JPH0463172U - - Google Patents
Info
- Publication number
- JPH0463172U JPH0463172U JP10467690U JP10467690U JPH0463172U JP H0463172 U JPH0463172 U JP H0463172U JP 10467690 U JP10467690 U JP 10467690U JP 10467690 U JP10467690 U JP 10467690U JP H0463172 U JPH0463172 U JP H0463172U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- conductor circuit
- connecting conductor
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 7
- 239000012787 coverlay film Substances 0.000 claims description 3
- 239000010408 film Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 1
- 238000005452 bending Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図は、本考案のフレキシブル印刷配線基板
と印刷配線基板との接続構造を示す断面図、第２
図は従来の接続構造を示す断面図である。
主な図番の説明、８……印刷配線基板、９，１
２……導体回路、１０……フレキシブル印刷配線
基板、１０ａ……折曲部、１１……ベースフイル
ム、１２ａ……接続用導体回路部、１３……カバ
ーレイフイルム、１４……半田。
FIG. 1 is a sectional view showing the connection structure between the flexible printed wiring board of the present invention and the printed wiring board, and FIG.
The figure is a sectional view showing a conventional connection structure. Explanation of main drawing numbers, 8...Printed wiring board, 9, 1
2...Conductor circuit, 10 ...Flexible printed wiring board, 10a...Bending portion, 11...Base film, 12a...Connecting conductor circuit portion, 13...Coverlay film, 14...Solder.
Claims (1)
設けられているとともに該導体回路上にカバーレ
イフイルムが形成されているフレキシブル印刷配
線基板において、該フレキシブル印刷配線基板の
端部に他の印刷配線基板に設けられている導体回
路と半田付にて接続される接続用導体回路部を設
けるとともに前記カバーレイフイルムを前記接続
用導体回路部が表出するように、且つ前記印刷配
線基板の導体回路と半田付される部分より離間し
た位置まで形成し、表出された接続用導体回路部
を折曲せしめて別々に設けられている回路間を連
結したことを特徴とするフレキシブル印刷配線基
板。 In a flexible printed wiring board in which a conductive circuit is provided on a flexible base film and a coverlay film is formed on the conductive circuit, an end portion of the flexible printed wiring board is provided with another printed wiring board. A connecting conductor circuit portion is provided to be connected by soldering to a conductor circuit provided on the printed wiring board, and the cover lay film is arranged so that the connecting conductor circuit portion is exposed and connected to the conductor circuit of the printed wiring board. A flexible printed wiring board characterized in that the circuits are formed to a position apart from the part to be soldered, and the exposed connecting conductor circuit parts are bent to connect the separately provided circuits.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990104676U JP2576096Y2 (en) | 1990-10-03 | 1990-10-03 | Flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990104676U JP2576096Y2 (en) | 1990-10-03 | 1990-10-03 | Flexible printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0463172U true JPH0463172U (en) | 1992-05-29 |
| JP2576096Y2 JP2576096Y2 (en) | 1998-07-09 |
Family
ID=31850055
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990104676U Expired - Lifetime JP2576096Y2 (en) | 1990-10-03 | 1990-10-03 | Flexible printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2576096Y2 (en) |
-
1990
- 1990-10-03 JP JP1990104676U patent/JP2576096Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2576096Y2 (en) | 1998-07-09 |