JPS60133691U - Substrate for electronic components - Google Patents

Substrate for electronic components

Info

Publication number
JPS60133691U
JPS60133691U JP2117084U JP2117084U JPS60133691U JP S60133691 U JPS60133691 U JP S60133691U JP 2117084 U JP2117084 U JP 2117084U JP 2117084 U JP2117084 U JP 2117084U JP S60133691 U JPS60133691 U JP S60133691U
Authority
JP
Japan
Prior art keywords
substrate
electronic components
metal plate
utility
open end
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2117084U
Other languages
Japanese (ja)
Inventor
秀明 白井
博 石橋
石井 昭弘
伊藤 弘孝
葛下 弘和
吉岡 道彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Cable Industries Ltd
Original Assignee
Mitsubishi Cable Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Cable Industries Ltd filed Critical Mitsubishi Cable Industries Ltd
Priority to JP2117084U priority Critical patent/JPS60133691U/en
Publication of JPS60133691U publication Critical patent/JPS60133691U/en
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第、1〜2図は本考案の好適な態様の基板を糸?占嶌工
。′°”1゛°°”68
Figures 1 and 2 show a substrate of a preferred embodiment of the present invention. Urashimako. ′°”1゛°°”68

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 導電層、絶縁層及び金属板を積層してなる電子−部品用
基板において、該金属板に端面開口した中空の通路を形
成−したことを特徴とする電子部品用基板。     
    11、−
1. A substrate for electronic components comprising a conductive layer, an insulating layer, and a metal plate laminated, characterized in that a hollow passageway with an open end is formed in the metal plate.
11,-
JP2117084U 1984-02-15 1984-02-15 Substrate for electronic components Pending JPS60133691U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2117084U JPS60133691U (en) 1984-02-15 1984-02-15 Substrate for electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2117084U JPS60133691U (en) 1984-02-15 1984-02-15 Substrate for electronic components

Publications (1)

Publication Number Publication Date
JPS60133691U true JPS60133691U (en) 1985-09-06

Family

ID=30512320

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2117084U Pending JPS60133691U (en) 1984-02-15 1984-02-15 Substrate for electronic components

Country Status (1)

Country Link
JP (1) JPS60133691U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016046430A (en) * 2014-08-25 2016-04-04 京セラ株式会社 Circuit board and electronic device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016046430A (en) * 2014-08-25 2016-04-04 京セラ株式会社 Circuit board and electronic device

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