JPH0348264U - - Google Patents
Info
- Publication number
- JPH0348264U JPH0348264U JP10925389U JP10925389U JPH0348264U JP H0348264 U JPH0348264 U JP H0348264U JP 10925389 U JP10925389 U JP 10925389U JP 10925389 U JP10925389 U JP 10925389U JP H0348264 U JPH0348264 U JP H0348264U
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- width
- chip component
- view
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の第１実施例の平面図、第２図
はその断面図、第３図は本考案の第２実施例の平
面図、第４図はその断面図、第５図は本考案の第
３実施例の平面図、第６図はその断面図、第７図
は従来例における半田接合部付近の断面図、第８
図は異なる幅の半田接合部におけるそれぞれの断
線率を示す図である。
１１……配線回路基板、１２，１８，２２……
半田ランド、１３，２０……導体パターン、１４
，１７……チツプ部品、１５，１９……電極、１
６，２１……半田接合部。
Fig. 1 is a plan view of the first embodiment of the invention, Fig. 2 is a sectional view thereof, Fig. 3 is a plan view of the second embodiment of the invention, Fig. 4 is a sectional view thereof, and Fig. 5 is a sectional view thereof. A plan view of the third embodiment of the present invention, FIG. 6 is a sectional view thereof, FIG. 7 is a sectional view of the vicinity of the solder joint in the conventional example, and FIG.
The figure is a diagram showing the respective disconnection rates in solder joints of different widths. 11... Wired circuit board, 12, 18, 22...
Solder land, 13, 20... Conductor pattern, 14
, 17... Chip parts, 15, 19... Electrodes, 1
6, 21...Solder joint.
Claims (1)
対し、当該チツプ部品を取付けるための半田ラン
ドの幅が等しいか若しくはそれよりも狭いことを
特徴とする配線回路基板。 A printed circuit board characterized in that the width of a solder land for attaching a chip component is equal to or narrower than the width between the electrodes of a chip component provided with electrodes at both ends.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10925389U JPH0348264U (en) | 1989-09-19 | 1989-09-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10925389U JPH0348264U (en) | 1989-09-19 | 1989-09-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0348264U true JPH0348264U (en) | 1991-05-08 |
Family
ID=31657853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10925389U Pending JPH0348264U (en) | 1989-09-19 | 1989-09-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0348264U (en) |
-
1989
- 1989-09-19 JP JP10925389U patent/JPH0348264U/ja active Pending