JPH028078U - - Google Patents
Info
- Publication number
- JPH028078U JPH028078U JP8298788U JP8298788U JPH028078U JP H028078 U JPH028078 U JP H028078U JP 8298788 U JP8298788 U JP 8298788U JP 8298788 U JP8298788 U JP 8298788U JP H028078 U JPH028078 U JP H028078U
- Authority
- JP
- Japan
- Prior art keywords
- surface mount
- mount components
- terminals
- soldered
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003014 reinforcing effect Effects 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図ａは本考案の一実施例を示す平面図、第
１図ｂはその縦断面図、第２図は本考案の他の実
施例を示す平面図、第３図ａは従来技術を示す平
面図、第３図ｂはその−線断面図である。
図面中、３，２３は端子、５はハンダ、１１，
２１はプリント基板、１７ａ，１７ｂはランド、
１７ｃ，１７ｄ，２３ｃ，２３ｄはスルーホール
である。
FIG. 1a is a plan view showing one embodiment of the present invention, FIG. The plan view shown, and FIG. 3b, is a sectional view taken along the - line. In the drawing, 3 and 23 are terminals, 5 is solder, 11,
21 is a printed circuit board, 17a and 17b are lands,
17c, 17d, 23c, and 23d are through holes.
Claims (1)
付けする補強用のランドにスルーホールを設けた
ことを特徴とする表面実装用部品の実装用の基板
。 (2) 表面実装用部品の多数の端子を夫々ハンダ
付けする端子のうち最外側の端子の幅を外側に拡
げてこの端子にスルーホールを設けたことを特徴
とする表面実装用部品の実装用の基板。[Claims for Utility Model Registration] (1) A board for mounting surface mount components, characterized in that a through hole is provided in a reinforcing land to which reinforcing fins for surface mount components are soldered. (2) For mounting surface mount components, the width of the outermost terminal among the terminals to which a large number of terminals of the surface mount component are soldered is expanded outward and a through hole is provided in this terminal. board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8298788U JPH028078U (en) | 1988-06-24 | 1988-06-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8298788U JPH028078U (en) | 1988-06-24 | 1988-06-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH028078U true JPH028078U (en) | 1990-01-18 |
Family
ID=31307721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8298788U Pending JPH028078U (en) | 1988-06-24 | 1988-06-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH028078U (en) |
-
1988
- 1988-06-24 JP JP8298788U patent/JPH028078U/ja active Pending
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