JPS61106066U - - Google Patents

Info

Publication number
JPS61106066U
JPS61106066U JP19078984U JP19078984U JPS61106066U JP S61106066 U JPS61106066 U JP S61106066U JP 19078984 U JP19078984 U JP 19078984U JP 19078984 U JP19078984 U JP 19078984U JP S61106066 U JPS61106066 U JP S61106066U
Authority
JP
Japan
Prior art keywords
printed wiring
wiring board
metal
heat
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19078984U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19078984U priority Critical patent/JPS61106066U/ja
Publication of JPS61106066U publication Critical patent/JPS61106066U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図〜第4図は本考案実施例であつて、第1
図は要部分解斜視図、第2図は同斜視図、第3図
、第4図は他の実施例の斜視図である。 符号の説明、14,26,36…プリント配線
板、12…ラウンド、16,18,28,30,
38…導体、32…スルーホール導体、10,2
4,35…金属ベースプリント配線板。
Figures 1 to 4 show embodiments of the present invention.
The figure is an exploded perspective view of a main part, FIG. 2 is a perspective view of the same, and FIGS. 3 and 4 are perspective views of other embodiments. Explanation of symbols, 14, 26, 36...Printed wiring board, 12...Round, 16, 18, 28, 30,
38...Conductor, 32...Through hole conductor, 10,2
4, 35...Metal-based printed wiring board.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 有機高分子、セラミツクス等の耐熱性絶縁基材
よりなり、且つ放熱性が良好でないプリント配線
板を、金属ベースプリント配線板上の一定の区画
面をして重ね合わせ、相互の配線導体を電気的に
関連づけて実装するも、上記実装されたプリント
配線板の配線導体は、少なくとも重ね合わせた面
とは反対側に位置せる面上に設けておくことで、
上記区画面上の配線導体では上記金属ベースへの
熱逃げを防止したことを特徴とする金属ベースプ
リント配線板。
Printed wiring boards made of heat-resistant insulating substrates such as organic polymers and ceramics, which do not have good heat dissipation, are stacked on top of a metal-based printed wiring board in a certain area, and the wiring conductors of each other are electrically connected. However, by providing the wiring conductor of the printed wiring board mounted above at least on the surface opposite to the overlapping surface,
A metal-based printed wiring board, characterized in that the wiring conductor on the partition screen prevents heat from escaping to the metal base.
JP19078984U 1984-12-18 1984-12-18 Pending JPS61106066U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19078984U JPS61106066U (en) 1984-12-18 1984-12-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19078984U JPS61106066U (en) 1984-12-18 1984-12-18

Publications (1)

Publication Number Publication Date
JPS61106066U true JPS61106066U (en) 1986-07-05

Family

ID=30748240

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19078984U Pending JPS61106066U (en) 1984-12-18 1984-12-18

Country Status (1)

Country Link
JP (1) JPS61106066U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008218833A (en) * 2007-03-06 2008-09-18 Citizen Electronics Co Ltd External connection terminal of metal core substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008218833A (en) * 2007-03-06 2008-09-18 Citizen Electronics Co Ltd External connection terminal of metal core substrate

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