JPS60109349U - Packaging structure of enamel substrate - Google Patents
Packaging structure of enamel substrateInfo
- Publication number
- JPS60109349U JPS60109349U JP20466183U JP20466183U JPS60109349U JP S60109349 U JPS60109349 U JP S60109349U JP 20466183 U JP20466183 U JP 20466183U JP 20466183 U JP20466183 U JP 20466183U JP S60109349 U JPS60109349 U JP S60109349U
- Authority
- JP
- Japan
- Prior art keywords
- packaging structure
- enamel substrate
- substrate
- electrical components
- protective cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のパッケージング構造の一例を示す断面図
、第２図は本考案の一実施例の構成を示す断面図、第３
図はリードピン１６の取付構造を示す断面図、第４図は
上記実施例の変形例の構成を示す断面図である。
１・・・アルミナ基板（基板）、２・・・電気部品、４
′・・・補強板、１１・・・はうろう基板、１８
．２１・・・保 −護カバー、１９，２２・・・
厚膜導体。FIG. 1 is a cross-sectional view showing an example of a conventional packaging structure, FIG. 2 is a cross-sectional view showing the structure of an embodiment of the present invention, and FIG.
The figure is a sectional view showing the mounting structure of the lead pin 16, and FIG. 4 is a sectional view showing the structure of a modification of the above embodiment. 1... Alumina substrate (substrate), 2... Electrical components, 4
'...Reinforcement plate, 11...Crawling board, 18
．． 21...protective cover, 19, 22...
Thick film conductor.
Claims (1)
板に前記電気部品を覆う保護カバーを取付けたパッケー
ジング構造において、電気部品の実装されたほうろう基
板の周縁部に厚膜導体を形成し、前記保護カバーを前記
厚膜導体に半田づけしたことを特徴とするほうろう基板
のパッケージング構造。In a packaging structure in which a reinforcing plate is fixed to a substrate on which electrical components are mounted, and a protective cover covering the electrical components is attached to the reinforcing plate, a thick film conductor is formed on the peripheral edge of the enamel substrate on which the electrical components are mounted. A packaging structure for an enamel substrate, characterized in that the protective cover is soldered to the thick film conductor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20466183U JPS60109349U (en) | 1983-12-26 | 1983-12-26 | Packaging structure of enamel substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20466183U JPS60109349U (en) | 1983-12-26 | 1983-12-26 | Packaging structure of enamel substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60109349U true JPS60109349U (en) | 1985-07-25 |
Family
ID=30767051
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20466183U Pending JPS60109349U (en) | 1983-12-26 | 1983-12-26 | Packaging structure of enamel substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60109349U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6268299U (en) * | 1985-10-17 | 1987-04-28 |
-
1983
- 1983-12-26 JP JP20466183U patent/JPS60109349U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6268299U (en) * | 1985-10-17 | 1987-04-28 |
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