JPS6398676U - - Google Patents
Info
- Publication number
- JPS6398676U JPS6398676U JP19362486U JP19362486U JPS6398676U JP S6398676 U JPS6398676 U JP S6398676U JP 19362486 U JP19362486 U JP 19362486U JP 19362486 U JP19362486 U JP 19362486U JP S6398676 U JPS6398676 U JP S6398676U
- Authority
- JP
- Japan
- Prior art keywords
- metal layer
- insulating layer
- electrically insulating
- solderable metal
- aluminum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Description
第１図はアルミＰＣＢにおけるワイヤボンデイ
ングによる接続を示す従来例の断面図である。第
２図は本考案プリント配線板の構成を示す断面図
である。第３図、第４図は、本考案プリント配線
板の使用例を示す断面図である。
１……アルミニウム板又はアルミニウム合金基
板、２……ハンダ付け可能な金属層、３……電気
絶縁層、４……電気導体、５……はんだ、６……
部品、７……アルミパツド、８……アルミニウム
線、９……基板露出部、９′……アース接続部分
金属層露出部。
FIG. 1 is a cross-sectional view of a conventional example showing connection by wire bonding on an aluminum PCB. FIG. 2 is a sectional view showing the structure of the printed wiring board of the present invention. FIGS. 3 and 4 are cross-sectional views showing examples of use of the printed wiring board of the present invention. DESCRIPTION OF SYMBOLS 1... Aluminum plate or aluminum alloy substrate, 2... Solderable metal layer, 3... Electrical insulating layer, 4... Electric conductor, 5... Solder, 6...
Parts, 7...Aluminum pad, 8...Aluminum wire, 9...Exposed part of board, 9'...Exposed part of metal layer of ground connection part.
Claims (1)
たアルミニウム板又はアルミニウム合金板の前記
ハンダ付け可能な金属層上に、少くともアース接
続部分が露出するように電気絶縁層を設け、該電
気絶縁層上に電気導体を配したことを特徴とする
プリント配線板。 An electrically insulating layer is provided on the solderable metal layer of an aluminum plate or an aluminum alloy plate having a solderable metal layer on at least one side so that at least a ground connection portion is exposed, and the electrically insulating layer A printed wiring board characterized by having an electrical conductor placed on top.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19362486U JPS6398676U (en) | 1986-12-16 | 1986-12-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19362486U JPS6398676U (en) | 1986-12-16 | 1986-12-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6398676U true JPS6398676U (en) | 1988-06-25 |
Family
ID=31149817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19362486U Pending JPS6398676U (en) | 1986-12-16 | 1986-12-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6398676U (en) |
-
1986
- 1986-12-16 JP JP19362486U patent/JPS6398676U/ja active Pending
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