JPS5811255U - Finn device - Google Patents
Finn deviceInfo
- Publication number
- JPS5811255U JPS5811255U JP10389281U JP10389281U JPS5811255U JP S5811255 U JPS5811255 U JP S5811255U JP 10389281 U JP10389281 U JP 10389281U JP 10389281 U JP10389281 U JP 10389281U JP S5811255 U JPS5811255 U JP S5811255U
- Authority
- JP
- Japan
- Prior art keywords
- boss
- cooling fluid
- finn
- fin device
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は平型半導体素子冷却の為に従来用いられている
フィン装置を示す外形図、第２図は第１図のボス部とプ
レート部の接合部の状態を示す部分断面図、第３図は本
考案の一実施例を示すフィン装置の外形図、第４図は本
考案の他の実施例を示す外形図である。
１・・・ボス部、２・・・プレート部、５・・・ボス部
内の冷却流体通過路。Fig. 1 is an external view showing a fin device conventionally used for cooling flat semiconductor devices, Fig. 2 is a partial sectional view showing the state of the joint between the boss portion and the plate portion in Fig. 1, and Fig. 3 The figure is an external view of a fin device showing one embodiment of the present invention, and FIG. 4 is an external view showing another embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Boss part, 2... Plate part, 5... Cooling fluid passageway in boss part.
Claims (1)
熱をすみやかに拡散するボス部と、このボス部より派生
した熱を冷却流体へ伝達するプレート部よりなるものに
おいて、ボス部内に放熱効果を有する冷却流体の通過路
を形成したことを特徴とするフィン装置。 −（２）ボス部及びプレート部は押し出し加工により一
体的に形成されたことを特徴とする実用新案登録請求の
範囲第１項記載のフィン装置。(1) Heat dissipation within the boss is made up of a boss that contacts the object to be cooled and quickly diffuses the heat flowing in from the object, and a plate that transfers the heat derived from the boss to the cooling fluid. A fin device characterized by forming a cooling fluid passageway having an effect. (2) The fin device according to claim 1, wherein the boss portion and the plate portion are integrally formed by extrusion processing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10389281U JPS5811255U (en) | 1981-07-15 | 1981-07-15 | Finn device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10389281U JPS5811255U (en) | 1981-07-15 | 1981-07-15 | Finn device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5811255U true JPS5811255U (en) | 1983-01-25 |
Family
ID=29898496
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10389281U Pending JPS5811255U (en) | 1981-07-15 | 1981-07-15 | Finn device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5811255U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6027779U (en) * | 1983-08-02 | 1985-02-25 | 呉羽センイ株式会社 | Anti-slip sheet for carpet |
-
1981
- 1981-07-15 JP JP10389281U patent/JPS5811255U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6027779U (en) * | 1983-08-02 | 1985-02-25 | 呉羽センイ株式会社 | Anti-slip sheet for carpet |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5811255U (en) | Finn device | |
| JPS58158496U (en) | Heatsink with protruding pin | |
| JPS6113946U (en) | Cooling device for semiconductor devices | |
| JPS60102847U (en) | Temperature fuse mounting device | |
| JPS602841U (en) | semiconductor mounting board | |
| JPS5920639U (en) | Heatsink for semiconductor devices | |
| JPS58116236U (en) | hybrid integrated circuit | |
| JPS59145046U (en) | Heat dissipation device for semiconductor devices | |
| JPS5811256U (en) | Finn device | |
| JPS59132648U (en) | Heat dissipation device for semiconductor devices | |
| JPS58189593U (en) | circuit element assembly | |
| JPS59121892U (en) | heat dissipation device | |
| JPS59182939U (en) | Semiconductor package cage with radiator | |
| JPS5895655U (en) | semiconductor equipment | |
| JPS60129150U (en) | Semiconductor device cooling equipment | |
| JPS599550U (en) | Heat pipe mounting plate | |
| JPS59121847U (en) | semiconductor equipment | |
| JPS6066035U (en) | semiconductor equipment | |
| JPS5885351U (en) | Cooling body for semiconductor rectifier | |
| JPS58153452U (en) | Heat pipe type semiconductor heat sink | |
| JPS60144245U (en) | semiconductor equipment | |
| JPS5926258U (en) | Heat dissipation device for semiconductor devices | |
| JPS5978632U (en) | semiconductor equipment | |
| JPS6049639U (en) | Cooling fins for semiconductor devices | |
| JPS59158337U (en) | Cooling device for power semiconductors |