JPH0392086U - - Google Patents
Info
- Publication number
- JPH0392086U JPH0392086U JP15323289U JP15323289U JPH0392086U JP H0392086 U JPH0392086 U JP H0392086U JP 15323289 U JP15323289 U JP 15323289U JP 15323289 U JP15323289 U JP 15323289U JP H0392086 U JPH0392086 U JP H0392086U
- Authority
- JP
- Japan
- Prior art keywords
- board
- solder
- chassis
- printed circuit
- connecting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図は、本考案の１実施例に係わる基板接続
装置の概略の構成を示す斜視図、第２図は、本考
案に係わる基板接続装置の詳細な構造を示す部分
的斜視図、第３図ａおよび第３図ｂは、それぞれ
、シヤーシの基板固定部に設けられる溝の形状例
を示す部分的断面図、そして第４図および第５図
は、それぞれ従来の基板接続装置を示す部分的斜
視図である。
２７……プリント回路基板、２９……取り付け
ネジ、３１……シヤーシ、３３……基板固定部、
３５……半田被覆部、３７……溝、３９……取り
付け孔、４１……ネジ孔。
FIG. 1 is a perspective view showing a schematic configuration of a board connecting device according to an embodiment of the present invention, FIG. 2 is a partial perspective view showing a detailed structure of the board connecting device according to the present invention, and FIG. Figures a and 3b are partial cross-sectional views showing examples of the shape of grooves provided in the board fixing part of the chassis, and Figures 4 and 5 are partial cross-sectional views showing conventional board connecting devices, respectively. FIG. 27... Printed circuit board, 29... Mounting screw, 31... Chassis, 33... Board fixing part,
35...Solder coating portion, 37...Groove, 39...Mounting hole, 41...Screw hole.
Claims (1)
ンをシヤーシに接続するための基板接続装置であ
つて、 前記シヤーシの基板固定部の少なくとも前記基
板の半田被覆部に対向する部分に形成された複数
の溝、および 前記プリント回路基板を前記基板固定部に押圧
固定する手段、 を具備し、それにより前記基板の半田被覆部と前
記基板固定部とを電気的に強固に接続可能とした
ことを特徴とする基板接続装置。[Claims for Utility Model Registration] A board connecting device for connecting a solder-covered conductive pattern of a printed circuit board to a chassis, comprising at least a portion of the board fixing portion of the chassis that faces the solder-covered portion of the board. a plurality of grooves formed in the substrate, and a means for pressing and fixing the printed circuit board to the board fixing part, thereby making it possible to electrically firmly connect the solder coating part of the board and the board fixing part. A board connecting device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989153232U JPH0644141Y2 (en) | 1989-12-29 | 1989-12-29 | Board connection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989153232U JPH0644141Y2 (en) | 1989-12-29 | 1989-12-29 | Board connection device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0392086U true JPH0392086U (en) | 1991-09-19 |
| JPH0644141Y2 JPH0644141Y2 (en) | 1994-11-14 |
Family
ID=31699453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989153232U Expired - Lifetime JPH0644141Y2 (en) | 1989-12-29 | 1989-12-29 | Board connection device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0644141Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4713813U (en) * | 1971-03-17 | 1972-10-18 | ||
| JPS4827709U (en) * | 1971-08-07 | 1973-04-04 |
-
1989
- 1989-12-29 JP JP1989153232U patent/JPH0644141Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4713813U (en) * | 1971-03-17 | 1972-10-18 | ||
| JPS4827709U (en) * | 1971-08-07 | 1973-04-04 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0644141Y2 (en) | 1994-11-14 |