JPS6061754U - Surface structure of printed circuit board - Google Patents

Surface structure of printed circuit board

Info

Publication number
JPS6061754U
JPS6061754U JP15365083U JP15365083U JPS6061754U JP S6061754 U JPS6061754 U JP S6061754U JP 15365083 U JP15365083 U JP 15365083U JP 15365083 U JP15365083 U JP 15365083U JP S6061754 U JPS6061754 U JP S6061754U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
surface structure
copper foils
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15365083U
Other languages
Japanese (ja)
Inventor
幸生 森岡
Original Assignee
松下電器産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電器産業株式会社 filed Critical 松下電器産業株式会社
Priority to JP15365083U priority Critical patent/JPS6061754U/en
Publication of JPS6061754U publication Critical patent/JPS6061754U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図：従来のプリント基板の平面図、第２Ｎ：本考案
のプリント基板の平面図、第３図：第２図ＸＹ線の断面
図で、イ９口、ハはいづれも実施例である。 １・・・プリント基板、２・・・銅箔（１次回路）３・
・・隔壁、４・・・貫通孔、５・・・凹溝。Figure 1: A plan view of a conventional printed circuit board, 2N: A plan view of a printed circuit board of the present invention, Figure 3: A cross-sectional view taken along the XY line in Figure 2, where A9 and C are both examples. . 1... Printed circuit board, 2... Copper foil (primary circuit) 3.
...Partition wall, 4...Through hole, 5...Concave groove.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] １次回路を形成する銅箔をその表面に有するプリント基
板において、前記銅箔と銅箔との間に突出した絶縁材料
よりなる隔壁を設けて前記銅箔間の絶縁間隔を立体的に
保持することを特徴とするプリント基板の表面構造。In a printed circuit board having copper foil on its surface forming a primary circuit, a partition wall made of an insulating material that protrudes between the copper foils is provided to maintain the insulation spacing between the copper foils in a three-dimensional manner. A surface structure of a printed circuit board characterized by:
JP15365083U 1983-10-03 1983-10-03 Surface structure of printed circuit board Pending JPS6061754U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15365083U JPS6061754U (en) 1983-10-03 1983-10-03 Surface structure of printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15365083U JPS6061754U (en) 1983-10-03 1983-10-03 Surface structure of printed circuit board

Publications (1)

Publication Number Publication Date
JPS6061754U true JPS6061754U (en) 1985-04-30

Family

ID=30339879

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15365083U Pending JPS6061754U (en) 1983-10-03 1983-10-03 Surface structure of printed circuit board

Country Status (1)

Country Link
JP (1) JPS6061754U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999039555A1 (en) * 1998-01-29 1999-08-05 Smk Corporation Circuit board
JP2012253201A (en) * 2011-06-03 2012-12-20 Denso Corp Electronic apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999039555A1 (en) * 1998-01-29 1999-08-05 Smk Corporation Circuit board
JP2012253201A (en) * 2011-06-03 2012-12-20 Denso Corp Electronic apparatus

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