JPS5850947U - thermal recording head - Google Patents
thermal recording headInfo
- Publication number
- JPS5850947U JPS5850947U JP14679081U JP14679081U JPS5850947U JP S5850947 U JPS5850947 U JP S5850947U JP 14679081 U JP14679081 U JP 14679081U JP 14679081 U JP14679081 U JP 14679081U JP S5850947 U JPS5850947 U JP S5850947U
- Authority
- JP
- Japan
- Prior art keywords
- recording head
- thermal recording
- diode
- substrate
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electronic Switches (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図ａ、 ｂは熱記録ヘッドに形成するダイオード
回路やマトリックス回路の回路構成（アノード・コモン
・タイプとアイソレーションΦタイプ）を示す回路図、
第２図ａ、 ｂは第１図ａ、 ｂに対応した従来の熱記
録ヘッド（ダイオードの構造）を示す断面図、第３図ａ
、 ｂ−はこの考案の一実施例に係る熱記録ヘッドを示
す断面図である。
６・・・基板、７．８・・・リード配線、９・・・ダイ
オード、１０・・・導電接着剤、１１． １５・・・ワ
イヤー、１２・・・力／ｓ、？ −１１３・・・リード
配線、１４・・・接着剤、１６・・・凹部。Figures 1a and 1b are circuit diagrams showing the circuit configurations (anode common type and isolation Φ type) of the diode circuit and matrix circuit formed in the thermal recording head.
Figures 2a and b are cross-sectional views showing a conventional thermal recording head (diode structure) corresponding to Figures 1a and b, and Figure 3a is a
, b- is a sectional view showing a thermal recording head according to an embodiment of this invention. 6... Substrate, 7.8... Lead wiring, 9... Diode, 10... Conductive adhesive, 11. 15...wire, 12...force/s, ? -113... Lead wiring, 14... Adhesive, 16... Recessed portion.
Claims (1)
直接又は一方のリード配線を芥してダイオードを接着し
、該ダイオードの電極を他方のリード配線又は両方のリ
ード配線にワイヤ・−等を介して接続してなる熱記録ヘ
ッドにおいて、前記基板のうち前記ダイオードに対応す
る位置に凹部を設け、該凹部にダイオードを配設したこ
とを特徴とする前記−ヘッド。 ′（２）前記
凹部にダイオードをその表面が基板表面一致又は略一致
するように配設したことを特徴とする実用新案登録請求
の範囲第１項記載の熱記録ヘッド。(1) Form two types of lead wiring on the substrate, and bond a diode directly to the substrate or by discarding one lead wiring, and wire the electrode of the diode to the other lead wiring or both lead wirings. 1. A thermal recording head connected to a thermal recording head via a wire or the like, characterized in that a recess is provided in a position of the substrate corresponding to the diode, and a diode is disposed in the recess. (2) The thermal recording head according to claim 1, which is a registered utility model, characterized in that a diode is disposed in the recess so that its surface coincides with or substantially coincides with the surface of the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14679081U JPS5850947U (en) | 1981-10-02 | 1981-10-02 | thermal recording head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14679081U JPS5850947U (en) | 1981-10-02 | 1981-10-02 | thermal recording head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5850947U true JPS5850947U (en) | 1983-04-06 |
Family
ID=29939674
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14679081U Pending JPS5850947U (en) | 1981-10-02 | 1981-10-02 | thermal recording head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5850947U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS602381A (en) * | 1983-06-20 | 1985-01-08 | Toshiba Corp | Thermal head and thermal transfer device |
-
1981
- 1981-10-02 JP JP14679081U patent/JPS5850947U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS602381A (en) * | 1983-06-20 | 1985-01-08 | Toshiba Corp | Thermal head and thermal transfer device |
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