JPH0272536U - - Google Patents

Info

Publication number
JPH0272536U
JPH0272536U JP1988150745U JP15074588U JPH0272536U JP H0272536 U JPH0272536 U JP H0272536U JP 1988150745 U JP1988150745 U JP 1988150745U JP 15074588 U JP15074588 U JP 15074588U JP H0272536 U JPH0272536 U JP H0272536U
Authority
JP
Japan
Prior art keywords
circuit electrode
metal plate
wiring board
printed wiring
electrode portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988150745U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988150745U priority Critical patent/JPH0272536U/ja
Publication of JPH0272536U publication Critical patent/JPH0272536U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4807Shape of bonding interfaces, e.g. interlocking features
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/4845Details of ball bonds
    • H01L2224/48451Shape
    • H01L2224/48453Shape of the interface with the bonding area

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案による金属板の回路電極部の斜
視図、第2図は上記の回路電極部にめつき処理を
施した模式的断面図、第3図は上記の回路電極部
にボンデイング装置のキヤピラリーが降下する模
様を模式的に示す図、第4図は上記のボンデイン
グ後の拡散層形成の模様を示す模式図、第5図は
ワイヤボンデイング法による半導体チツプの実装
部分の断面概念図、第6図は従来例の回路電極部
とボンデイングワイヤとの拡散接合面を示す模式
図、第7図は従来例の回路電極部上のめつき層の
曲面化を示す断面図である。 1:金属板、1a:回路電極部、1b:脚部、
1c:切割部、2:絶縁基板、3:半導体チツプ
、4:ボンデイングワイヤ。
Figure 1 is a perspective view of the circuit electrode part of the metal plate according to the present invention, Figure 2 is a schematic cross-sectional view of the circuit electrode part subjected to plating treatment, and Figure 3 is a bonding device attached to the circuit electrode part. FIG. 4 is a schematic diagram showing the pattern of diffusion layer formation after bonding, FIG. 5 is a cross-sectional conceptual diagram of the part where the semiconductor chip is mounted by wire bonding, FIG. 6 is a schematic diagram showing a diffusion bonding surface between a circuit electrode part and a bonding wire in a conventional example, and FIG. 7 is a sectional view showing a curved surface of a plating layer on a circuit electrode part in a conventional example. 1: metal plate, 1a: circuit electrode part, 1b: leg part,
1c: Cut portion, 2: Insulating substrate, 3: Semiconductor chip, 4: Bonding wire.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁基板と、回路を形成する導電性金属板とか
らなり、該金属板の回路電極部に半導体チツプと
を直接ワイヤボンドすることにより実装するプリ
ント配線板において、上記回路電極部が長さ方向
に平行した2本の脚部が形成されるように切割部
が設けられてなることを特徴とするプリント配線
板。
In a printed wiring board consisting of an insulating substrate and a conductive metal plate that forms a circuit, and in which a semiconductor chip is mounted by direct wire bonding to the circuit electrode portion of the metal plate, the circuit electrode portion is A printed wiring board characterized in that a cut portion is provided to form two parallel leg portions.
JP1988150745U 1988-11-21 1988-11-21 Pending JPH0272536U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988150745U JPH0272536U (en) 1988-11-21 1988-11-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988150745U JPH0272536U (en) 1988-11-21 1988-11-21

Publications (1)

Publication Number Publication Date
JPH0272536U true JPH0272536U (en) 1990-06-01

Family

ID=31424160

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988150745U Pending JPH0272536U (en) 1988-11-21 1988-11-21

Country Status (1)

Country Link
JP (1) JPH0272536U (en)

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