JPS5860995U - Heat sink mounting device - Google Patents
Heat sink mounting deviceInfo
- Publication number
- JPS5860995U JPS5860995U JP15525381U JP15525381U JPS5860995U JP S5860995 U JPS5860995 U JP S5860995U JP 15525381 U JP15525381 U JP 15525381U JP 15525381 U JP15525381 U JP 15525381U JP S5860995 U JPS5860995 U JP S5860995U
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- heat sink
- circuit board
- printed circuit
- legs
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の放熱板取付装置の分解斜視図、第２図、
第３図は従来の他の放熱板取付装置の要部断面図、第４
図、第５図は本考案の一実施例による放熱板取付装置に
おける放熱板の平面図、側面図、第６図はプリント基板
の要部平面図、第７図、第８図は放熱板の取付操作を説
明するための一部断正面図である。
１０・・・・・・放熱板、１１． １２． １３・・・
・・・取付脚、１４・・・・・・プリント基板、１５．
１６． １７・・・・・・取付孔。Figure 1 is an exploded perspective view of a conventional heat sink mounting device;
Figure 3 is a sectional view of the main parts of another conventional heat sink mounting device;
5 is a plan view and a side view of a heat sink in a heat sink mounting device according to an embodiment of the present invention, FIG. 6 is a plan view of the main part of a printed circuit board, and FIGS. FIG. 3 is a partially sectional front view for explaining an attachment operation. 10... Heat sink, 11. 12. 13...
...Mounting leg, 14...Printed circuit board, 15.
16. 17...Mounting hole.
Claims (1)
部のそれぞれ下端縁に前記板部の主平面° と同一
平面で下方に伸びるストレートな取付脚を一体に設け、
プリント基板に前記各取付脚が挿入される取付孔をその
間隔が前記取付脚の間の間隔よりせまくなるように設け
、前記放熱板の各取付脚がプリント基板の取付孔の側壁
に弾性的に当接するように各取付孔に挿入し、プリント
基板の裏面において前記取付脚の先端を銅箔部に半田付
けした放熱板取付装置。A straight mounting leg extending downward in the same plane as the main plane of the plate part is integrally provided at the lower edge of each of the opposing plate parts of the heat sink which is processed into a U-shape and has elasticity,
Mounting holes into which the mounting legs are inserted are provided in the printed circuit board so that the intervals between the mounting holes are narrower than the intervals between the mounting legs, and each mounting leg of the heat sink is elastically attached to the side wall of the mounting hole of the printed circuit board. A heat sink mounting device in which the mounting legs are inserted into each mounting hole so as to be in contact with each other, and the tips of the mounting legs are soldered to the copper foil portion on the back side of the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15525381U JPS5860995U (en) | 1981-10-19 | 1981-10-19 | Heat sink mounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15525381U JPS5860995U (en) | 1981-10-19 | 1981-10-19 | Heat sink mounting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5860995U true JPS5860995U (en) | 1983-04-25 |
Family
ID=29947828
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15525381U Pending JPS5860995U (en) | 1981-10-19 | 1981-10-19 | Heat sink mounting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5860995U (en) |
-
1981
- 1981-10-19 JP JP15525381U patent/JPS5860995U/en active Pending
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