JPS61179773U - - Google Patents
Info
- Publication number
- JPS61179773U JPS61179773U JP6431285U JP6431285U JPS61179773U JP S61179773 U JPS61179773 U JP S61179773U JP 6431285 U JP6431285 U JP 6431285U JP 6431285 U JP6431285 U JP 6431285U JP S61179773 U JPS61179773 U JP S61179773U
- Authority
- JP
- Japan
- Prior art keywords
- chip component
- circuit board
- printed circuit
- adhesive
- wiring body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 238000010019 resist printing Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案に係るチツプ部品配線体におけ
るプリント基板の半田側面の平面図、第２図は第
１図のチツプ部品載置後の平面図、及び第３図は
従来のチツプ部品配線体の平面図である。
１０……プリント基板、１１……異色のレジス
ト印刷パターン、１２……接着剤、１３〜１５…
…チツプ部品、１６，１７……導電ランド。
FIG. 1 is a plan view of the soldered side of a printed circuit board in a chip component wiring body according to the present invention, FIG. 2 is a plan view after the chip component shown in FIG. 1 is mounted, and FIG. 3 is a conventional chip component wiring body. FIG. 10...Printed circuit board, 11...Different color resist printing pattern, 12...Adhesive, 13-15...
...Chip parts, 16, 17...Conductive lands.
Claims (1)
部品を搭載したプリント配線体において、前記接
着剤のプリント基板塗着面積より大きいが搭載チ
ツプ部品外形より小さく且つプリント基板とチツ
プ部品の外表面色とは異色にしたレジスト用パタ
ーンを施し、前記接着剤の塗着状態と同時に前記
チツプ部品の搭載状態を目視検知可能にしたこと
を特徴とするチツプ部品配線体。 In a printed wiring body in which a chip component is mounted on a predetermined position of a printed circuit board using an adhesive, the surface area of the printed circuit board is larger than the area covered by the adhesive, but smaller than the outer shape of the mounted chip component, and the color of the outer surface of the printed circuit board and the chip component is different from that of the printed circuit board. 1. A chip component wiring body, characterized in that the chip component wiring body is provided with a resist pattern of 300 to 300 nm, so that the state of mounting of the chip component can be visually detected at the same time as the state of application of the adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6431285U JPS61179773U (en) | 1985-04-30 | 1985-04-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6431285U JPS61179773U (en) | 1985-04-30 | 1985-04-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61179773U true JPS61179773U (en) | 1986-11-10 |
Family
ID=30595278
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6431285U Pending JPS61179773U (en) | 1985-04-30 | 1985-04-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61179773U (en) |
-
1985
- 1985-04-30 JP JP6431285U patent/JPS61179773U/ja active Pending