JPH01162273U - - Google Patents
Info
- Publication number
- JPH01162273U JPH01162273U JP5463488U JP5463488U JPH01162273U JP H01162273 U JPH01162273 U JP H01162273U JP 5463488 U JP5463488 U JP 5463488U JP 5463488 U JP5463488 U JP 5463488U JP H01162273 U JPH01162273 U JP H01162273U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- recess
- mounted component
- sectional
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
図―１は本考案に係るプリント回路基板の一実
施例を示す断面図、図―２は図―１の―線に
おける断面図、図―３は本考案の他の実施例を示
す断面図、図―４は従来のプリント回路基板を示
す断面図である。
１：プリント回路基板、２：絶縁基板、３：パ
ツド部、４：チツプ部品、５：電極部、６：半田
付け部、７：くぼみ、８：フラツトパツケージ型
部品、９：電極部。
Figure 1 is a sectional view showing an embodiment of the printed circuit board according to the present invention, Figure 2 is a sectional view taken along line - in Figure 1, and Figure 3 is a sectional view showing another embodiment of the invention. Figure 4 is a cross-sectional view of a conventional printed circuit board. 1: Printed circuit board, 2: Insulating board, 3: Pad part, 4: Chip part, 5: Electrode part, 6: Soldering part, 7: Recess, 8: Flat package type part, 9: Electrode part.
Claims (1)
において、表面実装型部品の電極部が半田付けさ
れるパツド部の間の、表面実装型部品の下に相当
する位置に、くぼみを形成したことを特徴とする
プリント回路基板。 In a printed circuit board on which surface-mounted components are mounted, a recess is formed at a position corresponding to the bottom of the surface-mounted component between the pads to which the electrodes of the surface-mounted component are soldered. printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5463488U JPH01162273U (en) | 1988-04-25 | 1988-04-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5463488U JPH01162273U (en) | 1988-04-25 | 1988-04-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01162273U true JPH01162273U (en) | 1989-11-10 |
Family
ID=31280556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5463488U Pending JPH01162273U (en) | 1988-04-25 | 1988-04-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01162273U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013214612A (en) * | 2012-04-02 | 2013-10-17 | Denso Corp | Wiring device |
-
1988
- 1988-04-25 JP JP5463488U patent/JPH01162273U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013214612A (en) * | 2012-04-02 | 2013-10-17 | Denso Corp | Wiring device |