JPS6127337U - Header for semiconductor devices - Google Patents

Header for semiconductor devices

Info

Publication number
JPS6127337U
JPS6127337U JP11119184U JP11119184U JPS6127337U JP S6127337 U JPS6127337 U JP S6127337U JP 11119184 U JP11119184 U JP 11119184U JP 11119184 U JP11119184 U JP 11119184U JP S6127337 U JPS6127337 U JP S6127337U
Authority
JP
Japan
Prior art keywords
header
semiconductor device
semiconductor devices
groove
mounting area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11119184U
Other languages
Japanese (ja)
Inventor
美樹 工原
Original Assignee
住友電気工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 住友電気工業株式会社 filed Critical 住友電気工業株式会社
Priority to JP11119184U priority Critical patent/JPS6127337U/en
Publication of JPS6127337U publication Critical patent/JPS6127337U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/27—Manufacturing methods
    • H01L2224/27011—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature
    • H01L2224/27013—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature for holding or confining the layer connector, e.g. solder flow barrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/83009—Pre-treatment of the layer connector or the bonding area
    • H01L2224/83051—Forming additional members, e.g. dam structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の半導体用のきツダーの一実施例を示す
概略平面図であり、第２図は第１図の半導体装置用へツ
タの側面図であり、第３図は第１図及び第２図に図示す
る半導体装置用へツタに半導体チップをボンディングし
た状態を拡大して示す部分断面図であり、第４図ａ，
ｂ及びＣは半導体装置用ヘッダの平坦面に形成すべき溝
の種々の横断面形状を示す図であり、第５図は本考案の
半導体装置用ヘッダの別の実施例を示す概略平面図であ
り、第６図は本考案の半導体装置用ヘッダの更に別の実
施例を示す概略平面図であり、第７図は本考案の半導体
装置用ヘッダの更に別の実施例を示す概略平面図であり
、第８図及び第９図は従来の半導体装置用ヘッダを用い
て発光ダイオードを構成した場合と、本考案の半導体装
置用ヘッダを用いて発光ダイオードを構成した場合との
製品合格率についての具体例を示すグラフである。 （主な参照番号）、１・・・半導体装置用ヘッダ、２・
・・中央本体部、３・・・フランジ、６・・・取付け領
域、７，１１．１２，１３乃び１４・・・溝、８・・・
半導体チップ。FIG. 1 is a schematic plan view showing one embodiment of the screw for semiconductor devices of the present invention, FIG. 2 is a side view of the screw for semiconductor devices shown in FIG. 1, and FIG. 3 is a side view of the screw for semiconductor devices of FIG. 4 is an enlarged partial cross-sectional view showing a state in which a semiconductor chip is bonded to the socket for a semiconductor device shown in FIG. 2, and FIG.
b and C are views showing various cross-sectional shapes of grooves to be formed in the flat surface of a header for a semiconductor device, and FIG. 5 is a schematic plan view showing another embodiment of the header for a semiconductor device of the present invention. 6 is a schematic plan view showing still another embodiment of the header for a semiconductor device of the present invention, and FIG. 7 is a schematic plan view showing still another embodiment of the header for a semiconductor device of the present invention. Figures 8 and 9 show the product pass rates for the case where a light emitting diode is constructed using a conventional header for a semiconductor device and the case where a light emitting diode is constructed using a header for a semiconductor device of the present invention. It is a graph showing a specific example. (Main reference number), 1... Header for semiconductor device, 2...
...Central body part, 3...Flange, 6...Mounting area, 7, 11.12, 13 and 14...Groove, 8...
semiconductor chip.

Claims (3)

【実用新案登録請求の範囲】[Scope of utility model registration request] （１）半導体チップが半田でもってボンディングされる
ようになった半導体ヘッダにおいて、ボンデイングすべ
き半導体チップによって占められる取付け領域の周囲に
、溝が設けられていることを特徴とする半導体装置用ヘ
ッダ。(1) A header for a semiconductor device in which a semiconductor chip is bonded with solder, characterized in that a groove is provided around a mounting area occupied by the semiconductor chip to be bonded. （２）前記溝か前記取付け領域の周囲に不連続に設けら
れることを特徴とする前記第１項に記載の半導体装置用
ヘッダ。(2) The header for a semiconductor device according to item 1, wherein the groove is provided discontinuously around the mounting area. （３）前記溝が前記取付け領域の全周囲に亘って設けら
れることを特徴とする前記第１項に記載の半導体装置用
ヘッダ。(3) The header for a semiconductor device according to item 1, wherein the groove is provided all around the mounting area.
JP11119184U 1984-07-24 1984-07-24 Header for semiconductor devices Pending JPS6127337U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11119184U JPS6127337U (en) 1984-07-24 1984-07-24 Header for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11119184U JPS6127337U (en) 1984-07-24 1984-07-24 Header for semiconductor devices

Publications (1)

Publication Number Publication Date
JPS6127337U true JPS6127337U (en) 1986-02-18

Family

ID=30670296

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11119184U Pending JPS6127337U (en) 1984-07-24 1984-07-24 Header for semiconductor devices

Country Status (1)

Country Link
JP (1) JPS6127337U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0743126U (en) * 1993-12-29 1995-08-18 岡三機工株式会社 Truck for cement

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0743126U (en) * 1993-12-29 1995-08-18 岡三機工株式会社 Truck for cement

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