JPS6429872U - - Google Patents
Info
- Publication number
- JPS6429872U JPS6429872U JP12526787U JP12526787U JPS6429872U JP S6429872 U JPS6429872 U JP S6429872U JP 12526787 U JP12526787 U JP 12526787U JP 12526787 U JP12526787 U JP 12526787U JP S6429872 U JPS6429872 U JP S6429872U
- Authority
- JP
- Japan
- Prior art keywords
- metal substrate
- insulating metal
- chip
- electrode pad
- longitudinal direction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の実施例を示す平面図である。
１は絶縁性金属基板、２は導電路、３は電子部
品、４は電極パツドパターン。
FIG. 1 is a plan view showing an embodiment of the present invention. 1 is an insulating metal substrate, 2 is a conductive path, 3 is an electronic component, and 4 is an electrode pad pattern.
Claims (1)
基板上に絶縁樹脂層を介して形成された導電路と
、前記導電路上に固着実装された複数の半導体チ
ツプ及び複数のチツプ状の電子部品とから成る混
成集積回路において、前記チツプ状の電子部品が
固着される電極パツドパターンを前記絶縁性金属
基板の長手方向と平行に設けたことを特徴とする
混成集積回路。 an insulating metal substrate in a longitudinal direction, a conductive path formed on the insulating metal substrate via an insulating resin layer, a plurality of semiconductor chips and a plurality of chip-shaped electronic components firmly mounted on the conductive path; 1. A hybrid integrated circuit comprising: an electrode pad pattern to which the chip-shaped electronic component is fixed; and an electrode pad pattern provided parallel to the longitudinal direction of the insulating metal substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12526787U JPS6429872U (en) | 1987-08-18 | 1987-08-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12526787U JPS6429872U (en) | 1987-08-18 | 1987-08-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6429872U true JPS6429872U (en) | 1989-02-22 |
Family
ID=31375721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12526787U Pending JPS6429872U (en) | 1987-08-18 | 1987-08-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6429872U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6281797A (en) * | 1985-10-07 | 1987-04-15 | 日立東部セミコンダクタ株式会社 | Electronic device |
-
1987
- 1987-08-18 JP JP12526787U patent/JPS6429872U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6281797A (en) * | 1985-10-07 | 1987-04-15 | 日立東部セミコンダクタ株式会社 | Electronic device |
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