JPS62149857U - - Google Patents
Info
- Publication number
- JPS62149857U JPS62149857U JP1986038716U JP3871686U JPS62149857U JP S62149857 U JPS62149857 U JP S62149857U JP 1986038716 U JP1986038716 U JP 1986038716U JP 3871686 U JP3871686 U JP 3871686U JP S62149857 U JPS62149857 U JP S62149857U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting part
- led
- led laminated
- constructed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 13
- 230000000295 complement effect Effects 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
第１図は本考案の要部を示す発光部の縦断面構
造図、第２図はＬＥＤ積層チツプの第一の取付例
図、第２ａ図はそれに対応した発光部の電気回路
図、第３図はＬＥＤ積層チツプの第２の取付例図
、第３ａ図はそれに対応した発光部の電気回路図
、第４図はＬＥＤ積層チツプの第三の取付例図、
第４ａ図はその場合における発光部の縦断面構造
図、第４ｂ図はそれに対応する発光部の電気回路
図、第５図、第６図は、互いに相補な関係にある
ＬＥＤ積層チツプを構成するために使用されるＬ
ＥＤチツプの一例の構造説明図、第７図〜第９図
は、いずれも互いに相補な関係にあるＬＥＤ積層
チツプを用いて構成した発光部の例図であり、第
７図は互いに相補な２つのＬＥＤ積層チツプを用
いて発光部を構成した場合の電気回路図、第７ａ
図はその場合における発光部の平面図、第７ｂ図
は発光部の縦断面構造図、第８図は互いに相補な
ＬＥＤ積層チツプを含んだ３つのＬＥＤ積層チツ
プを用いて発光部を構成した場合の電気回路図、
第８ａ図はその場合における発光部の平面図、第
８ｂ図は発光部の縦断面構造図、第９図は互いに
相補なＬＥＤ積層チツプを含んだ４つのＬＥＤ積
層チツプを用いて発光部を構成した場合の電気回
路図、第９ａ図はその場合における発光部の平面
図、第９ｂ図は発光部の縦断面構造図、第１０図
、第１１図は、従来のＬＥＤチツプを用いて構成
した発光部の説明図、第１０ａ図、第１１ａ図は
第１０図、第１１図に対応した発光部の電気回路
図、第１２図は発光表示体の全体斜視図、第１３
図はその電気回路図である。
（符号の説明）、Ａ……本考案のドツトマトリ
クス発光表示体、Ｂ……その発光部、Ｃ……その
内周壁面に形成された光反射面、１……表示体基
板、２０……導電部、２１……Ｘ電極パターン（
Ｘｎ）、２２……Ｙ電極パターン（Ｙｎ）、３…
…スルーホール、４，４＊……ＬＥＤ積層チツプ
、５……銀ペースト、６……ボンデイングワイヤ
、７……マスク板、８……透孔、９……発光部の
封止層。
Fig. 1 is a vertical cross-sectional structural diagram of a light emitting part showing the main parts of the present invention, Fig. 2 is a first example of mounting an LED laminated chip, Fig. 2a is a corresponding electric circuit diagram of the light emitting part, and Fig. 3 The figure shows a second example of how to install an LED multilayer chip, FIG.
Fig. 4a is a vertical cross-sectional structural diagram of the light emitting part in that case, Fig. 4b is a corresponding electric circuit diagram of the light emitting part, and Figs. 5 and 6 constitute an LED laminated chip in a mutually complementary relationship. L used for
The structural explanatory diagrams of an example of an ED chip, FIGS. 7 to 9, are examples of a light emitting section constructed using LED laminated chips that are complementary to each other, and FIG. Electrical circuit diagram when the light emitting part is constructed using two LED laminated chips, No. 7a
The figure is a plan view of the light emitting part in that case, Figure 7b is a vertical cross-sectional structural diagram of the light emitting part, and Figure 8 is a case in which the light emitting part is constructed using three LED laminated chips including mutually complementary LED laminated chips. electrical circuit diagram,
Figure 8a is a plan view of the light emitting part in that case, Figure 8b is a vertical cross-sectional structural diagram of the light emitting part, and Figure 9 shows the light emitting part constructed using four LED laminated chips including mutually complementary LED laminated chips. Fig. 9a is a plan view of the light emitting part in that case, Fig. 9b is a longitudinal cross-sectional structural diagram of the light emitting part, and Figs. 10 and 11 are the electrical circuit diagrams constructed using conventional LED chips. 10a and 11a are electrical circuit diagrams of the light emitting unit corresponding to FIGS. 10 and 11, and FIG.
The figure is its electrical circuit diagram. (Explanation of symbols), A...Dot matrix light emitting display of the present invention, B...Light emitting portion thereof, C...Light reflecting surface formed on the inner circumferential wall surface, 1...Display body substrate, 20... Conductive part, 21...X electrode pattern (
Xn), 22...Y electrode pattern (Yn), 3...
... Through hole, 4, 4* ... LED laminated chip, 5 ... Silver paste, 6 ... Bonding wire, 7 ... Mask plate, 8 ... Through hole, 9 ... Sealing layer of light emitting part.
Claims (1)
の発光部に２以上のＬＥＤチツプを同一極性方向
に積層構成するとともに、発光部の内周壁面を光
反射面に形成していることを特徴とする発光表示
体。 A light emitting display using LED chips, characterized in that two or more LED chips are laminated in the same polar direction in a light emitting part, and the inner peripheral wall surface of the light emitting part is formed as a light reflecting surface. Display body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986038716U JPH0416465Y2 (en) | 1986-03-17 | 1986-03-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986038716U JPH0416465Y2 (en) | 1986-03-17 | 1986-03-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62149857U true JPS62149857U (en) | 1987-09-22 |
| JPH0416465Y2 JPH0416465Y2 (en) | 1992-04-13 |
Family
ID=30851217
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986038716U Expired JPH0416465Y2 (en) | 1986-03-17 | 1986-03-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0416465Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000332297A (en) * | 1999-05-17 | 2000-11-30 | Koha Co Ltd | Full color led module |
| JP2003197972A (en) * | 2001-09-27 | 2003-07-11 | Kokuren Koden Kagi Kofun Yugenkoshi | High-luminance light emitting diode |
-
1986
- 1986-03-17 JP JP1986038716U patent/JPH0416465Y2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000332297A (en) * | 1999-05-17 | 2000-11-30 | Koha Co Ltd | Full color led module |
| JP2003197972A (en) * | 2001-09-27 | 2003-07-11 | Kokuren Koden Kagi Kofun Yugenkoshi | High-luminance light emitting diode |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0416465Y2 (en) | 1992-04-13 |