JPS6134742U - integrated circuit - Google Patents
integrated circuitInfo
- Publication number
- JPS6134742U JPS6134742U JP11742984U JP11742984U JPS6134742U JP S6134742 U JPS6134742 U JP S6134742U JP 11742984 U JP11742984 U JP 11742984U JP 11742984 U JP11742984 U JP 11742984U JP S6134742 U JPS6134742 U JP S6134742U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- package
- circuit board
- printed circuit
- convex heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図はプリント基板に実装された従来のＩＣの冷却方
法の一実施例を示す図、第２図はこの考案によるＩＣを
プリント基板に実装し冷却している状態を示す図。
１はＩＣ， ２はＩＣチップ、３はリード線、４はパ
ッケージ、５は放熱板、６はプリント基板、７は放熱体
、８は通風孔である。
尚、図中同一、あるいは相当部分には同一符号を付して
示してある。FIG. 1 is a diagram showing an example of a conventional method for cooling an IC mounted on a printed circuit board, and FIG. 2 is a diagram showing a state in which an IC according to the invention is mounted on a printed circuit board and cooled. 1 is an IC, 2 is an IC chip, 3 is a lead wire, 4 is a package, 5 is a heat sink, 6 is a printed circuit board, 7 is a heat sink, and 8 is a ventilation hole. In the figures, the same or corresponding parts are designated by the same reference numerals.
Claims (2)
、パッケージの内部に集積回路チップを有する集積回路
において、上記パッケージのプリント基板面と接する面
と対向する面に上記パッケージと一体に断面が凸状の複
数個の放熱体を設けたことを特徴とする集積回路。(1) In an integrated circuit having lead wires for mounting on a printed circuit board on the outer surface and an integrated circuit chip inside the package, a cross section integrally formed with the package on the surface opposite to the surface in contact with the printed circuit board surface of the package. An integrated circuit characterized by having a plurality of convex heat sinks.
ップとの間に通風孔を設けたことを特徴とする実用新案
登録請求の範囲第（１）項記載の集積回路。 第１図(2) The integrated circuit according to claim 1, which is a registered utility model, characterized in that a ventilation hole is provided between the convex heat sink of the package and the integrated circuit chip. Figure 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11742984U JPS6134742U (en) | 1984-07-31 | 1984-07-31 | integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11742984U JPS6134742U (en) | 1984-07-31 | 1984-07-31 | integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6134742U true JPS6134742U (en) | 1986-03-03 |
Family
ID=30676338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11742984U Pending JPS6134742U (en) | 1984-07-31 | 1984-07-31 | integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6134742U (en) |
-
1984
- 1984-07-31 JP JP11742984U patent/JPS6134742U/en active Pending
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