JPS6389255U - - Google Patents
Info
- Publication number
- JPS6389255U JPS6389255U JP18281786U JP18281786U JPS6389255U JP S6389255 U JPS6389255 U JP S6389255U JP 18281786 U JP18281786 U JP 18281786U JP 18281786 U JP18281786 U JP 18281786U JP S6389255 U JPS6389255 U JP S6389255U
- Authority
- JP
- Japan
- Prior art keywords
- frequency transistor
- spacer
- conductive film
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 125000006850 spacer group Chemical group 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 4
- 239000012212 insulator Substances 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例の断面図、第２図は
スペーサの斜視図、第３図は従来構造の断面図で
ある。
１……高周波トランジスタ、２……ベース、３
……素子、４……ケース、５……信号ピン、６…
…金属線、７……スペーサ、８……絶縁体、９…
…導体膜、１０……貫通孔、１１……プリント回
路基板、１２……接地用導体膜、１３……半田、
１４……貫通孔、１５……信号線路、１６，１７
……半田。
FIG. 1 is a sectional view of an embodiment of the present invention, FIG. 2 is a perspective view of a spacer, and FIG. 3 is a sectional view of a conventional structure. 1...High frequency transistor, 2...Base, 3
...Element, 4...Case, 5...Signal pin, 6...
...Metal wire, 7...Spacer, 8...Insulator, 9...
...Conductor film, 10...Through hole, 11...Printed circuit board, 12...Grounding conductor film, 13...Solder,
14...Through hole, 15...Signal line, 16, 17
……solder.
Claims (1)
ト回路基板に高周波トランジスタを搭載し、かつ
少なくともこの高周波トランジスタのケースを前
記接地用導体膜に半田付けする搭載構造において
、前記高周波トランジスタとプリント回路基板と
の間に、所要面部位に導体膜を形成した絶縁体か
らなるスペーサを介装し、このスペーサの導体膜
を介して前記高周波トランジスタのケースとプリ
ント回路基板の接地用導体膜とを電気接続したこ
とを特徴とする高周波トランジスタの搭載構造。 (2) スペーサはアルミナ・セラミツクを絶縁体
とし、その表面、側面及び裏面に亘つて連続する
所要パターンの導体膜を形成してなる実用新案登
録請求の範囲第１項記載の高周波トランジスタの
搭載構造。[Scope of Claim for Utility Model Registration] (1) A mounting structure in which a high-frequency transistor is mounted on a printed circuit board on which a signal line and a grounding conductor film are formed, and at least the case of this high-frequency transistor is soldered to the grounding conductor film. A spacer made of an insulator with a conductive film formed on a required surface portion is interposed between the high frequency transistor and the printed circuit board, and the case of the high frequency transistor and the printed circuit board are connected through the conductive film of the spacer. A mounting structure for a high-frequency transistor, characterized in that it is electrically connected to a grounding conductive film. (2) The high-frequency transistor mounting structure according to claim 1, wherein the spacer is made of alumina ceramic as an insulator, and a conductive film of a required pattern is formed continuously over the front, side, and back surfaces of the spacer. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18281786U JPS6389255U (en) | 1986-11-29 | 1986-11-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18281786U JPS6389255U (en) | 1986-11-29 | 1986-11-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6389255U true JPS6389255U (en) | 1988-06-10 |
Family
ID=31128969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18281786U Pending JPS6389255U (en) | 1986-11-29 | 1986-11-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6389255U (en) |
-
1986
- 1986-11-29 JP JP18281786U patent/JPS6389255U/ja active Pending
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