JPS6133465U - insulated metal substrate - Google Patents
insulated metal substrateInfo
- Publication number
- JPS6133465U JPS6133465U JP11819684U JP11819684U JPS6133465U JP S6133465 U JPS6133465 U JP S6133465U JP 11819684 U JP11819684 U JP 11819684U JP 11819684 U JP11819684 U JP 11819684U JP S6133465 U JPS6133465 U JP S6133465U
- Authority
- JP
- Japan
- Prior art keywords
- metal substrate
- insulated metal
- insulated
- metal
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【図面の簡単な説明】
第1図は、金属箔を用いた実施例の断面図、第2図、第
3図は金属板を用いた実施例の断面図である。
1:金属箔、2:熱伝導性充てん剤含有電着絶縁層、3
:金属板。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a sectional view of an embodiment using metal foil, and FIGS. 2 and 3 are sectional views of an embodiment using a metal plate. 1: Metal foil, 2: Electrodeposited insulating layer containing thermally conductive filler, 3
: Metal plate.
Claims (1)
金属板に設けてなる絶縁金属基板。An insulated metal substrate comprising a metal foil or metal plate provided with an electrodeposited insulating layer containing a thermally conductive filler.
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11819684U JPS6133465U (en) | 1984-07-30 | 1984-07-30 | insulated metal substrate |
US06/759,209 US4767674A (en) | 1984-01-27 | 1985-07-26 | Metal cored board and method for manufacturing same |
US06/759,210 US4695515A (en) | 1984-07-30 | 1985-07-26 | Metal cored board and method for manufacturing same |
CA000487695A CA1232971A (en) | 1984-07-30 | 1985-07-29 | Metal cored board and method for manufacturing same |
CA000487703A CA1240072A (en) | 1984-07-30 | 1985-07-29 | Metal cored circuit board with baked-on polymer layer |
CA000487694A CA1225462A (en) | 1984-07-30 | 1985-07-29 | Aluminium cored board and method for manufacturing same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11819684U JPS6133465U (en) | 1984-07-30 | 1984-07-30 | insulated metal substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6133465U true JPS6133465U (en) | 1986-02-28 |
Family
ID=30677084
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11819684U Pending JPS6133465U (en) | 1984-01-27 | 1984-07-30 | insulated metal substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6133465U (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5815375B2 (en) * | 1975-04-28 | 1983-03-25 | カブシキガイシヤ サト−ケンキユウシヨ | mobile phone label insatsuharitsukeki |
JPS58222593A (en) * | 1982-02-24 | 1983-12-24 | 日立化成工業株式会社 | Method of producing substrate for metal core-filled printed circuit board |
-
1984
- 1984-07-30 JP JP11819684U patent/JPS6133465U/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5815375B2 (en) * | 1975-04-28 | 1983-03-25 | カブシキガイシヤ サト−ケンキユウシヨ | mobile phone label insatsuharitsukeki |
JPS58222593A (en) * | 1982-02-24 | 1983-12-24 | 日立化成工業株式会社 | Method of producing substrate for metal core-filled printed circuit board |
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