JPS58153452U - Heat pipe type semiconductor heat sink - Google Patents
Heat pipe type semiconductor heat sinkInfo
- Publication number
- JPS58153452U JPS58153452U JP5054682U JP5054682U JPS58153452U JP S58153452 U JPS58153452 U JP S58153452U JP 5054682 U JP5054682 U JP 5054682U JP 5054682 U JP5054682 U JP 5054682U JP S58153452 U JPS58153452 U JP S58153452U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- type semiconductor
- heat pipe
- pipe type
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図及び第２図は夫々従来の放熱器の例を示す説明図
、第３図はこの考案による放熱器の一例を示す説明図、
第４図は実施例の放熱特性を示すグラフである。
１：ヒートパイプ、２：加熱部、３：半導体、４ニブロ
ツク、５：放熱部、６：放熱フィン。1 and 2 are explanatory diagrams showing examples of conventional heat radiators, respectively, and FIG. 3 is an explanatory diagram showing an example of a radiator according to this invention,
FIG. 4 is a graph showing the heat dissipation characteristics of the example. 1: heat pipe, 2: heating section, 3: semiconductor, 4 niblock, 5: heat dissipation section, 6: heat dissipation fin.
Claims (1)
端に、半導体取付用ブロックを取付けて成る半導体放熱
器において、前記ブロックと放熱フィンの間のヒートパ
イプをは５゛直角に折曲ケ、□前記ブロックを水平に、
放熱フィンを垂直上方向に位置させて成ることを特徴と
するヒートパイプ式半導体放熱器。In a semiconductor heat radiator comprising a heat pipe with a plurality of heat radiation fins attached to one end and a semiconductor mounting block attached to the other end, the heat pipe between the block and the radiation fins is bent at a right angle of 5°; □Place the block horizontally,
A heat pipe type semiconductor heat sink characterized by having heat dissipation fins positioned vertically upward.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5054682U JPS58153452U (en) | 1982-04-07 | 1982-04-07 | Heat pipe type semiconductor heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5054682U JPS58153452U (en) | 1982-04-07 | 1982-04-07 | Heat pipe type semiconductor heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58153452U true JPS58153452U (en) | 1983-10-14 |
Family
ID=30061338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5054682U Pending JPS58153452U (en) | 1982-04-07 | 1982-04-07 | Heat pipe type semiconductor heat sink |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58153452U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009168354A (en) * | 2008-01-17 | 2009-07-30 | Kiko Kagi Kofun Yugenkoshi | Thermal conduit molding method and its structure |
-
1982
- 1982-04-07 JP JP5054682U patent/JPS58153452U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009168354A (en) * | 2008-01-17 | 2009-07-30 | Kiko Kagi Kofun Yugenkoshi | Thermal conduit molding method and its structure |
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