JPS63137971U - - Google Patents
Info
- Publication number
- JPS63137971U JPS63137971U JP3059487U JP3059487U JPS63137971U JP S63137971 U JPS63137971 U JP S63137971U JP 3059487 U JP3059487 U JP 3059487U JP 3059487 U JP3059487 U JP 3059487U JP S63137971 U JPS63137971 U JP S63137971U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- width
- ground
- ground pattern
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は、本考案の第１実施例の回路基板の要
部平面図、第２図は、その使用状態の一例を示す
要部平面図、第３図は、本考案の第１実施例の回
路基板と従来の回路基板とを用いた場合のそれぞ
れの電子部品の挿入損失特性を示す特性図、第４
図は、本考案の第２実施例の回路基板の要部平面
図、第５図は、本考案の第３実施例の回路基板の
要部平面図、第６図は、チツプ型電子部品の斜視
図、第７図は、第３実施例の回路基板の使用状態
の一例を示す要部平面図、第８図は、第３実施例
の変形例を示す要部平面図、第９図は、従来の回
路基板の要部平面図、第１０図は、チツプ型電子
部品の斜視図、第１１図は、従来の回路基板の使
用状態の一例を示す要部平面図、第１２図は、従
来の他の回路基板の要部平面図である。
５，５２―電子部品素体、６，７，５４―入出
力電極、８，５３―アース電極、９，５１―チツ
プ型電子部品、２１―基板、２２，２３，５６―
入出力パターン、２４，５５―アースパターン、
２５，５７―ソルダーレジスト膜、２６，２７，
５７，５８―窓。
Fig. 1 is a plan view of the main parts of a circuit board according to the first embodiment of the present invention, Fig. 2 is a plan view of the main parts showing an example of its usage condition, and Fig. 3 is a plan view of the main parts of the circuit board according to the first embodiment of the present invention. Characteristic diagram showing the insertion loss characteristics of each electronic component when using a circuit board and a conventional circuit board, 4th
The figure is a plan view of the main parts of the circuit board according to the second embodiment of the present invention, FIG. 5 is a plan view of the main parts of the circuit board according to the third embodiment of the present invention, and FIG. A perspective view, FIG. 7 is a plan view of the main part showing an example of the usage state of the circuit board of the third embodiment, FIG. 8 is a plan view of the main part showing a modification of the third embodiment, and FIG. , FIG. 10 is a perspective view of a chip-type electronic component, FIG. 11 is a plan view of the main part showing an example of the usage state of the conventional circuit board, and FIG. 12 is a plan view of the main part of a conventional circuit board. FIG. 7 is a plan view of main parts of another conventional circuit board. 5, 52 - Electronic component element body, 6, 7, 54 - Input/output electrode, 8, 53 - Earth electrode, 9, 51 - Chip type electronic component, 21 - Substrate, 22, 23, 56 -
Input/output pattern, 24,55-earth pattern,
25,57-Solder resist film, 26,27,
57,58-window.
Claims (1)
ース電極と接続されるアースパターンが形成され
、このアースパターン表面にはソルダーレジスト
膜が形成されてなる回路基板であつて、 前記アースパターンの幅を、前記電子部品のア
ース電極の幅よりも大きく形成するとともに、こ
のアースパターンと前記アース電極とが接続され
る部分に、前記アースパターン表面が露出するよ
うな、前記ソルダーレジスト膜の形成されていな
い窓を形成し、この窓の幅を前記アース電極の幅
よりも小さくしたことを特徴とする回路基板。[Claims for Utility Model Registration] A circuit board having at least a ground pattern connected to a ground electrode of a chip-type electronic component formed on one side, and a solder resist film formed on the surface of this ground pattern. , the solder is formed such that the width of the ground pattern is larger than the width of the ground electrode of the electronic component, and the surface of the ground pattern is exposed at a portion where the ground pattern and the ground electrode are connected. 1. A circuit board characterized in that a window is formed without a resist film, and the width of the window is smaller than the width of the ground electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987030594U JPH0729658Y2 (en) | 1987-03-02 | 1987-03-02 | Circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987030594U JPH0729658Y2 (en) | 1987-03-02 | 1987-03-02 | Circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63137971U true JPS63137971U (en) | 1988-09-12 |
| JPH0729658Y2 JPH0729658Y2 (en) | 1995-07-05 |
Family
ID=30835548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987030594U Expired - Lifetime JPH0729658Y2 (en) | 1987-03-02 | 1987-03-02 | Circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0729658Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014036170A (en) * | 2012-08-10 | 2014-02-24 | Murata Mfg Co Ltd | Land structure of mounting board and vibration sound reduction method of mounting board |
| US9374901B2 (en) | 2012-08-10 | 2016-06-21 | Murata Manufacturing Co., Ltd. | Monolithic capacitor mounting structure and monolithic capacitor |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60121675U (en) * | 1984-01-26 | 1985-08-16 | 株式会社村田製作所 | printed wiring board |
-
1987
- 1987-03-02 JP JP1987030594U patent/JPH0729658Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60121675U (en) * | 1984-01-26 | 1985-08-16 | 株式会社村田製作所 | printed wiring board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014036170A (en) * | 2012-08-10 | 2014-02-24 | Murata Mfg Co Ltd | Land structure of mounting board and vibration sound reduction method of mounting board |
| US9374901B2 (en) | 2012-08-10 | 2016-06-21 | Murata Manufacturing Co., Ltd. | Monolithic capacitor mounting structure and monolithic capacitor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0729658Y2 (en) | 1995-07-05 |
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