JPH044761U - - Google Patents
Info
- Publication number
- JPH044761U JPH044761U JP4477390U JP4477390U JPH044761U JP H044761 U JPH044761 U JP H044761U JP 4477390 U JP4477390 U JP 4477390U JP 4477390 U JP4477390 U JP 4477390U JP H044761 U JPH044761 U JP H044761U
- Authority
- JP
- Japan
- Prior art keywords
- board
- hybrid
- chip carrier
- leadless chip
- soldered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000005011 phenolic resin Substances 0.000 claims description 2
- 229920002050 silicone resin Polymers 0.000 claims 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
第1図は本考案による実施例の断面図、第2図
は従来装置の断面図である。
1……LCC(リードレスチツプキヤリア)、
2……基板、3……半田、4……ケース、5……
ゴム状シリコン、6……フエノール樹脂。
FIG. 1 is a sectional view of an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional device. 1...LCC (leadless chip carrier),
2... Board, 3... Solder, 4... Case, 5...
Rubbery silicone, 6...phenolic resin.
Claims (1)
する基板をシリコン樹脂によりケース内に封止し
て収容するハイブリツドIC装置において、上記
基板と上記リードレスチツプキヤリアの接合面周
辺部をフエノール樹脂により覆うようにしたこと
を特徴とするハイブリツドIC装置。 In a hybrid IC device in which a board on which a leadless chip carrier is soldered and mounted is sealed and housed in a case with silicone resin, the periphery of the bonding surface between the board and the leadless chip carrier is covered with phenol resin. A hybrid IC device characterized by:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4477390U JPH044761U (en) | 1990-04-26 | 1990-04-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4477390U JPH044761U (en) | 1990-04-26 | 1990-04-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH044761U true JPH044761U (en) | 1992-01-16 |
Family
ID=31558370
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4477390U Pending JPH044761U (en) | 1990-04-26 | 1990-04-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH044761U (en) |
-
1990
- 1990-04-26 JP JP4477390U patent/JPH044761U/ja active Pending
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