JPS61199043U - - Google Patents
Info
- Publication number
- JPS61199043U JPS61199043U JP8212585U JP8212585U JPS61199043U JP S61199043 U JPS61199043 U JP S61199043U JP 8212585 U JP8212585 U JP 8212585U JP 8212585 U JP8212585 U JP 8212585U JP S61199043 U JPS61199043 U JP S61199043U
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- chip
- layer
- conductive
- conductive paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Description
第１図はこの考案の実施例であるＩＣチツプの
取付構造を示す図である。また第２図はＩＣチツ
プの回路例を示し、第３図はＩｃチツプを実装し
たサーマルヘツドの要部の概略平面図、第４図は
従来のＩＣチツプ取付構造を示す図である。
２……ＩＣチツプ、３……セラミツク基板、４
……（第１の）絶縁層、５……導電層、８……導
電ペースト、９……チツプキヤリア、１０……（
第２の）絶縁層、１１……配線パターン。
FIG. 1 is a diagram showing an IC chip mounting structure according to an embodiment of this invention. 2 shows an example of an IC chip circuit, FIG. 3 is a schematic plan view of the main part of a thermal head mounted with an IC chip, and FIG. 4 is a diagram showing a conventional IC chip mounting structure. 2...IC chip, 3...ceramic substrate, 4
... (first) insulating layer, 5 ... conductive layer, 8 ... conductive paste, 9 ... chip carrier, 10 ... (
2nd) insulating layer, 11...wiring pattern.
Claims (1)
電層がこの順に積層され、前記導電層の上に導電
ペースを付着して、その導電ペーストを介して前
記導電層上に底部に内部回路の共通電極が形成さ
れているＩＣチツプをマウントするようにしたも
のにおいて、 前記絶縁層を、前記ＩＣチツプの底面より広い
第１の絶縁層と、前記第１の絶縁層上に積層され
、且つ前記ＩＣチツプの底面の大きさ以下の第２
の絶縁層とで構成した導電ペーストを用いたＩＣ
チツプの取付構造。[Claims for Utility Model Registration] A patterned insulating layer and a conductive layer are laminated in this order on a substrate, a conductive paste is attached on the conductive layer, and the conductive layer is coated with the conductive paste through the conductive paste. in which an IC chip having a common electrode for an internal circuit formed on the bottom thereof is mounted, the insulating layer being a first insulating layer wider than the bottom surface of the IC chip, and a first insulating layer on the first insulating layer. a second layer which is laminated on the IC chip and whose size is less than or equal to the bottom surface of the IC chip;
An IC using a conductive paste composed of an insulating layer of
Chip mounting structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8212585U JPS61199043U (en) | 1985-05-30 | 1985-05-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8212585U JPS61199043U (en) | 1985-05-30 | 1985-05-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61199043U true JPS61199043U (en) | 1986-12-12 |
Family
ID=30629562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8212585U Pending JPS61199043U (en) | 1985-05-30 | 1985-05-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61199043U (en) |
-
1985
- 1985-05-30 JP JP8212585U patent/JPS61199043U/ja active Pending
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