication Critical patent/JPS60121675U/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来のプリント配線基板の要部斜視図、第２図
は本考案の一実施例のプリント配線基板の要部斜視図で
ある。・ １１・・・絶縁基板、１２・・・導体パターン、１３゜
１４．１５・・・取付孔、１６・・・ソルダーレジスト
、１７．１８，１９・・・半田付は個所、２０，２１゜
２２．２３・・・導体パターン欠除部。FIG. 1 is a perspective view of a main part of a conventional printed wiring board, and FIG. 2 is a perspective view of a main part of a printed wiring board according to an embodiment of the present invention.・ 11... Insulating board, 12... Conductor pattern, 13° 14.15... Mounting hole, 16... Solder resist, 17.18, 19... Soldering points, 20, 21° 22.23... Conductor pattern missing portion.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁基板に設けた導体パターンの半田付は個所の周囲に
、隣接する導体パターンへの熱伝導を阻止して、その半
田付は個所の加熱効果を高めるような導体パターン欠除
部を設けたことを特徴とするプリント配線基板。When soldering a conductor pattern on an insulating substrate, a conductor pattern cutout is provided around the part to prevent heat conduction to the adjacent conductor pattern and increase the heating effect of the soldering part. A printed wiring board featuring:
JP983084U 1984-01-26 1984-01-26 printed wiring board Pending JPS60121675U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP983084U JPS60121675U (en) 1984-01-26 1984-01-26 printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP983084U JPS60121675U (en) 1984-01-26 1984-01-26 printed wiring board

Publications (1)

Publication Number Publication Date
JPS60121675U true JPS60121675U (en) 1985-08-16

Family

ID=30490419

Family Applications (1)

Application Number Title Priority Date Filing Date
JP983084U Pending JPS60121675U (en) 1984-01-26 1984-01-26 printed wiring board

Country Status (1)

Country Link
JP (1) JPS60121675U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63137971U (en) * 1987-03-02 1988-09-12

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63137971U (en) * 1987-03-02 1988-09-12

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