JPS61168670U - - Google Patents
Info
- Publication number
- JPS61168670U JPS61168670U JP5174685U JP5174685U JPS61168670U JP S61168670 U JPS61168670 U JP S61168670U JP 5174685 U JP5174685 U JP 5174685U JP 5174685 U JP5174685 U JP 5174685U JP S61168670 U JPS61168670 U JP S61168670U
- Authority
- JP
- Japan
- Prior art keywords
- chip parts
- circuit board
- printed circuit
- parts
- electrode patterns
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図〜第４図は本考案の１実施例に係り、第
１図はチツプ部品が載置された状態の要部平面図
、第２図は第１図の状態に対応する断面図、第３
図は半田付け後の状態を示す断面図、第４図はチ
ツプ部品が位置ズレした場合を示す説明図、第５
図は本考案の他の実施例に係るプリント基板の要
部平面図、第６図および第７図は従来例に係り、
第６図は要部平面図、第７図はチツプ部品が位置
ズレした場合を示す説明図である。
１…プリント基板、２…接続電極パターン、２
ａ…切欠き、３，６…透孔、４…チツプ部品、５
…接続電極。
1 to 4 relate to one embodiment of the present invention, in which FIG. 1 is a plan view of the main part in a state where chip parts are placed, FIG. 2 is a sectional view corresponding to the state shown in FIG. 1, Third
The figure is a sectional view showing the state after soldering, Figure 4 is an explanatory diagram showing the case where the chip parts are misaligned, and Figure 5 is a cross-sectional view showing the state after soldering.
The figure is a plan view of the main parts of a printed circuit board according to another embodiment of the present invention, and FIGS. 6 and 7 are related to a conventional example,
FIG. 6 is a plan view of the main part, and FIG. 7 is an explanatory diagram showing a case where the chip parts are misaligned. 1... Printed circuit board, 2... Connection electrode pattern, 2
a... Notch, 3, 6... Through hole, 4... Chip part, 5
...Connection electrode.
Claims (1)
れぞれ接続するための接続電極パターンが形成さ
れたプリント基板において、前記各接続電極パタ
ーンが前記チツプ部品の接続電極と重なる部位に
、前記チツプ部品の位置ズレ検出用の透孔を穿設
したことを特徴とするプリント基板。 In a printed circuit board on which connection electrode patterns are formed to respectively connect the connection electrodes formed at the ends of the chip parts, the parts of the chip parts where the respective connection electrode patterns overlap with the connection electrodes of the chip parts are provided. A printed circuit board characterized by having a through hole for detecting positional deviation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5174685U JPS61168670U (en) | 1985-04-09 | 1985-04-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5174685U JPS61168670U (en) | 1985-04-09 | 1985-04-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61168670U true JPS61168670U (en) | 1986-10-20 |
Family
ID=30571074
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5174685U Pending JPS61168670U (en) | 1985-04-09 | 1985-04-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61168670U (en) |
-
1985
- 1985-04-09 JP JP5174685U patent/JPS61168670U/ja active Pending