JPS5811256U - Finn device - Google Patents
Finn deviceInfo
- Publication number
- JPS5811256U JPS5811256U JP10389481U JP10389481U JPS5811256U JP S5811256 U JPS5811256 U JP S5811256U JP 10389481 U JP10389481 U JP 10389481U JP 10389481 U JP10389481 U JP 10389481U JP S5811256 U JPS5811256 U JP S5811256U
- Authority
- JP
- Japan
- Prior art keywords
- finn
- cooled
- plate
- boss part
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は平型半導体と、その冷却のために用いられる空
冷フィンを示す全体構成図、第２図は従来の空冷フィン
単体を示す外形図、第３図は、本考案によるフィン装置
を示す外形図、第４図は第３図のフィン装置の使用状態
を示す断面図である。
１・・・フィンボス突出部、１ａ・・・座グリ部、２・
・・フィンプレート、３・・・半導体突出部、４・・・
電極、５・・・半導体本体、６・・・ボス。Fig. 1 is an overall configuration diagram showing a flat semiconductor and air cooling fins used for cooling it, Fig. 2 is an outline drawing showing a conventional air cooling fin alone, and Fig. 3 is a fin device according to the present invention. The outline drawing and FIG. 4 are cross-sectional views showing the state in which the fin device of FIG. 3 is used. 1... Fin boss protruding part, 1a... Spot facing part, 2...
...Fin plate, 3...Semiconductor protrusion, 4...
Electrode, 5... semiconductor body, 6... boss.
Claims (1)
かに拡散するボス部と、このボス部に接合され流入した
熱を冷却流体へ伝達するプレート部よりなるものにおい
て、ボス部の被冷却体接触面をサグリにより形成すると
ともに、プレート端面より内部に設けたことを特徴とす
るフィン装置。A boss part that comes into contact with an object to be cooled and quickly diffuses the heat flowing in from the object to be cooled, and a plate part that is joined to this boss part and transmits the inflowing heat to the cooling fluid. A fin device characterized in that the body contacting surface is formed by a recess and is provided inside from the end surface of the plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10389481U JPS5811256U (en) | 1981-07-15 | 1981-07-15 | Finn device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10389481U JPS5811256U (en) | 1981-07-15 | 1981-07-15 | Finn device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5811256U true JPS5811256U (en) | 1983-01-25 |
Family
ID=29898498
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10389481U Pending JPS5811256U (en) | 1981-07-15 | 1981-07-15 | Finn device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5811256U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0458185U (en) * | 1990-09-25 | 1992-05-19 |
-
1981
- 1981-07-15 JP JP10389481U patent/JPS5811256U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0458185U (en) * | 1990-09-25 | 1992-05-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5811256U (en) | Finn device | |
| JPS58109293U (en) | Double housing heat dissipation structure | |
| JPS5822746U (en) | semiconductor equipment | |
| JPS5842581U (en) | Heat exchanger | |
| JPS5811255U (en) | Finn device | |
| JPS6079740U (en) | Contact pins for integrated circuit devices | |
| JPS5965558U (en) | GTO unit | |
| JPS5885351U (en) | Cooling body for semiconductor rectifier | |
| JPS60102847U (en) | Temperature fuse mounting device | |
| JPS599550U (en) | Heat pipe mounting plate | |
| JPS60156669U (en) | Vehicle battery heating device | |
| JPS6068657U (en) | Cooling structure for semiconductor integrated circuit devices | |
| JPS5887357U (en) | Cooler | |
| JPS59195746U (en) | Semiconductor device circuit assembly | |
| JPS58179469U (en) | Cooler | |
| JPS6088035U (en) | Wastegate valve heat dissipation device | |
| JPS5856450U (en) | Cooling body for semiconductor rectifier | |
| JPS594645U (en) | Forced cooling device | |
| JPS6081657U (en) | Heat sink for semiconductor devices | |
| JPS5918256U (en) | ice making device | |
| JPS6059364U (en) | thermal battery | |
| JPS5832288U (en) | Heat exchanger with cast-in fins | |
| JPS5955296U (en) | Heat exchanger | |
| JPS59186688U (en) | Heat exchanger | |
| JPS585183U (en) | Combined heat sensor |