JPH01140879U - - Google Patents
Info
- Publication number
- JPH01140879U JPH01140879U JP3664788U JP3664788U JPH01140879U JP H01140879 U JPH01140879 U JP H01140879U JP 3664788 U JP3664788 U JP 3664788U JP 3664788 U JP3664788 U JP 3664788U JP H01140879 U JPH01140879 U JP H01140879U
- Authority
- JP
- Japan
- Prior art keywords
- electrode pattern
- chip capacitor
- diagram showing
- shaped electrode
- explanatory diagram
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 1
- 239000003990 capacitor Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一実施例による回路基板の電
極パターンを示す平面図、第２図は本考案のＹ字
型を有する電極パターン上にチツプコンデンサを
実装した状態を示す説明図で同図ａはＹ字型を有
する電極パターンの中心部にチツプコンデンサを
実装した状態を示す説明図で、同図ｂはチツプコ
ンデンサが位置ズレ実装された状態を示す説明図
、第３図は本考案のＹ字型を有する電極パターン
にチツプコンデンサを実装・はんだ付けした状態
を示す説明図、第４図は本考案と従来例の電極パ
ターンによるチツプコンデンサのはんだ接合強度
を示す比較データの散布図、第５図は第４図で使
用したチツプコンデンサのはんだ接合強度測定法
を示す概略図、第６図は本考案と従来例の電極パ
ターンによるチツプコンデンサのたわみ強度を示
す比較データの散布図、第７図は第６図で使用し
たチツプコンデンサのたわみ強度測定法を示す概
略図、第８図は従来の回路基板の電極パターン形
状を示す平面図である。
１……Ｙ字型を有する電極パターン、３……チ
ツプコンデンサ、４……半田接合部。
FIG. 1 is a plan view showing an electrode pattern of a circuit board according to an embodiment of the present invention, and FIG. 2 is an explanatory diagram showing a state in which a chip capacitor is mounted on the Y-shaped electrode pattern of the present invention. Figure a is an explanatory diagram showing a chip capacitor mounted in the center of a Y-shaped electrode pattern, Figure b is an explanatory diagram showing a chip capacitor mounted in a misaligned manner, and Figure 3 is an explanatory diagram showing a chip capacitor mounted at the center of a Y-shaped electrode pattern. FIG. 4 is an explanatory diagram showing the state in which a chip capacitor is mounted and soldered to a Y-shaped electrode pattern. FIG. Figure 5 is a schematic diagram showing the method for measuring the solder joint strength of the chip capacitor used in Figure 4, Figure 6 is a scatter diagram of comparative data showing the deflection strength of chip capacitors using the electrode patterns of the present invention and the conventional example, and Figure 7 This figure is a schematic diagram showing a method for measuring the deflection strength of the chip capacitor used in FIG. 6, and FIG. 8 is a plan view showing the shape of an electrode pattern of a conventional circuit board. 1... Electrode pattern having a Y-shape, 3... Chip capacitor, 4... Solder joint.
Claims (1)
極パターンを有する回路基板。 A circuit board with a Y-shaped electrode pattern for soldering surface-mounted components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3664788U JPH01140879U (en) | 1988-03-18 | 1988-03-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3664788U JPH01140879U (en) | 1988-03-18 | 1988-03-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01140879U true JPH01140879U (en) | 1989-09-27 |
Family
ID=31263240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3664788U Pending JPH01140879U (en) | 1988-03-18 | 1988-03-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01140879U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5918469B2 (en) * | 1980-08-21 | 1984-04-27 | 株式会社神戸製鋼所 | Method for producing aluminum alloy plate with excellent bright alumite properties and strength |
| JPS6138975B2 (en) * | 1981-09-08 | 1986-09-01 | Matsushita Electric Ind Co Ltd |
-
1988
- 1988-03-18 JP JP3664788U patent/JPH01140879U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5918469B2 (en) * | 1980-08-21 | 1984-04-27 | 株式会社神戸製鋼所 | Method for producing aluminum alloy plate with excellent bright alumite properties and strength |
| JPS6138975B2 (en) * | 1981-09-08 | 1986-09-01 | Matsushita Electric Ind Co Ltd |
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