JPS58196886U - Electronic component package structure - Google Patents

Electronic component package structure

Info

Publication number
JPS58196886U
JPS58196886U JP9602582U JP9602582U JPS58196886U JP S58196886 U JPS58196886 U JP S58196886U JP 9602582 U JP9602582 U JP 9602582U JP 9602582 U JP9602582 U JP 9602582U JP S58196886 U JPS58196886 U JP S58196886U
Authority
JP
Japan
Prior art keywords
electronic component
package structure
component package
peripheral edge
bottom plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9602582U
Other languages
Japanese (ja)
Inventor
正行 片岡
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to JP9602582U priority Critical patent/JPS58196886U/en
Publication of JPS58196886U publication Critical patent/JPS58196886U/en
Pending legal-status Critical Current

Links

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来の電子部品のパッケージ構造を示す主要部
分断面図、第２図は本考案の一実施例による電子部品の
パッケージ構造を示す主要部分断面図である。 １．１′・・・・・・放熱板（底板）、４・・・・・・
フレーム、６・・・・・・エポキシ樹脂（接着剤）、７
・・曲面取り部。FIG. 1 is a cross-sectional view of a main part of a conventional package structure for an electronic component, and FIG. 2 is a cross-sectional view of a main part of a package structure of an electronic component according to an embodiment of the present invention. 1.1'... Heat sink (bottom plate), 4...
Frame, 6... Epoxy resin (adhesive), 7
...Curved chamfered part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] その下端周縁部に接着面が形成されたエポキシ系樹脂の
フレームと、電子部品をその上に搭載しその周縁部が上
記フレームの接着面にエポキシ樹脂を用いて接着され該
周縁部の下面に面取りが施された放熱板を兼ねる金属性
の底板とを備えたことを特徴とする電子部品のパッケー
ジ構造。A frame made of epoxy resin has an adhesive surface formed on its lower peripheral edge, and an electronic component is mounted on it, and its peripheral edge is adhered to the adhesive surface of the frame using epoxy resin, and the lower surface of the peripheral edge is chamfered. A package structure for electronic components characterized by comprising a metal bottom plate that also serves as a heat sink and is coated with a metal bottom plate.
JP9602582U 1982-06-25 1982-06-25 Electronic component package structure Pending JPS58196886U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9602582U JPS58196886U (en) 1982-06-25 1982-06-25 Electronic component package structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9602582U JPS58196886U (en) 1982-06-25 1982-06-25 Electronic component package structure

Publications (1)

Publication Number Publication Date
JPS58196886U true JPS58196886U (en) 1983-12-27

Family

ID=30229037

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9602582U Pending JPS58196886U (en) 1982-06-25 1982-06-25 Electronic component package structure

Country Status (1)

Country Link
JP (1) JPS58196886U (en)

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