JPH0410366U - - Google Patents
Info
- Publication number
- JPH0410366U JPH0410366U JP5050890U JP5050890U JPH0410366U JP H0410366 U JPH0410366 U JP H0410366U JP 5050890 U JP5050890 U JP 5050890U JP 5050890 U JP5050890 U JP 5050890U JP H0410366 U JPH0410366 U JP H0410366U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- polarity
- chip component
- land
- component mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 description 1
- 238000010019 resist printing Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の実施例のチツプ部品取付用ラ
ンドにチツプ部品を載せた状態を示す斜視図、第
２図は本考案の他の実施例のチツプ部品取付用ラ
ンドにチツプ部品を載せた状態を示す正面図、第
３図は従来のチツプ部品取付用ランドにチツプ部
品を載せた状態を示す斜視図である。
１，１ａ，１ｂ……チツプ部品取付用ランド、
２……チツプ部品、３，３ａ，３ｂ……電極部、
４……導体パターン、５……レジスト印刷、６…
…プリント基板。
Fig. 1 is a perspective view showing a state in which a chip component is placed on a chip component mounting land according to an embodiment of the present invention, and Fig. 2 is a perspective view showing a state in which a chip component is placed on a chip component mounting land according to another embodiment of the present invention. FIG. 3 is a front view showing the state, and FIG. 3 is a perspective view showing a state in which a chip component is placed on a conventional chip component mounting land. 1, 1a, 1b...Land for mounting chip parts,
2... Chip parts, 3, 3a, 3b... Electrode part,
4... Conductor pattern, 5... Resist printing, 6...
…Printed board.
Claims (1)
記電子部品が極性を有し、かつ電極が前記極性に
よつて相異なる形状とし、前記電子部品を実装す
る前記プリント基板上に形成されたチツプ部品取
付用ランドが、前記電子部品の電極の形状と類似
した形状としたことを特徴とするチツプ部品取付
用ランド。 A chip component mounting land formed on the printed circuit board on which the electronic component is mounted, wherein the electronic component has a polarity and electrodes have different shapes depending on the polarity. A chip component mounting land characterized in that the land has a shape similar to the shape of the electrode of the electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5050890U JPH0410366U (en) | 1990-05-14 | 1990-05-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5050890U JPH0410366U (en) | 1990-05-14 | 1990-05-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0410366U true JPH0410366U (en) | 1992-01-29 |
Family
ID=31569116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5050890U Pending JPH0410366U (en) | 1990-05-14 | 1990-05-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0410366U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009026823A (en) * | 2007-07-17 | 2009-02-05 | Toshiba Corp | Printed wiring board, and electronic device |
-
1990
- 1990-05-14 JP JP5050890U patent/JPH0410366U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009026823A (en) * | 2007-07-17 | 2009-02-05 | Toshiba Corp | Printed wiring board, and electronic device |