JPS60113693U - printed circuit board structure - Google Patents

printed circuit board structure

Info

Publication number
JPS60113693U
JPS60113693U JP100684U JP100684U JPS60113693U JP S60113693 U JPS60113693 U JP S60113693U JP 100684 U JP100684 U JP 100684U JP 100684 U JP100684 U JP 100684U JP S60113693 U JPS60113693 U JP S60113693U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
board structure
heating element
metal plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP100684U
Other languages
Japanese (ja)
Inventor
有田 篤雄
Original Assignee
沖電気工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 沖電気工業株式会社 filed Critical 沖電気工業株式会社
Priority to JP100684U priority Critical patent/JPS60113693U/en
Publication of JPS60113693U publication Critical patent/JPS60113693U/en
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来の印刷回路板の放熱方式を示す平面図、第
2図は同側面図、第3図は金属コア印刷回路板を用いた
放熱方式を説明するための図、第4図は本考案の一実施
を示す印刷回路板の上面図、第5図は同正面図である。 21−・・金属板、22a、22b・・・発熱素子、2
3・・・可撓性のある印刷回路板、24・・・接栓部、
25・・・押え板、26・・・ネジ、27・・・ナツト
、28・・・導体パターン。
Fig. 1 is a plan view showing a conventional heat dissipation method for a printed circuit board, Fig. 2 is a side view of the same, Fig. 3 is a diagram for explaining a heat dissipation method using a metal core printed circuit board, and Fig. 4 is a diagram for explaining a heat dissipation method using a metal core printed circuit board. FIG. 5 is a top view of a printed circuit board showing one implementation of the present invention, and FIG. 5 is a front view of the same. 21-...Metal plate, 22a, 22b...Heating element, 2
3... Flexible printed circuit board, 24... Connection part,
25... Pressing plate, 26... Screw, 27... Nut, 28... Conductor pattern.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 放熱を必要とする発熱素子を搭載する印刷回路板構造に
おいて、発熱素子を搭載して電気的に結合した、可撓性
を有する印刷回路板と、辺部に絶縁性被膜を介して導体
パターンを形成した接栓部を有する金属板とから成り、
該金属板に前記発熱素子を接触固定し、前記導体パター
ンと前記印刷回路板とを電気的に接続したことを特徴と
する印刷回路板構造。  −
In a printed circuit board structure that mounts a heating element that requires heat dissipation, a flexible printed circuit board that carries the heating element and is electrically connected to it, and a conductive pattern on the side through an insulating coating. consisting of a metal plate with a formed plug,
A printed circuit board structure characterized in that the heating element is fixed in contact with the metal plate, and the conductor pattern and the printed circuit board are electrically connected. −
JP100684U 1984-01-10 1984-01-10 printed circuit board structure Pending JPS60113693U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP100684U JPS60113693U (en) 1984-01-10 1984-01-10 printed circuit board structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP100684U JPS60113693U (en) 1984-01-10 1984-01-10 printed circuit board structure

Publications (1)

Publication Number Publication Date
JPS60113693U true JPS60113693U (en) 1985-08-01

Family

ID=30473361

Family Applications (1)

Application Number Title Priority Date Filing Date
JP100684U Pending JPS60113693U (en) 1984-01-10 1984-01-10 printed circuit board structure

Country Status (1)

Country Link
JP (1) JPS60113693U (en)

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