JPS6448063U - - Google Patents
Info
- Publication number
- JPS6448063U JPS6448063U JP14414287U JP14414287U JPS6448063U JP S6448063 U JPS6448063 U JP S6448063U JP 14414287 U JP14414287 U JP 14414287U JP 14414287 U JP14414287 U JP 14414287U JP S6448063 U JPS6448063 U JP S6448063U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- short detection
- substrate surface
- resin substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001514 detection method Methods 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の実施例に係るプリント配線基
板の要部のみの平面図、第２図はその縦断面図、
第３図はシヨート検出電極の接続例を示す等価回
路図である。
１……樹脂基板、２……プリント配線基板、３
，４……シヨート検出電極。
FIG. 1 is a plan view of only the main parts of a printed wiring board according to an embodiment of the present invention, and FIG. 2 is a longitudinal sectional view thereof.
FIG. 3 is an equivalent circuit diagram showing an example of connection of short detection electrodes. 1...Resin board, 2...Printed wiring board, 3
, 4... Short detection electrode.
Claims (1)
てなるプリント配線基板において、 その樹脂基板面の所定位置に所定の距離を隔て
て対向する一対のシヨート検出電極を形成したこ
とを特徴とするプリント配線基板。 (2) シヨート検出電極上に半田を付与して半田
盛り上がり部を形成した前記実用新案登録請求の
範囲第１項に記載のプリント配線基板。[Claims for Utility Model Registration] (1) In a printed wiring board having a predetermined wiring pattern formed on a resin substrate surface, a pair of short detection electrodes facing each other at a predetermined position on the resin substrate surface with a predetermined distance apart. A printed wiring board characterized by forming. (2) The printed wiring board according to claim 1, wherein solder is applied on the short detection electrode to form a solder bulge.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14414287U JPS6448063U (en) | 1987-09-21 | 1987-09-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14414287U JPS6448063U (en) | 1987-09-21 | 1987-09-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6448063U true JPS6448063U (en) | 1989-03-24 |
Family
ID=31411586
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14414287U Pending JPS6448063U (en) | 1987-09-21 | 1987-09-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6448063U (en) |
-
1987
- 1987-09-21 JP JP14414287U patent/JPS6448063U/ja active Pending