JPS61136578U - - Google Patents

Info

Publication number
JPS61136578U
JPS61136578U JP1814585U JP1814585U JPS61136578U JP S61136578 U JPS61136578 U JP S61136578U JP 1814585 U JP1814585 U JP 1814585U JP 1814585 U JP1814585 U JP 1814585U JP S61136578 U JPS61136578 U JP S61136578U
Authority
JP
Japan
Prior art keywords
board
lands
soldering
holes
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1814585U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1814585U priority Critical patent/JPS61136578U/ja
Publication of JPS61136578U publication Critical patent/JPS61136578U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図及び第2図は本考案の一実施例を示し、
第1図は斜視図、第2図は第1図中―線に沿
う断面図、第3図は本考案の他の実施例を示す分
解斜視図、第4図は孔の変形例を示す要部の拡大
平面図である。 図中、1は基板、2は導電パターン、3はラン
ド、5は導線、7は孔、8は絶縁部材である。
1 and 2 show an embodiment of the present invention,
Fig. 1 is a perspective view, Fig. 2 is a sectional view taken along the line - in Fig. 1, Fig. 3 is an exploded perspective view showing another embodiment of the present invention, and Fig. 4 is a schematic diagram showing a modified example of the hole. FIG. In the figure, 1 is a substrate, 2 is a conductive pattern, 3 is a land, 5 is a conducting wire, 7 is a hole, and 8 is an insulating member.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板上に半田付けにより導線が接続される複数
のランドを設けたものにおいて、前記基板に前記
ランド間に位置して孔を形成したことを特徴とす
るプリント基板。
1. A printed circuit board having a plurality of lands on the board to which conductive wires are connected by soldering, wherein holes are formed in the board between the lands.
JP1814585U 1985-02-12 1985-02-12 Pending JPS61136578U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1814585U JPS61136578U (en) 1985-02-12 1985-02-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1814585U JPS61136578U (en) 1985-02-12 1985-02-12

Publications (1)

Publication Number Publication Date
JPS61136578U true JPS61136578U (en) 1986-08-25

Family

ID=30506501

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1814585U Pending JPS61136578U (en) 1985-02-12 1985-02-12

Country Status (1)

Country Link
JP (1) JPS61136578U (en)

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